KR102430326B1 - 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 - Google Patents

다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 Download PDF

Info

Publication number
KR102430326B1
KR102430326B1 KR1020200081390A KR20200081390A KR102430326B1 KR 102430326 B1 KR102430326 B1 KR 102430326B1 KR 1020200081390 A KR1020200081390 A KR 1020200081390A KR 20200081390 A KR20200081390 A KR 20200081390A KR 102430326 B1 KR102430326 B1 KR 102430326B1
Authority
KR
South Korea
Prior art keywords
die
dicing tape
collet
movable stage
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020200081390A
Other languages
English (en)
Korean (ko)
Other versions
KR20210032893A (ko
Inventor
히로시 마끼
아끼라 사이또
즈요시 요꼬모리
Original Assignee
파스포드 테크놀로지 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파스포드 테크놀로지 주식회사 filed Critical 파스포드 테크놀로지 주식회사
Publication of KR20210032893A publication Critical patent/KR20210032893A/ko
Application granted granted Critical
Publication of KR102430326B1 publication Critical patent/KR102430326B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
KR1020200081390A 2019-09-17 2020-07-02 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법 Active KR102430326B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-168865 2019-09-17
JP2019168865A JP7377654B2 (ja) 2019-09-17 2019-09-17 ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20210032893A KR20210032893A (ko) 2021-03-25
KR102430326B1 true KR102430326B1 (ko) 2022-08-08

Family

ID=74876585

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200081390A Active KR102430326B1 (ko) 2019-09-17 2020-07-02 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법

Country Status (4)

Country Link
JP (1) JP7377654B2 (enrdf_load_stackoverflow)
KR (1) KR102430326B1 (enrdf_load_stackoverflow)
CN (1) CN112530834B (enrdf_load_stackoverflow)
TW (1) TWI719896B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7658778B2 (ja) * 2021-03-29 2025-04-08 芝浦メカトロニクス株式会社 実装装置
JP2024024567A (ja) * 2022-08-09 2024-02-22 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP2025074826A (ja) 2023-10-30 2025-05-14 リンテック株式会社 移載装置および移載方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243834A (ja) * 2004-02-25 2005-09-08 Nitto Denko Corp コレット及びそれを用いたチップのピックアップ方法
JP2008270417A (ja) * 2007-04-18 2008-11-06 Canon Machinery Inc 半導体装置の製造装置及び製造方法
KR101385443B1 (ko) 2013-09-13 2014-04-16 이향이 반도체 칩 픽업 이송용 콜렛

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526193B1 (ko) * 2003-10-15 2005-11-03 삼성전자주식회사 다이 본더 설비 및 이를 이용한 반도체 칩 부착방법
JP2005322815A (ja) 2004-05-11 2005-11-17 Matsushita Electric Ind Co Ltd 半導体製造装置および半導体装置の製造方法
JP4664150B2 (ja) * 2005-08-05 2011-04-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
JP5054933B2 (ja) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4397429B1 (ja) 2009-03-05 2010-01-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
JP5284144B2 (ja) 2009-03-11 2013-09-11 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
KR101562021B1 (ko) * 2009-08-11 2015-10-20 삼성전자주식회사 반도체 칩 부착 장치 및 반도체 칩 부착 방법
JP5813432B2 (ja) * 2011-09-19 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP6349496B2 (ja) * 2014-02-24 2018-07-04 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
DE102014107729B4 (de) * 2014-06-02 2022-05-12 Infineon Technologies Ag Dreidimensionaler Stapel einer mit Anschlüssen versehenen Packung und eines elektronischen Elements sowie Verfahren zur Herstellung eines solchen Stapels
JP6018670B2 (ja) 2015-06-15 2016-11-02 株式会社東芝 ダイボンディング装置、および、ダイボンディング方法
WO2017129171A1 (de) * 2016-01-29 2017-08-03 Jenoptik Optical Systems Gmbh Verfahren und vorrichtung zum herauslösen eines mikro-chips aus einem wafer und aufbringen des mikro-chips auf ein substrat
JP6621771B2 (ja) * 2017-01-25 2019-12-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6653273B2 (ja) * 2017-01-26 2020-02-26 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6941513B2 (ja) * 2017-09-07 2021-09-29 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243834A (ja) * 2004-02-25 2005-09-08 Nitto Denko Corp コレット及びそれを用いたチップのピックアップ方法
JP2008270417A (ja) * 2007-04-18 2008-11-06 Canon Machinery Inc 半導体装置の製造装置及び製造方法
KR101385443B1 (ko) 2013-09-13 2014-04-16 이향이 반도체 칩 픽업 이송용 콜렛

Also Published As

Publication number Publication date
CN112530834A (zh) 2021-03-19
JP7377654B2 (ja) 2023-11-10
CN112530834B (zh) 2024-03-08
TWI719896B (zh) 2021-02-21
KR20210032893A (ko) 2021-03-25
TW202113992A (zh) 2021-04-01
JP2021048201A (ja) 2021-03-25

Similar Documents

Publication Publication Date Title
KR102296641B1 (ko) 반도체 제조 장치, 밀어올림 지그 및 반도체 장치의 제조 방법
KR102430326B1 (ko) 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법
KR102066874B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
KR102101760B1 (ko) 반도체 제조 장치, 반도체 장치의 제조 방법 및 콜릿
US6863109B2 (en) In-line die attaching and curing apparatus for a multi-chip package
KR101489054B1 (ko) 다이본더 및 픽업 방법 및 픽업 장치
JP6941513B2 (ja) 半導体製造装置および半導体装置の製造方法
KR102003130B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
KR102490394B1 (ko) 다이 본딩 장치, 반도체 장치의 제조 방법, 및 박리 장치
US20220238357A1 (en) Die Bonding Apparatus and Manufacturing Method for Semiconductor Device
JP6200735B2 (ja) ダイボンダ及びボンディング方法
JP2014239090A (ja) ピックアップシステム
WO2022004151A1 (ja) 物品の製造装置、物品の製造方法
US20230290666A1 (en) Semiconductor manufacturing apparatus, carrier jig, and manufacturing method of semiconductor device
KR20230132215A (ko) 다이 본딩 장치

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20200702

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20211207

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20220524

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220803

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220804

End annual number: 3

Start annual number: 1

PG1601 Publication of registration