KR102415755B1 - 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 - Google Patents

열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 Download PDF

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KR102415755B1
KR102415755B1 KR1020177022761A KR20177022761A KR102415755B1 KR 102415755 B1 KR102415755 B1 KR 102415755B1 KR 1020177022761 A KR1020177022761 A KR 1020177022761A KR 20177022761 A KR20177022761 A KR 20177022761A KR 102415755 B1 KR102415755 B1 KR 102415755B1
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epoxy resin
resin
bisphenol
composition
resin composition
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KR1020177022761A
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Korean (ko)
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KR20170106405A (ko
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도모타카 노구치
다카유키 추조
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다이요 잉키 세이조 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020177022761A 2015-01-21 2015-12-10 열경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 KR102415755B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015009670 2015-01-21
JPJP-P-2015-009670 2015-01-21
PCT/JP2015/084727 WO2016117237A1 (ja) 2015-01-21 2015-12-10 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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KR20170106405A KR20170106405A (ko) 2017-09-20
KR102415755B1 true KR102415755B1 (ko) 2022-07-04

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JP (1) JP6268310B2 (zh)
KR (1) KR102415755B1 (zh)
CN (1) CN107207837B (zh)
TW (1) TWI684623B (zh)
WO (1) WO2016117237A1 (zh)

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CN109983052B (zh) * 2016-11-18 2021-07-23 昭和电工材料株式会社 密封用膜及其固化物、以及电子装置
JP7082496B2 (ja) * 2017-02-27 2022-06-08 株式会社Adeka 繊維強化プラスチック用樹脂組成物、その硬化物、及び該硬化物を含有する繊維強化プラスチック
JP7084203B2 (ja) * 2017-06-21 2022-06-14 積水化学工業株式会社 絶縁フィルム用樹脂組成物、絶縁フィルム及び多層プリント配線板
JP7401961B2 (ja) * 2017-11-10 2023-12-20 住友ベークライト株式会社 熱硬化性樹脂組成物、回路基板、及び、回路基板の製造方法
JP7217532B2 (ja) 2017-11-14 2023-02-03 株式会社弘輝 補強用樹脂組成物及び電子部品装置
JP6516115B1 (ja) * 2018-05-16 2019-05-22 山栄化学株式会社 溶解性・非溶解性粒子含有硬化性樹脂組成物
JP7252027B2 (ja) * 2019-03-26 2023-04-04 太陽インキ製造株式会社 穴埋め用硬化性樹脂組成物
CN110642998A (zh) * 2019-08-27 2020-01-03 中山精合电子材料有限公司 一种环氧树脂组合物、固化性干膜、固化物及印刷电路板
JP2021150311A (ja) 2020-03-16 2021-09-27 キオクシア株式会社 半導体装置
JP7371321B2 (ja) * 2020-03-31 2023-10-31 太陽ホールディングス株式会社 硬化性樹脂組成物、硬化物、およびプリント配線板
JPWO2022202220A1 (zh) * 2021-03-26 2022-09-29
WO2023063277A1 (ja) * 2021-10-15 2023-04-20 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体チップ、樹脂組成物層付き半導体チップ搭載用基板、及び半導体装置
TW202328333A (zh) * 2021-10-15 2023-07-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、疊層體、設有樹脂組成物層之半導體晶片、設有樹脂組成物層之半導體晶片搭載用基板、及半導體裝置
CN114369437A (zh) * 2022-02-08 2022-04-19 深圳先进电子材料国际创新研究院 一种耐高温绝缘胶膜、制备方法及其应用

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JP2000030533A (ja) * 1998-05-08 2000-01-28 Matsushita Electric Ind Co Ltd ビアホ―ル充填用導電体ペ―スト組成物並びにそれを用いた両面及び多層プリント基板とその製造方法
JP2004149758A (ja) 2002-09-05 2004-05-27 Sanyo Chem Ind Ltd 硬化性樹脂フィルム
JP2014175459A (ja) * 2013-03-08 2014-09-22 Hitachi Chemical Co Ltd 半導体装置及び半導体装置の製造方法

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JPS62212418A (ja) * 1986-03-13 1987-09-18 Mitsubishi Petrochem Co Ltd 一液性エポキシ樹脂組成物
JPH02281068A (ja) * 1989-04-24 1990-11-16 Somar Corp 層間絶縁に好適な樹脂組成物
JP3290295B2 (ja) 1994-05-13 2002-06-10 太陽インキ製造株式会社 硬化性樹脂組成物並びに該組成物を用いた多層プリント配線板及びその製造方法
JP3290296B2 (ja) 1994-05-13 2002-06-10 太陽インキ製造株式会社 多層プリント配線板及びその製造方法
JP3242009B2 (ja) 1995-10-23 2001-12-25 イビデン株式会社 樹脂充填剤
JP3405914B2 (ja) 1998-02-06 2003-05-12 日本特殊陶業株式会社 スルーホール充填用ペースト
JP4849860B2 (ja) * 2005-10-04 2012-01-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP5150381B2 (ja) 2008-06-20 2013-02-20 太陽ホールディングス株式会社 熱硬化性樹脂組成物
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2000030533A (ja) * 1998-05-08 2000-01-28 Matsushita Electric Ind Co Ltd ビアホ―ル充填用導電体ペ―スト組成物並びにそれを用いた両面及び多層プリント基板とその製造方法
JP2004149758A (ja) 2002-09-05 2004-05-27 Sanyo Chem Ind Ltd 硬化性樹脂フィルム
JP2014175459A (ja) * 2013-03-08 2014-09-22 Hitachi Chemical Co Ltd 半導体装置及び半導体装置の製造方法

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TWI684623B (zh) 2020-02-11
WO2016117237A1 (ja) 2016-07-28
CN107207837A (zh) 2017-09-26
JPWO2016117237A1 (ja) 2017-04-27
JP6268310B2 (ja) 2018-01-24
CN107207837B (zh) 2020-04-07
KR20170106405A (ko) 2017-09-20
TW201631023A (zh) 2016-09-01

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