KR102410234B1 - 정보 처리 장치, 컴퓨터 프로그램, 리소그래피 장치, 리소그래피 시스템 및 물품의 제조 방법 - Google Patents

정보 처리 장치, 컴퓨터 프로그램, 리소그래피 장치, 리소그래피 시스템 및 물품의 제조 방법 Download PDF

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KR102410234B1
KR102410234B1 KR1020180142652A KR20180142652A KR102410234B1 KR 102410234 B1 KR102410234 B1 KR 102410234B1 KR 1020180142652 A KR1020180142652 A KR 1020180142652A KR 20180142652 A KR20180142652 A KR 20180142652A KR 102410234 B1 KR102410234 B1 KR 102410234B1
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substrate
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pattern
original plate
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KR20190062202A (ko
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신이치로 고가
유스케 미우라
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H01L21/67276—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H01L21/0274—
    • H01L21/67253—
    • H01L21/682—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
KR1020180142652A 2017-11-28 2018-11-19 정보 처리 장치, 컴퓨터 프로그램, 리소그래피 장치, 리소그래피 시스템 및 물품의 제조 방법 Active KR102410234B1 (ko)

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JP2017228337A JP7262921B2 (ja) 2017-11-28 2017-11-28 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法
JPJP-P-2017-228337 2017-11-28

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KR20190062202A KR20190062202A (ko) 2019-06-05
KR102410234B1 true KR102410234B1 (ko) 2022-06-20

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Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
IL282101B2 (en) 2018-11-07 2023-02-01 Asml Netherlands Bv Methods for configuring a semiconductor manufacturing process
JP6896036B2 (ja) * 2019-09-30 2021-06-30 キヤノン株式会社 情報処理装置、判定方法、インプリント装置、リソグラフィシステム、物品の製造方法及びプログラム
JP7466403B2 (ja) 2020-08-03 2024-04-12 キヤノン株式会社 制御装置、リソグラフィー装置、制御方法および物品製造方法
JP7649188B2 (ja) * 2021-04-21 2025-03-19 キヤノン株式会社 処理システム、計測装置、基板処理装置及び物品の製造方法
US20230274987A1 (en) * 2022-02-25 2023-08-31 Applied Materials, Inc. Machine learning & integrated metrology for run-to-run optimization of chip-to-wafer alignment accuracy
KR102870303B1 (ko) * 2022-08-16 2025-10-15 주식회사 선익시스템 머신 러닝 기반 이미지 처리 유닛을 구비하는 증착 장치 및 그 얼라인 마크의 촬영 조건 설정 방법

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2014053426A (ja) 2012-09-06 2014-03-20 Toshiba Corp 露光装置、露光方法および半導体装置の製造方法

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Publication number Priority date Publication date Assignee Title
KR100375559B1 (ko) 2001-07-03 2003-03-10 삼성전자주식회사 공정장치의 제어방법
JP2006013178A (ja) 2004-06-28 2006-01-12 Toshiba Corp 露光方法及び露光システム
SG183108A1 (en) * 2010-02-19 2012-09-27 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP5816772B2 (ja) * 2012-05-29 2015-11-18 エーエスエムエル ネザーランズ ビー．ブイ． オーバレイの補正に対するアライメントマークの有用性を決定するための方法、および、リソグラフィ装置とオーバレイ測定システムとの組み合わせ
JP2014229675A (ja) 2013-05-21 2014-12-08 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 重ね合わせ補正システム
JP6356996B2 (ja) 2014-04-01 2018-07-11 キヤノン株式会社 パターン形成方法、露光装置、および物品の製造方法
JP6506521B2 (ja) 2014-09-17 2019-04-24 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
US20160148850A1 (en) 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014053426A (ja) 2012-09-06 2014-03-20 Toshiba Corp 露光装置、露光方法および半導体装置の製造方法

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KR20190062202A (ko) 2019-06-05
JP2019102495A (ja) 2019-06-24

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