JP7262921B2 - 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 - Google Patents

情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 Download PDF

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Publication number
JP7262921B2
JP7262921B2 JP2017228337A JP2017228337A JP7262921B2 JP 7262921 B2 JP7262921 B2 JP 7262921B2 JP 2017228337 A JP2017228337 A JP 2017228337A JP 2017228337 A JP2017228337 A JP 2017228337A JP 7262921 B2 JP7262921 B2 JP 7262921B2
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pattern
information
substrate
original
obtaining
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JP2017228337A
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Japanese (ja)
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JP2019102495A5 (enExample
JP2019102495A (ja
Inventor
慎一郎 古賀
勇介 三浦
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Canon Inc
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Canon Inc
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Priority to JP2017228337A priority Critical patent/JP7262921B2/ja
Priority to KR1020180142652A priority patent/KR102410234B1/ko
Publication of JP2019102495A publication Critical patent/JP2019102495A/ja
Publication of JP2019102495A5 publication Critical patent/JP2019102495A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2017228337A 2017-11-28 2017-11-28 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 Active JP7262921B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017228337A JP7262921B2 (ja) 2017-11-28 2017-11-28 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法
KR1020180142652A KR102410234B1 (ko) 2017-11-28 2018-11-19 정보 처리 장치, 컴퓨터 프로그램, 리소그래피 장치, 리소그래피 시스템 및 물품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017228337A JP7262921B2 (ja) 2017-11-28 2017-11-28 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2019102495A JP2019102495A (ja) 2019-06-24
JP2019102495A5 JP2019102495A5 (enExample) 2021-01-07
JP7262921B2 true JP7262921B2 (ja) 2023-04-24

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JP2017228337A Active JP7262921B2 (ja) 2017-11-28 2017-11-28 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法

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JP (1) JP7262921B2 (enExample)
KR (1) KR102410234B1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3807720B1 (en) 2018-11-07 2022-05-11 ASML Netherlands B.V. Method for configuring a semiconductor manufacturing process, a lithographic apparatus and an associated computer program product
JP6896036B2 (ja) * 2019-09-30 2021-06-30 キヤノン株式会社 情報処理装置、判定方法、インプリント装置、リソグラフィシステム、物品の製造方法及びプログラム
JP7466403B2 (ja) * 2020-08-03 2024-04-12 キヤノン株式会社 制御装置、リソグラフィー装置、制御方法および物品製造方法
JP7649188B2 (ja) * 2021-04-21 2025-03-19 キヤノン株式会社 処理システム、計測装置、基板処理装置及び物品の製造方法
US20230274987A1 (en) * 2022-02-25 2023-08-31 Applied Materials, Inc. Machine learning & integrated metrology for run-to-run optimization of chip-to-wafer alignment accuracy
KR102870303B1 (ko) * 2022-08-16 2025-10-15 주식회사 선익시스템 머신 러닝 기반 이미지 처리 유닛을 구비하는 증착 장치 및 그 얼라인 마크의 촬영 조건 설정 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124110A (ja) 2001-07-03 2003-04-25 Samsung Electronics Co Ltd 工程装置の制御方法
JP2006013178A (ja) 2004-06-28 2006-01-12 Toshiba Corp 露光方法及び露光システム
JP2014053426A (ja) 2012-09-06 2014-03-20 Toshiba Corp 露光装置、露光方法および半導体装置の製造方法
JP2014229675A (ja) 2013-05-21 2014-12-08 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 重ね合わせ補正システム
JP2015198173A (ja) 2014-04-01 2015-11-09 キヤノン株式会社 パターン形成方法、露光装置、および物品の製造方法
JP2016063054A (ja) 2014-09-17 2016-04-25 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
US20160148850A1 (en) 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583791B2 (ja) * 2010-02-19 2014-09-03 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びデバイス製造方法
NL2010691A (en) * 2012-05-29 2013-12-02 Asml Netherlands Bv A method to determine the usefulness of alignment marks to correct overlay, and a combination of a lithographic apparatus and an overlay measurement system.

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124110A (ja) 2001-07-03 2003-04-25 Samsung Electronics Co Ltd 工程装置の制御方法
JP2006013178A (ja) 2004-06-28 2006-01-12 Toshiba Corp 露光方法及び露光システム
JP2014053426A (ja) 2012-09-06 2014-03-20 Toshiba Corp 露光装置、露光方法および半導体装置の製造方法
JP2014229675A (ja) 2013-05-21 2014-12-08 ピーエスフォー ルクスコ エスエイアールエルＰＳ４ Ｌｕｘｃｏ Ｓ．ａ．ｒ．ｌ． 重ね合わせ補正システム
JP2015198173A (ja) 2014-04-01 2015-11-09 キヤノン株式会社 パターン形成方法、露光装置、および物品の製造方法
JP2016063054A (ja) 2014-09-17 2016-04-25 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
US20160148850A1 (en) 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes

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KR102410234B1 (ko) 2022-06-20
JP2019102495A (ja) 2019-06-24
KR20190062202A (ko) 2019-06-05

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