KR102409584B1 - 기판 처리 장치 및 기판 보유 지지 장치 - Google Patents

기판 처리 장치 및 기판 보유 지지 장치 Download PDF

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Publication number
KR102409584B1
KR102409584B1 KR1020190042414A KR20190042414A KR102409584B1 KR 102409584 B1 KR102409584 B1 KR 102409584B1 KR 1020190042414 A KR1020190042414 A KR 1020190042414A KR 20190042414 A KR20190042414 A KR 20190042414A KR 102409584 B1 KR102409584 B1 KR 102409584B1
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South Korea
Prior art keywords
substrate
holder
wafer
holding
chuck
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KR1020190042414A
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Korean (ko)
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KR20190120708A (ko
Inventor
겐이치 고바야시
데츠지 도가와
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • H01L21/67028—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/16—Rigid blades, e.g. scrapers; Flexible blades, e.g. wipers
    • B08B1/165—Scrapers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • H01L21/6838—
    • H01L21/68742—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020190042414A 2018-04-16 2019-04-11 기판 처리 장치 및 기판 보유 지지 장치 Active KR102409584B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018078563A JP7020986B2 (ja) 2018-04-16 2018-04-16 基板処理装置および基板保持装置
JPJP-P-2018-078563 2018-04-16

Publications (2)

Publication Number Publication Date
KR20190120708A KR20190120708A (ko) 2019-10-24
KR102409584B1 true KR102409584B1 (ko) 2022-06-17

Family

ID=66349275

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190042414A Active KR102409584B1 (ko) 2018-04-16 2019-04-11 기판 처리 장치 및 기판 보유 지지 장치

Country Status (6)

Country Link
US (1) US11373894B2 (enExample)
EP (1) EP3556511B1 (enExample)
JP (1) JP7020986B2 (enExample)
KR (1) KR102409584B1 (enExample)
CN (1) CN110391171B (enExample)
TW (1) TWI780322B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4018473B1 (en) * 2019-08-19 2024-07-03 Oem Group, LLC Systems and methods for a lift and rotate wafer handling process
JP7471170B2 (ja) 2020-08-03 2024-04-19 東京エレクトロン株式会社 基板処理方法、及び基板処理装置
KR102883042B1 (ko) * 2020-08-18 2025-11-10 삼성디스플레이 주식회사 초음파 본딩 장치 및 이를 이용한 초음파 본딩 방법
JP7491774B2 (ja) * 2020-08-24 2024-05-28 株式会社荏原製作所 基板保持回転機構、基板処理装置
CN112599432B (zh) * 2020-12-16 2022-04-01 无锡英诺赛思科技有限公司 一种芯片共晶焊接设备及共晶焊接方法
TW202343164A (zh) 2021-12-20 2023-11-01 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記憶媒體
US20230360940A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Wafer film frame carrier
CN115502844A (zh) * 2022-09-29 2022-12-23 中国航发动力股份有限公司 一种自动抛光装置
JP2024106671A (ja) * 2023-01-27 2024-08-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN117855110B (zh) * 2024-03-08 2024-05-24 苏州智程半导体科技股份有限公司 一种半导体处理设备
TWI907104B (zh) * 2024-10-15 2025-12-01 國巨股份有限公司 電鑄金屬網版研磨裝置及其研磨方法
CN120228636A (zh) * 2025-03-20 2025-07-01 西安奕斯伟材料科技股份有限公司 一种双面抛光设备的承载盘及双面抛光设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060094343A1 (en) 2004-04-20 2006-05-04 Nihon Microcoating Co., Ltd. Polishing machine
US20130213437A1 (en) 2012-02-21 2013-08-22 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2854213B2 (ja) * 1993-03-19 1999-02-03 シャープ株式会社 洗浄装置
JPH08117701A (ja) * 1994-10-26 1996-05-14 M Setetsuku Kk 基板のスクラビング装置
JP3109558B2 (ja) * 1994-11-24 2000-11-20 住友金属工業株式会社 ウエハ保持具
CN1260778C (zh) * 2000-12-04 2006-06-21 株式会社荏原制作所 基片加工方法
JP3895651B2 (ja) * 2002-08-12 2007-03-22 Ｈｏｙａ株式会社 不要膜除去装置および不要膜除去方法、並びにフォトマスクブランク製造方法
WO2005081301A1 (en) * 2004-02-25 2005-09-01 Ebara Corporation Polishing apparatus and substrate processing apparatus
JP2007258274A (ja) 2006-03-20 2007-10-04 Ebara Corp 基板処理方法、及び基板処理装置
KR20100059549A (ko) * 2008-11-26 2010-06-04 세메스 주식회사 기판 지지부재, 이를 갖는 기판 처리 장치 및 이를 이용한 기판 처리 방법
JP5301505B2 (ja) * 2009-08-27 2013-09-25 東京エレクトロン株式会社 液処理装置および液処理方法
JP6140439B2 (ja) * 2012-12-27 2017-05-31 株式会社荏原製作所 研磨装置、及び研磨方法
JP6100002B2 (ja) 2013-02-01 2017-03-22 株式会社荏原製作所 基板裏面の研磨方法および基板処理装置
JP6777985B2 (ja) * 2015-11-19 2020-10-28 株式会社荏原製作所 基板保持装置
JP2017157746A (ja) * 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP6691836B2 (ja) * 2016-06-20 2020-05-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060094343A1 (en) 2004-04-20 2006-05-04 Nihon Microcoating Co., Ltd. Polishing machine
US20130213437A1 (en) 2012-02-21 2013-08-22 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
TW201944528A (zh) 2019-11-16
CN110391171A (zh) 2019-10-29
TWI780322B (zh) 2022-10-11
US20190318954A1 (en) 2019-10-17
EP3556511B1 (en) 2021-06-23
JP7020986B2 (ja) 2022-02-16
JP2019186475A (ja) 2019-10-24
KR20190120708A (ko) 2019-10-24
CN110391171B (zh) 2024-07-12
EP3556511A3 (en) 2020-03-11
US11373894B2 (en) 2022-06-28
EP3556511A2 (en) 2019-10-23

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