KR102361291B1 - 전지 보호 장치 - Google Patents
전지 보호 장치 Download PDFInfo
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- KR102361291B1 KR102361291B1 KR1020170068980A KR20170068980A KR102361291B1 KR 102361291 B1 KR102361291 B1 KR 102361291B1 KR 1020170068980 A KR1020170068980 A KR 1020170068980A KR 20170068980 A KR20170068980 A KR 20170068980A KR 102361291 B1 KR102361291 B1 KR 102361291B1
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- chip
- protection device
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
- H02J7/0031—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits using battery or load disconnect circuits
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
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- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
- H01M2010/4271—Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing
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KR102128868B1 (ko) * | 2019-07-11 | 2020-07-01 | 주식회사 아이티엠반도체 | 배터리 보호회로 패키지 및 그 제조방법 |
USD929337S1 (en) | 2019-09-05 | 2021-08-31 | Techtronic Cordless Gp | Electrical interface |
USD929338S1 (en) | 2019-09-05 | 2021-08-31 | Techtronic Cordless Gp | Electrical interface |
USD929336S1 (en) | 2019-09-05 | 2021-08-31 | Techtronic Cordless Gp | Electrical interface |
USD953268S1 (en) | 2019-09-05 | 2022-05-31 | Techtronic Cordless Gp | Electrical interface |
USD1012855S1 (en) | 2019-09-05 | 2024-01-30 | Techtronic Cordless Gp | Battery pack |
USD929335S1 (en) | 2019-09-05 | 2021-08-31 | Techtronic Cordless Gp | Electrical interface |
USD929334S1 (en) | 2019-09-05 | 2021-08-31 | Techtronic Cordless Gp | Electrical interface |
USD929339S1 (en) | 2019-09-05 | 2021-08-31 | Techtronic Cordless Gp | Electrical interface |
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