KR102351843B1 - 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치 - Google Patents

반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치 Download PDF

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KR102351843B1
KR102351843B1 KR1020197036965A KR20197036965A KR102351843B1 KR 102351843 B1 KR102351843 B1 KR 102351843B1 KR 1020197036965 A KR1020197036965 A KR 1020197036965A KR 20197036965 A KR20197036965 A KR 20197036965A KR 102351843 B1 KR102351843 B1 KR 102351843B1
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South Korea
Prior art keywords
adhesive
preferable
component
compound
semiconductor device
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KR1020197036965A
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English (en)
Korean (ko)
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KR20200016264A (ko
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도시야스 아키요시
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쇼와덴코머티리얼즈가부시끼가이샤
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Priority to KR1020227000993A priority Critical patent/KR102412246B1/ko
Publication of KR20200016264A publication Critical patent/KR20200016264A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Epoxy Resins (AREA)
KR1020197036965A 2017-06-07 2017-06-07 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치 KR102351843B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227000993A KR102412246B1 (ko) 2017-06-07 2017-06-07 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/021143 WO2018225191A1 (ja) 2017-06-07 2017-06-07 半導体用フィルム状接着剤、半導体装置の製造方法及び半導体装置

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KR1020227000993A Division KR102412246B1 (ko) 2017-06-07 2017-06-07 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치

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KR20200016264A KR20200016264A (ko) 2020-02-14
KR102351843B1 true KR102351843B1 (ko) 2022-01-18

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KR1020197036965A KR102351843B1 (ko) 2017-06-07 2017-06-07 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
KR1020227000993A KR102412246B1 (ko) 2017-06-07 2017-06-07 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
KR1020197033477A KR102455211B1 (ko) 2017-06-07 2018-03-14 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
KR1020197033478A KR102508048B1 (ko) 2017-06-07 2018-06-06 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치

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KR1020227000993A KR102412246B1 (ko) 2017-06-07 2017-06-07 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
KR1020197033477A KR102455211B1 (ko) 2017-06-07 2018-03-14 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치
KR1020197033478A KR102508048B1 (ko) 2017-06-07 2018-06-06 반도체용 필름형 접착제, 반도체 장치의 제조 방법 및 반도체 장치

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JP (8) JP6958615B2 (zh)
KR (4) KR102351843B1 (zh)
TW (4) TWI804062B (zh)
WO (3) WO2018225191A1 (zh)

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CN117070169A (zh) * 2019-09-30 2023-11-17 株式会社力森诺科 半导体用黏合剂及其制造方法、以及半导体装置及其制造方法
WO2023146254A1 (ko) 2022-01-25 2023-08-03 주식회사 엘지에너지솔루션 전사 적층체, 리튬 이차 전지용 전극의 전리튬화 방법 및 전극을 포함하는 리튬 이차 전지

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KR20200016264A (ko) 2020-02-14
WO2018225191A1 (ja) 2018-12-13
JP2022000918A (ja) 2022-01-04
WO2018225323A1 (ja) 2018-12-13
JP2023164554A (ja) 2023-11-10
KR20200016840A (ko) 2020-02-17
TWI827512B (zh) 2023-12-21
TW201904007A (zh) 2019-01-16
JP2024003019A (ja) 2024-01-11
JP7196839B2 (ja) 2022-12-27
KR102412246B1 (ko) 2022-06-23
KR102455211B1 (ko) 2022-10-14
TW202336971A (zh) 2023-09-16
JPWO2018225323A1 (ja) 2020-04-09
JP7351393B2 (ja) 2023-09-27
TW202209622A (zh) 2022-03-01
TW202410369A (zh) 2024-03-01
TWI804062B (zh) 2023-06-01
KR20220010583A (ko) 2022-01-25
JPWO2018225800A1 (ja) 2020-04-16
JP7173002B2 (ja) 2022-11-16
JP7380926B2 (ja) 2023-11-15
JP6958615B2 (ja) 2021-11-02
JP2023041754A (ja) 2023-03-24
KR102508048B1 (ko) 2023-03-09
TWI748105B (zh) 2021-12-01
JP7226498B2 (ja) 2023-02-21
WO2018225800A1 (ja) 2018-12-13
KR20200016841A (ko) 2020-02-17
JP2022186809A (ja) 2022-12-15
JPWO2018225191A1 (ja) 2020-04-09

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