KR102345722B1 - 고내열 저유전 폴리이미드 필름 및 이의 제조방법 - Google Patents

고내열 저유전 폴리이미드 필름 및 이의 제조방법 Download PDF

Info

Publication number
KR102345722B1
KR102345722B1 KR1020190141524A KR20190141524A KR102345722B1 KR 102345722 B1 KR102345722 B1 KR 102345722B1 KR 1020190141524 A KR1020190141524 A KR 1020190141524A KR 20190141524 A KR20190141524 A KR 20190141524A KR 102345722 B1 KR102345722 B1 KR 102345722B1
Authority
KR
South Korea
Prior art keywords
mol
dianhydride
less
content
component
Prior art date
Application number
KR1020190141524A
Other languages
English (en)
Korean (ko)
Other versions
KR20210055267A (ko
Inventor
조민상
Original Assignee
피아이첨단소재 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피아이첨단소재 주식회사 filed Critical 피아이첨단소재 주식회사
Priority to KR1020190141524A priority Critical patent/KR102345722B1/ko
Priority to CN201980101953.8A priority patent/CN114616270B/zh
Priority to PCT/KR2019/016856 priority patent/WO2021091013A1/ko
Priority to TW109137739A priority patent/TWI823032B/zh
Publication of KR20210055267A publication Critical patent/KR20210055267A/ko
Application granted granted Critical
Publication of KR102345722B1 publication Critical patent/KR102345722B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
KR1020190141524A 2019-11-07 2019-11-07 고내열 저유전 폴리이미드 필름 및 이의 제조방법 KR102345722B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020190141524A KR102345722B1 (ko) 2019-11-07 2019-11-07 고내열 저유전 폴리이미드 필름 및 이의 제조방법
CN201980101953.8A CN114616270B (zh) 2019-11-07 2019-12-02 高耐热及低介电质的聚酰亚胺薄膜及其制备方法
PCT/KR2019/016856 WO2021091013A1 (ko) 2019-11-07 2019-12-02 고내열 저유전 폴리이미드 필름 및 이의 제조방법
TW109137739A TWI823032B (zh) 2019-11-07 2020-10-30 聚醯亞胺薄膜、其製造方法及包含其的多層薄膜、可撓性金屬箔層壓板和電子部件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190141524A KR102345722B1 (ko) 2019-11-07 2019-11-07 고내열 저유전 폴리이미드 필름 및 이의 제조방법

Publications (2)

Publication Number Publication Date
KR20210055267A KR20210055267A (ko) 2021-05-17
KR102345722B1 true KR102345722B1 (ko) 2022-01-03

Family

ID=75849207

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190141524A KR102345722B1 (ko) 2019-11-07 2019-11-07 고내열 저유전 폴리이미드 필름 및 이의 제조방법

Country Status (4)

Country Link
KR (1) KR102345722B1 (zh)
CN (1) CN114616270B (zh)
TW (1) TWI823032B (zh)
WO (1) WO2021091013A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023090969A1 (ko) * 2021-11-22 2023-05-25 피아이첨단소재 주식회사 폴리이미드 전구체 조성물 및 이를 포함하는 폴리이미드 필름
KR20230153791A (ko) * 2022-04-29 2023-11-07 피아이첨단소재 주식회사 저유전 및 고내열 특성을 가지는 폴리이미드 필름 및 그 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101183320B1 (ko) 2004-05-13 2012-09-14 가부시키가이샤 가네카 접착 필름 및 연성 금속장적층판 및 이들의 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202412A (en) * 1990-10-02 1993-04-13 E. I. Du Pont De Nemours And Company Polyimide copolymer precursors
KR950007999A (ko) * 1993-09-27 1995-04-15 김창화 단조용 초경합금 분할다이스 및 그 제조방법
JP5054976B2 (ja) * 2004-09-24 2012-10-24 株式会社カネカ 高い接着性を有するポリイミドフィルムの製造方法
JP5374817B2 (ja) * 2005-11-16 2013-12-25 東レ・デュポン株式会社 ポリイミドフィルムおよびその製造方法
JP5735287B2 (ja) * 2011-01-13 2015-06-17 株式会社カネカ 多層ポリイミドフィルム及びそれを用いたフレキシブル金属箔張積層板
KR101506611B1 (ko) * 2013-03-19 2015-03-27 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
KR101928598B1 (ko) * 2013-09-30 2018-12-12 주식회사 엘지화학 폴리이미드 필름 및 그 제조방법
KR101769101B1 (ko) 2013-12-13 2017-08-30 주식회사 엘지화학 저유전율 및 열가소성을 갖는 폴리이미드 수지 및 이를 이용한 연성 금속 적층판
JP6780500B2 (ja) * 2014-02-28 2020-11-04 日産化学株式会社 ディスプレイ基板用樹脂組成物、ディスプレイ基板用樹脂薄膜及びディスプレイ基板用樹脂薄膜の製造方法
JP6971580B2 (ja) * 2016-02-12 2021-11-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
KR102141892B1 (ko) * 2018-04-05 2020-08-07 피아이첨단소재 주식회사 연성금속박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성금속박적층판
KR102141893B1 (ko) * 2018-04-05 2020-08-07 피아이첨단소재 주식회사 연성금속박적층판 제조용 폴리이미드 필름 및 이를 포함하는 연성금속박적층판

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101183320B1 (ko) 2004-05-13 2012-09-14 가부시키가이샤 가네카 접착 필름 및 연성 금속장적층판 및 이들의 제조 방법

Also Published As

Publication number Publication date
WO2021091013A1 (ko) 2021-05-14
TWI823032B (zh) 2023-11-21
TW202118814A (zh) 2021-05-16
CN114616270A (zh) 2022-06-10
CN114616270B (zh) 2024-03-19
KR20210055267A (ko) 2021-05-17

Similar Documents

Publication Publication Date Title
KR102347633B1 (ko) 유전특성이 개선된 폴리이미드 필름 및 그 제조방법
KR102347588B1 (ko) 고내열 저유전 폴리이미드 필름 및 이의 제조방법
KR102347632B1 (ko) 저유전 폴리이미드 필름 및 이의 제조방법
KR102345722B1 (ko) 고내열 저유전 폴리이미드 필름 및 이의 제조방법
KR102473354B1 (ko) 저유전 폴리이미드 필름 및 이의 제조방법
KR102383776B1 (ko) 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판
KR102437830B1 (ko) 치수안정성이 개선된 저유전 폴리이미드 필름 및 그 제조방법
KR102447652B1 (ko) 유전특성이 개선된 폴리이미드 필름 및 그 제조방법
KR102475605B1 (ko) 액정 분말을 포함하는 저유전 폴리아믹산, 폴리이미드 필름 및 그 제조방법
KR102606060B1 (ko) 그래핀 나노판을 포함하는 폴리이미드 필름 및 그 제조방법
KR102347634B1 (ko) 고접착 저유전 폴리이미드 필름 및 이의 제조방법
KR20230075343A (ko) 폴리이미드 전구체 조성물 및 이를 포함하는 폴리이미드 필름
KR20230075240A (ko) 폴리아믹산, 폴리이미드 필름 및 이를 이용한 연성금속박적층판
KR20230000671A (ko) 반투명 저유전 폴리이미드 필름 및 그 제조방법
KR20230077191A (ko) 저유전 폴리아믹산 및 폴리이미드 필름
KR20220044928A (ko) 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant