KR102341061B1 - Cleaning apparatus for substrate - Google Patents

Abstract

The present invention discloses a substrate cleaning apparatus. The present invention is installed to rotate on a substrate, the brush bristles contacting the substrate in the contact region, an air knife installed on one side of the brush and spraying a first gas on the substrate, and the air knife Installed adjacently, the ionizer for spraying the ionized second gas to the brush bristles, and a cleaning unit installed on the other side of the brush to spray the third gas to the brush bristles.

Description

Substrate cleaning apparatus {Cleaning apparatus for substrate}

The present invention relates to a substrate cleaning apparatus.

In the process of manufacturing a semiconductor substrate or an organic light emitting device substrate, fine particles or foreign substances present on the surface may cause defects in the entire product. Therefore, it is necessary to remove particles corresponding to foreign substances existing on the surface during the manufacturing process of semiconductor products, display devices, or camera modules.

An object of the present invention is to provide a substrate cleaning apparatus with improved cleaning efficiency. However, these problems are exemplary, and the scope of the present invention is not limited thereto.

One aspect of the present invention includes a brush installed to rotate on a substrate and having brush bristles in contact with the substrate in a contact region, an air knife installed on one side of the brush and spraying a first gas on the substrate, A substrate cleaning apparatus including an ionizer installed adjacent to the air knife and spraying a second gas ionized to the brush bristles, and a cleaning unit installed on the other side of the brush and spraying a third gas to the brush bristles to provide.

In addition, the air knife may spray the first gas in front of the contact area when viewed in the moving direction of the substrate.

In addition, the second gas is sprayed from the ionizer to the brush bristles, the first gas is sprayed in front of the contact area from the air knife, and the brush bristles separate foreign substances from the substrate in the contact area, A third gas may be sprayed from the cleaning unit to the brush bristles that have passed through the contact area.

Also, the cleaning unit may move linearly along a rotation axis direction of the brush.

Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

In the substrate cleaning apparatus according to an embodiment of the present invention, cleaning efficiency may be increased by performing both contact and non-contact cleaning. The brush may come into contact with the substrate in the contact region to clean foreign substances adhering to the substrate in a contact manner. At the same time, the air knife can clean the substrate in a non-contact manner by injecting a high-pressure first gas to the substrate that has passed through the contact region. First, the brush cleans in a contact manner, and secondly, an air knife sprays the first gas in a non-contact manner, so that foreign substances remaining on the substrate can be completely removed.

In the substrate cleaning apparatus according to an embodiment of the present invention, the air knife sprays the first gas to the cleaned substrate, thereby preventing further contamination of the substrate. Since the air knife injects the first gas in a direction opposite to the moving direction of the substrate, it is possible to prevent foreign substances from adhering to the cleaned substrate.

The apparatus for cleaning a substrate according to an embodiment of the present invention continuously cleans the brush, thereby increasing the period of use of the brush and increasing cleaning efficiency. Since the cleaning unit immediately cleans the brush that has passed through the contact area, foreign substances adhering to the brush can be removed immediately. In this case, since the cleaning unit can move in the longitudinal direction of the brush, the entire area of the brush can be continuously cleaned.

Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view illustrating a substrate cleaning apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along II-II of FIG. 1 .
FIG. 3 is a view showing a side view of the substrate cleaning apparatus of FIG. 1 .
Fig. 4 is a diagram showing the operation of the substrate cleaning apparatus of Fig. 1;

Hereinafter, various embodiments of the present disclosure are described in connection with the accompanying drawings. Various embodiments of the present disclosure are capable of various changes and may have various embodiments, specific embodiments are illustrated in the drawings and the related detailed description is described. However, this is not intended to limit the various embodiments of the present disclosure to specific embodiments, and it should be understood to include all modifications and/or equivalents or substitutes included in the spirit and scope of the various embodiments of the present disclosure. In connection with the description of the drawings, like reference numerals have been used for like elements.

Expressions such as “comprises” or “may include” that may be used in various embodiments of the present disclosure indicate the existence of a disclosed function, operation, or component, and may include one or more additional functions, operations, or Components, etc. are not limited. Also, in various embodiments of the present disclosure, terms such as “comprise” or “have” are intended to designate that a feature, number, step, action, component, part, or combination thereof described in the specification is present, It should be understood that this does not preclude the possibility of addition or existence of one or more other features or numbers, steps, operations, components, parts, or combinations thereof.

In various embodiments of the present disclosure, expressions such as “or” include any and all combinations of words listed together. For example, "A or B" may include A, may include B, or may include both A and B.

Expressions such as “first”, “second”, “first”, or “second” used in various embodiments of the present disclosure may modify various components of various embodiments, but do not limit the components. does not For example, the above expressions do not limit the order and/or importance of corresponding components. The above expressions may be used to distinguish one component from another. For example, both the first user device and the second user device are user devices, and represent different user devices. For example, without departing from the scope of the various embodiments of the present disclosure, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.

When a component is referred to as being “connected” or “connected” to another component, the component may be directly connected to or connected to the other component, but the component and It should be understood that other new components may exist between the other components. On the other hand, when an element is referred to as being “directly connected” or “directly connected” to another element, it will be understood that no new element exists between the element and the other element. should be able to

Terms used in various embodiments of the present disclosure are only used to describe one specific embodiment, and are not intended to limit the various embodiments of the present disclosure. The singular expression includes the plural expression unless the context clearly dictates otherwise.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present disclosure pertain.

Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in various embodiments of the present disclosure, ideal or excessively formal terms not interpreted as meaning

1 is a perspective view illustrating a substrate cleaning apparatus 100 according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along II-II of FIG. 1 , and FIG. 3 is the substrate cleaning apparatus 100 of FIG. 1 . It is a drawing showing the side of

Referring to FIGS. 1 to 3 , the substrate cleaning apparatus 100 may remove foreign substances on the substrate, and in particular, may clean the substrate in a dry manner. A target to which the substrate cleaning apparatus 100 can be used is variously applicable, such as a substrate, a wafer, a plate, a panel, and an electronic device. However, hereinafter, for convenience of description, a case in which the object is a substrate will be mainly described.

The substrate cleaning apparatus 100 includes a housing 10 and a guide unit 20 , and the inside of the housing 10 includes a brush 110 , an air knife 120 , an ionizer 130 , and a cleaning unit 140 . and a dust collection chamber 150 .

The housing 10 forms an exterior of the substrate cleaning apparatus 100 and may extend in one direction. The guide unit 20 is disposed on one side of the housing 10 , and the dust collecting chamber 150 is disposed on the upper surface. In addition, a lower portion of the housing 10 is opened, and a portion of the brush 110 may protrude.

A cover plate 15 may be disposed inside the housing 10 . The cover plate 15 is disposed to surround a portion of the brush 110 , and may guide foreign substances PT discharged during cleaning to the dust collecting chamber 150 .

The guide unit 20 is installed on one side of the housing 10 . The guide unit 20 may include a support plate 21 , a guide rail 22 , an end cap 23 , and a guide shaft 24 .

The support plate 21 is installed on a side wall of the housing 10 , and a guide rail 22 may be attached thereto. The guide rail 22 may extend in the longitudinal direction of the housing 10 , that is, in the longitudinal direction of the brush 110 , and the cleaning unit 140 may be mounted thereon. The end cap 23 supports both ends of the guide shaft 24 , and may be installed on the support plate 21 . The guide shaft 24 extends parallel to the guide rail 22 , and may guide the movement of the cleaning unit 140 .

The brush 110 may be installed to rotate on the substrate S. The brush 110 is coupled to a drive shaft 111 connected to a drive motor 115 . When the driving motor 115 operates, the driving shaft 111 may rotate, so that the brush 110 may rotate on the substrate S.

Brush bristles 112 may be formed on the surface of the brush 110 to contact the substrate S in the contact region CE1 . The brush bristles 112 may contact the surface of the substrate S to form a contact region CE1 .

The air knife 120 is installed on one side of the brush 110 , and may spray the first gas g1 on the substrate S. The air knife 120 may inject the high-pressure first gas g1 onto the substrate S to increase the cleaning effect. A region in which the first gas g1 contacts the substrate S may be defined as the cleaning region CE2 .

The air knife 120 may spray the first gas g1 to the front of the contact area CE1 to prevent the foreign material PT separated from the contact area CE1 from moving forward. That is, the air knife 120 functions as an air curtain to prevent the foreign material PT from moving forward. When the first gas g1 is injected into the cleaning region CE2 , it is possible to prevent the foreign substances PT from passing through the cleaning region CE2 and adhering to the cleaned substrate S again. Although the first gas g1 is directed toward the cleaning area CE2 and is sprayed backward, it is possible to prevent the foreign material PT from moving forward.

Also, the air knife 120 may clean the substrate S primarily cleaned by the brush 110 again. Since the first gas g1 is sprayed with a strong pressure into the cleaning region CE2 , the foreign material PT remaining on the substrate S can be separated, and the foreign material PT is absorbed into the airflow of the first gas g1 . by moving backwards. That is, the air knife 120 may perform secondary cleaning of the substrate S.

Referring to FIG. 4 , the air knife 120 sprays the first gas g1 at a preset angle, but the first gas g1 is not directly sprayed toward the brush bristles 112 . That is, the first gas g1 is sprayed only to the preset cleaning area CE2 , and the first gas g1 does not directly contact the brush bristles 112 . Since the first gas g1 is sprayed only to the cleaning region CE2 , it is possible to prevent foreign substances from the brush 110 from falling onto the substrate S.

If the air knife 120 directly sprays the first gas g1 toward the brush 110 , the foreign material PT attached to the brush 110 falls on the substrate S, or the substrate cleaning apparatus 100 . Foreign substances (PT) may float in the inside of the unit, reducing the cleaning ability. Since the air knife 120 according to the present invention sprays the first gas g1 only to the cleaning area CE2 , only the foreign material PT attached to the substrate S can be effectively separated.

The ionizer 130 is installed adjacent to the air knife 120 , and may spray the ionized second gas g2 to the brush bristles 112 . The ionizer 130 sprays the ionized second gas g2 to the brush bristles 112 to prevent static electricity from being generated in the brush bristles 112 during operation. In addition, the ionizer 130 may prevent the brush bristles 112 from being in contact with the substrate S to generate static electricity on the substrate S.

The ionizer 130 may include a first nozzle 131 . The first nozzle 131 is disposed to contact the brush bristles 112 , and the second gas g2 discharged from the first nozzle 131 may directly contact the brush bristles 112 .

The cleaning unit 140 is installed on the other side of the brush 110 , and may spray the third gas g3 to the brush bristles 112 . The cleaning unit 140 may separate and remove the foreign material PT adhering to the brush 110 by spraying the third gas g3 to the brush 110 that has passed through the contact area CE1 .

The cleaning unit 140 may include a moving block 141 installed in the guide unit 20 , and a second nozzle 142 for spraying the third gas g3 , and the direction of the rotation axis of the brush 110 is adjusted. It can move linearly.

The moving block 141 is installed on the guide rail 22 and the guide shaft 24 , and may linearly reciprocate along the guide rail 22 and the guide shaft 24 .

The second nozzle 142 is installed in the moving block 141 , and an end thereof may be installed to contact the brush 110 . The high-pressure third gas g3 is injected through the second nozzle 142 , and the third gas g3 may separate the foreign substances PT attached to the brush 110 .

When passing through the contact area CE1 , the foreign material PT of the substrate S is attached to the brush 110 . Since the third gas g3 is sprayed with a strong pressure, the foreign material PT attached to the brush 110 may be separated, and the foreign material PT may be discharged to the dust collecting chamber 150 .

The cleaning unit 140 may move in the longitudinal direction of the brush 110 . Since the cleaning unit 140 moves linearly along the brush 110 , it is possible to continuously maintain the cleanliness of the brush 110 .

Since the cleaning unit 140 directly sprays the third gas g3 to the brush 110 passing through the contact area CE1 , the cleaning effect of the brush 110 may be enhanced. When coming out of the contact region CE1 , the end of the second nozzle 142 is in contact with the brush bristles 112 , and the third gas g3 is sprayed onto the brush bristles 112 , and foreign substances cleaned from the substrate S can be removed immediately.

FIG. 4 is a diagram illustrating the operation of the substrate cleaning apparatus 100 of FIG. 1 .

Referring to FIG. 4 , the substrate cleaning apparatus 100 may clean the substrate S in a contact and non-contact method.

When the brush 110 rotates clockwise, the second gas g2 ionized by the ionizer 130 is sprayed to the brush bristles 112 . The brush bristles 112 are neutralized in advance before being attached to the substrate S, thereby preventing static electricity from being generated in the contact region CE1 .

The brush 110 may be in contact with the substrate S in the contact region CE1 , and the brush bristles 112 may primarily clean foreign substances PT adhering to the substrate S. That is, the brush 110 may remove the foreign material PT adhering to the substrate S by using the contact method.

At this time, the air knife 120 injects the first gas g1 to the front of the contact area CE1 . Since the substrate S moves from left to right, the substrate S that has been primarily cleaned through the contact region CE1 enters the cleaning region CE2 to which the first gas g1 comes into contact.

Even when the brush 110 is primarily cleaned, the foreign material PT may remain on the substrate S. Since the first gas g1 is sprayed with a strong pressure, the foreign material PT remaining on the substrate S is separated and moved backward. That is, the air knife 120 may secondarily clean the substrate S.

The air knife 120 functions as an air curtain to prevent the foreign substances PT from re-adhering to the cleaned substrate S. Since the air knife 120 jets the first gas g1 from the front to the rear, it is possible to prevent the foreign substances PT from re-adhering to the cleaned substrate S.

When the brush 110 passes through the contact area CE1 , the brush 110 may be cleaned by the cleaning unit 140 . The third gas g3 is injected at a high pressure from the second nozzle 142 , and the foreign substances PT attached to the brush bristles 112 may be separated. That is, the cleaning unit 140 may clean the brush 110 to prevent contamination of the brush 110 and increase cleaning efficiency.

In the substrate cleaning apparatus 100 according to an embodiment of the present invention, cleaning efficiency may be increased by performing both contact and non-contact cleaning. The brush 110 may contact the substrate S in the contact region CE1 to clean the foreign substances PT adhering to the substrate S in a contact manner. At the same time, the air knife 120 may spray the high-pressure first gas g1 to the substrate S that has passed through the contact region CE1 to clean the substrate S in a non-contact manner. First, the brush 110 cleans in a contact manner, and secondly, the air knife 120 sprays the first gas g1 in a non-contact manner, so that foreign substances remaining on the substrate can be completely removed.

In the substrate cleaning apparatus 100 according to an embodiment of the present invention, the air knife 120 sprays the first gas g1 to the cleaned substrate S, thereby preventing further contamination of the substrate S. have. Since the air knife 120 jets the first gas g1 in a direction opposite to the moving direction of the substrate S, it is possible to prevent the foreign substances PT from adhering to the cleaned substrate S.

The substrate cleaning apparatus 100 according to an embodiment of the present invention continuously cleans the brush 110 , thereby increasing the period of use of the brush 110 and increasing cleaning efficiency. Since the cleaning unit 140 directly cleans the brush 110 that has passed through the contact area CE1 , the foreign material PT adhering to the brush 110 can be immediately removed. In this case, since the cleaning unit 140 may move in the longitudinal direction of the brush 110 , the entire area of the brush 110 may be continuously cleaned.

As such, the present invention has been described with reference to the embodiment shown in the drawings, which is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. . Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

100: substrate cleaning device
110: brush
120: air knife
130: ionizer
140: cleaning unit
150: dust collection chamber

Claims (4)

a brush installed to rotate on the substrate, the brush bristles contacting the substrate in a contact region;
an air knife installed on one side of the brush and spraying a first gas into a cleaning area different from the contact area;
an ionizer installed on the air knife and spraying the ionized second gas to the brush bristles; and
and a cleaning unit installed on the other side of the brush and spraying a third gas to the brush bristles.
the brush is
After the second gas from the ionizer is sprayed to the brush bristles, it comes into contact with the substrate in the contact area,
In a section before the brush bristles on which the second gas is injected enter the contact area, the air knife sprays the first gas into the cleaning area to clean the substrate passing through the contact area. . According to claim 1,
The ionizer includes a first nozzle in contact with the brush bristles. According to claim 1,
In the contact area, the brush bristles separate foreign substances from the substrate,
A substrate cleaning apparatus for spraying a third gas from the cleaning unit to the brush bristles that have passed through the contact area. According to claim 1,
the cleaning unit
a moving block that linearly moves along the direction of the rotation axis of the brush; and
and a second nozzle installed in the moving block and having an end contacting the brush.

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