KR102340204B1 - 기판 세정 방법, 기판 세정 시스템 및 기억 매체 - Google Patents

기판 세정 방법, 기판 세정 시스템 및 기억 매체 Download PDF

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Publication number
KR102340204B1
KR102340204B1 KR1020170062920A KR20170062920A KR102340204B1 KR 102340204 B1 KR102340204 B1 KR 102340204B1 KR 1020170062920 A KR1020170062920 A KR 1020170062920A KR 20170062920 A KR20170062920 A KR 20170062920A KR 102340204 B1 KR102340204 B1 KR 102340204B1
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KR
South Korea
Prior art keywords
substrate
treatment liquid
film
treatment
wafer
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KR1020170062920A
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English (en)
Korean (ko)
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KR20170133265A (ko
Inventor
켄지 세키구치
이타루 칸노
메이토쿠 아이바라
코우조우 타치바나
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20170133265A publication Critical patent/KR20170133265A/ko
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Publication of KR102340204B1 publication Critical patent/KR102340204B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
KR1020170062920A 2016-05-25 2017-05-22 기판 세정 방법, 기판 세정 시스템 및 기억 매체 KR102340204B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016104264 2016-05-25
JPJP-P-2016-104264 2016-05-25
JP2017066950A JP6945320B2 (ja) 2016-05-25 2017-03-30 基板洗浄方法、基板洗浄システムおよび記憶媒体
JPJP-P-2017-066950 2017-03-30

Publications (2)

Publication Number Publication Date
KR20170133265A KR20170133265A (ko) 2017-12-05
KR102340204B1 true KR102340204B1 (ko) 2021-12-16

Family

ID=60575862

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170062920A KR102340204B1 (ko) 2016-05-25 2017-05-22 기판 세정 방법, 기판 세정 시스템 및 기억 매체

Country Status (4)

Country Link
JP (2) JP6945320B2 (ja)
KR (1) KR102340204B1 (ja)
CN (1) CN107437517B (ja)
TW (1) TWI700133B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7142461B2 (ja) * 2018-05-14 2022-09-27 東京エレクトロン株式会社 基板処理方法、基板処理装置および基板処理システム
EP3576133B1 (en) * 2018-05-31 2023-11-22 SCREEN Holdings Co., Ltd. Substrate processing method
WO2020004047A1 (ja) * 2018-06-27 2020-01-02 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
JP7232583B2 (ja) * 2018-07-25 2023-03-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP6557796B1 (ja) * 2019-02-13 2019-08-07 ジャパン・フィールド株式会社 混合洗浄溶剤を用いた被洗浄物の洗浄方法
JP7355535B2 (ja) * 2019-06-28 2023-10-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7292192B2 (ja) * 2019-11-29 2023-06-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置、およびレシピ選択方法
CN112885719A (zh) 2019-11-29 2021-06-01 株式会社斯库林集团 基板处理方法、基板处理装置以及配方选择方法
JP7296309B2 (ja) * 2019-11-29 2023-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
TWI794774B (zh) 2020-03-24 2023-03-01 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
KR20230100232A (ko) * 2021-12-28 2023-07-05 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP7451595B2 (ja) 2022-05-09 2024-03-18 セメス カンパニー，リミテッド 基板処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011139004A (ja) * 2010-01-04 2011-07-14 Asahi Glass Co Ltd 基板の洗浄方法
JP2014123704A (ja) * 2012-11-26 2014-07-03 Tokyo Electron Ltd 基板洗浄システム、基板洗浄方法および記憶媒体
JP2015046442A (ja) * 2013-08-27 2015-03-12 東京エレクトロン株式会社 基板処理方法、基板処理システムおよび記憶媒体
JP2015119164A (ja) * 2013-11-13 2015-06-25 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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JP3690619B2 (ja) * 1996-01-12 2005-08-31 忠弘 大見 洗浄方法及び洗浄装置
US6349096B1 (en) * 1997-09-22 2002-02-19 Integrated Telecom Express, Inc. Configurable digital subscriber loop access and end-to-end data and analog voice connection system
US7745095B2 (en) * 2007-07-05 2010-06-29 Asml Netherlands B.V. Lithographic method and device manufactured thereby
JP6022490B2 (ja) * 2013-08-27 2016-11-09 東京エレクトロン株式会社 基板処理方法、基板処理システムおよび記憶媒体
JP6193813B2 (ja) * 2014-06-10 2017-09-06 信越化学工業株式会社 ウエハ加工用仮接着材料、ウエハ加工体及びこれらを使用する薄型ウエハの製造方法
JP6426936B2 (ja) * 2014-07-31 2018-11-21 東京エレクトロン株式会社 基板洗浄方法および記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011139004A (ja) * 2010-01-04 2011-07-14 Asahi Glass Co Ltd 基板の洗浄方法
JP2014123704A (ja) * 2012-11-26 2014-07-03 Tokyo Electron Ltd 基板洗浄システム、基板洗浄方法および記憶媒体
JP2015046442A (ja) * 2013-08-27 2015-03-12 東京エレクトロン株式会社 基板処理方法、基板処理システムおよび記憶媒体
JP2015119164A (ja) * 2013-11-13 2015-06-25 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体

Also Published As

Publication number Publication date
CN107437517A (zh) 2017-12-05
KR20170133265A (ko) 2017-12-05
JP2021082843A (ja) 2021-05-27
JP6945320B2 (ja) 2021-10-06
CN107437517B (zh) 2022-03-11
TW201808474A (zh) 2018-03-16
JP7066024B2 (ja) 2022-05-12
TWI700133B (zh) 2020-08-01
JP2017216431A (ja) 2017-12-07

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