KR102337721B1 - 기판 액 처리 장치 - Google Patents

기판 액 처리 장치 Download PDF

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Publication number
KR102337721B1
KR102337721B1 KR1020140188281A KR20140188281A KR102337721B1 KR 102337721 B1 KR102337721 B1 KR 102337721B1 KR 1020140188281 A KR1020140188281 A KR 1020140188281A KR 20140188281 A KR20140188281 A KR 20140188281A KR 102337721 B1 KR102337721 B1 KR 102337721B1
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KR
South Korea
Prior art keywords
cup
substrate
flow path
liquid
drain
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KR1020140188281A
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English (en)
Korean (ko)
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KR20150077351A (ko
Inventor
데루후미 와키야마
노리히로 이토
지로 히가시지마
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도쿄엘렉트론가부시키가이샤
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Publication of KR20150077351A publication Critical patent/KR20150077351A/ko
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Publication of KR102337721B1 publication Critical patent/KR102337721B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers

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  • Cleaning Or Drying Semiconductors (AREA)
KR1020140188281A 2013-12-27 2014-12-24 기판 액 처리 장치 Active KR102337721B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013272204 2013-12-27
JPJP-P-2013-272204 2013-12-27
JP2014211908A JP6287750B2 (ja) 2013-12-27 2014-10-16 基板液処理装置
JPJP-P-2014-211908 2014-10-16

Publications (2)

Publication Number Publication Date
KR20150077351A KR20150077351A (ko) 2015-07-07
KR102337721B1 true KR102337721B1 (ko) 2021-12-08

Family

ID=53482645

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140188281A Active KR102337721B1 (ko) 2013-12-27 2014-12-24 기판 액 처리 장치

Country Status (4)

Country Link
US (1) US9953848B2 (https=)
JP (1) JP6287750B2 (https=)
KR (1) KR102337721B1 (https=)
TW (1) TWI590360B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6090113B2 (ja) * 2013-10-30 2017-03-08 東京エレクトロン株式会社 液処理装置
WO2016076303A1 (ja) * 2014-11-11 2016-05-19 株式会社荏原製作所 基板洗浄装置
WO2017062141A1 (en) * 2015-10-04 2017-04-13 Applied Materials, Inc. Substrate support and baffle apparatus
KR102055712B1 (ko) 2015-10-04 2019-12-13 어플라이드 머티어리얼스, 인코포레이티드 감소된 용적의 처리 챔버
CN115527897A (zh) 2015-10-04 2022-12-27 应用材料公司 小热质量的加压腔室
JP6699335B2 (ja) * 2016-05-10 2020-05-27 トヨタ自動車株式会社 基板洗浄装置
JP6665042B2 (ja) * 2016-06-21 2020-03-13 東京エレクトロン株式会社 基板処理装置、基板処理装置の洗浄方法及び記憶媒体
JP6739268B2 (ja) * 2016-07-25 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI638394B (zh) * 2016-07-25 2018-10-11 斯庫林集團股份有限公司 基板處理裝置
JP6836913B2 (ja) * 2017-01-17 2021-03-03 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
JP6961362B2 (ja) * 2017-03-03 2021-11-05 東京エレクトロン株式会社 基板処理装置
SG11201908117VA (en) * 2017-03-06 2019-10-30 Acm Research Shanghai Inc Apparatus for cleaning semiconductor substrates
JP6788542B2 (ja) * 2017-03-31 2020-11-25 東京エレクトロン株式会社 基板液処理装置
KR102447277B1 (ko) * 2017-11-17 2022-09-26 삼성전자주식회사 스핀 코터 및 이를 구비하는 기판처리 장치와 기판처리 시스템
JP7002969B2 (ja) * 2018-03-19 2022-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI743391B (zh) * 2018-09-05 2021-10-21 大陸商盛美半導體設備（上海）股份有限公司 半導體基板清洗裝置
JP7027284B2 (ja) * 2018-09-07 2022-03-01 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
CN112053970B (zh) * 2019-06-05 2024-11-08 东京毅力科创株式会社 基板处理装置
JP7314634B2 (ja) 2019-06-11 2023-07-26 東京エレクトロン株式会社 塗布装置及び塗布方法
KR102634281B1 (ko) * 2020-12-21 2024-02-07 세메스 주식회사 기판 처리 장치
KR102616061B1 (ko) * 2021-08-24 2023-12-20 (주)디바이스이엔지 바울 조립체를 포함하는 기판 처리장치
JP7731250B2 (ja) * 2021-09-22 2025-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102869894B1 (ko) * 2021-10-08 2025-10-10 세메스 주식회사 기판처리장치 및 기판처리방법
CN115148623B (zh) * 2021-12-31 2025-04-15 华海清科股份有限公司 一种晶圆后处理装置
JP7826058B2 (ja) * 2022-02-28 2026-03-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および処理カップ洗浄方法
US20230286713A1 (en) * 2022-03-14 2023-09-14 Semes Co., Ltd. Bowl, mehtod of manufacturing bowl, and apparatus for treating substrate
JP2024014235A (ja) * 2022-07-22 2024-02-01 株式会社ディスコ スピンナ装置
JP2024089113A (ja) * 2022-12-21 2024-07-03 株式会社荏原製作所 基板回転処理装置及び基板研磨装置
CN118268310A (zh) * 2022-12-30 2024-07-02 盛美半导体设备(上海)股份有限公司 防反灌装置及基板处理设备
CN120977906A (zh) * 2023-09-15 2025-11-18 华海清科股份有限公司 一种晶圆后处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004265912A (ja) * 2003-02-03 2004-09-24 Personal Creation Ltd 基板の処理装置
JP2013033922A (ja) * 2011-07-06 2013-02-14 Tokyo Electron Ltd 基板液処理装置及び基板液処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04144121A (ja) * 1990-10-04 1992-05-18 Nec Corp フォトレジスト塗布用カップ
JP3289208B2 (ja) * 1996-09-24 2002-06-04 東京エレクトロン株式会社 洗浄処理方法及び洗浄処理装置
JP2005019675A (ja) 2003-06-26 2005-01-20 Toshiba Corp ウエット処理装置
ATE445229T1 (de) 2006-04-18 2009-10-15 Tokyo Electron Ltd Flüssigkeitsverarbeitungsvorrichtung
JP4949338B2 (ja) * 2008-08-06 2012-06-06 東京エレクトロン株式会社 液処理装置
JP2012019025A (ja) * 2010-07-07 2012-01-26 Tokyo Electron Ltd 液処理装置
JP5425745B2 (ja) * 2010-10-29 2014-02-26 東京エレクトロン株式会社 液処理装置、液処理方法、およびこの液処理方法を実行するためのコンピュータプログラムが記録された記録媒体
JP5220838B2 (ja) * 2010-12-28 2013-06-26 東京エレクトロン株式会社 液処理装置および液処理方法
JP6051919B2 (ja) * 2012-04-11 2016-12-27 東京エレクトロン株式会社 液処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004265912A (ja) * 2003-02-03 2004-09-24 Personal Creation Ltd 基板の処理装置
JP2013033922A (ja) * 2011-07-06 2013-02-14 Tokyo Electron Ltd 基板液処理装置及び基板液処理方法

Also Published As

Publication number Publication date
US20150187613A1 (en) 2015-07-02
US9953848B2 (en) 2018-04-24
JP6287750B2 (ja) 2018-03-07
JP2015144239A (ja) 2015-08-06
KR20150077351A (ko) 2015-07-07
TWI590360B (zh) 2017-07-01
TW201539610A (zh) 2015-10-16

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