KR102333514B1 - 레이저 광선의 검사 방법 - Google Patents

레이저 광선의 검사 방법 Download PDF

Info

Publication number
KR102333514B1
KR102333514B1 KR1020160000517A KR20160000517A KR102333514B1 KR 102333514 B1 KR102333514 B1 KR 102333514B1 KR 1020160000517 A KR1020160000517 A KR 1020160000517A KR 20160000517 A KR20160000517 A KR 20160000517A KR 102333514 B1 KR102333514 B1 KR 102333514B1
Authority
KR
South Korea
Prior art keywords
inspection
laser beam
shaped object
plate
film
Prior art date
Application number
KR1020160000517A
Other languages
English (en)
Korean (ko)
Other versions
KR20160089277A (ko
Inventor
시게후미 오카다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160089277A publication Critical patent/KR20160089277A/ko
Application granted granted Critical
Publication of KR102333514B1 publication Critical patent/KR102333514B1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/0014—Monitoring arrangements not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020160000517A 2015-01-19 2016-01-04 레이저 광선의 검사 방법 KR102333514B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-007521 2015-01-19
JP2015007521A JP6370227B2 (ja) 2015-01-19 2015-01-19 レーザー光線の検査方法

Publications (2)

Publication Number Publication Date
KR20160089277A KR20160089277A (ko) 2016-07-27
KR102333514B1 true KR102333514B1 (ko) 2021-12-01

Family

ID=56437920

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160000517A KR102333514B1 (ko) 2015-01-19 2016-01-04 레이저 광선의 검사 방법

Country Status (4)

Country Link
JP (1) JP6370227B2 (zh)
KR (1) KR102333514B1 (zh)
CN (1) CN105798453B (zh)
TW (1) TWI670479B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101716369B1 (ko) * 2015-10-19 2017-03-27 주식회사 이오테크닉스 레이저 가공 장비의 자동 검사 장치 및 방법
JP7488684B2 (ja) * 2020-04-08 2024-05-22 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7465425B2 (ja) 2020-07-14 2024-04-11 株式会社東京精密 検査用ウェーハの検査方法及び検査装置並びに検査用ウェーハ
KR102535231B1 (ko) * 2021-05-12 2023-05-26 한국전기안전공사 용융흔의 경계선 선정 및 선명도 결정 방법과 그 시스템

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133324A (ja) 1999-11-08 2001-05-18 Ibiden Co Ltd レーザ加工のテストクーポンおよびテスト方法
JP2002192370A (ja) 2000-09-13 2002-07-10 Hamamatsu Photonics Kk レーザ加工方法
CN202734962U (zh) 2012-05-30 2013-02-13 上海奥通激光技术有限公司 一种激光光斑检测试纸及其检测套件
JP2014104484A (ja) 2012-11-27 2014-06-09 Disco Abrasive Syst Ltd レーザー加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63100336A (ja) * 1986-10-17 1988-05-02 Sony Corp レ−ザ光の特性測定基体及びこれを使用したレ−ザ光の特性測定方法
WO2009150733A1 (ja) * 2008-06-12 2009-12-17 株式会社Ihi レーザアニール方法及びレーザアニール装置
TW201029781A (en) * 2008-12-18 2010-08-16 Hitachi High Tech Corp Laser working state examination method and apparatus, and solar panel fabricating method
JP5902529B2 (ja) * 2012-03-28 2016-04-13 株式会社ディスコ レーザ加工方法
CN102658431B (zh) * 2012-05-18 2014-09-03 中国科学院光电技术研究所 一种自动诊断并校正激光光束发散角及光束质量的装置
JP2014190870A (ja) * 2013-03-27 2014-10-06 Tokyo Seimitsu Co Ltd 被加工材内部の収差測定方法及びレーザ加工方法
JP5849985B2 (ja) * 2013-04-15 2016-02-03 トヨタ自動車株式会社 溶接部の検査装置とその検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001133324A (ja) 1999-11-08 2001-05-18 Ibiden Co Ltd レーザ加工のテストクーポンおよびテスト方法
JP2002192370A (ja) 2000-09-13 2002-07-10 Hamamatsu Photonics Kk レーザ加工方法
CN202734962U (zh) 2012-05-30 2013-02-13 上海奥通激光技术有限公司 一种激光光斑检测试纸及其检测套件
JP2014104484A (ja) 2012-11-27 2014-06-09 Disco Abrasive Syst Ltd レーザー加工装置

Also Published As

Publication number Publication date
KR20160089277A (ko) 2016-07-27
TW201636588A (zh) 2016-10-16
TWI670479B (zh) 2019-09-01
JP2016133370A (ja) 2016-07-25
CN105798453B (zh) 2019-04-19
JP6370227B2 (ja) 2018-08-08
CN105798453A (zh) 2016-07-27

Similar Documents

Publication Publication Date Title
JP6258787B2 (ja) レーザ加工装置及びレーザ加工方法
JP6272145B2 (ja) レーザ加工装置及びレーザ加工方法
US11471976B2 (en) Laser light radiation device and laser light radiation method
JP5456510B2 (ja) レーザ加工装置
KR102333514B1 (ko) 레이저 광선의 검사 방법
JP5451238B2 (ja) レーザ加工方法
KR102231739B1 (ko) 레이저 광선의 검사 방법
TWI712079B (zh) 晶圓之加工方法
JP4709482B2 (ja) 超短光パルスによる透明材料の接合方法、物質接合装置、接合物質
JP2006145810A (ja) 自動焦点装置、レーザ加工装置およびレーザ割断装置
US9149886B2 (en) Modified layer forming method
TW201618876A (zh) 穿透雷射光束的檢測方法
JP2013107090A (ja) 脆性基板加工装置
JP2019176079A (ja) ウェーハ加工方法及びウェーハ加工装置
JP2011173128A (ja) レーザ加工装置
JP5230240B2 (ja) レーザ加工装置
KR20080093321A (ko) 레이저가공 장치
JP7475211B2 (ja) レーザー加工装置の検査方法
TW202241623A (zh) 雷射加工裝置的調整方法以及雷射加工裝置
JP2024047107A (ja) レーザ加工装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right