KR102318648B1 - 연마장치 - Google Patents

연마장치 Download PDF

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Publication number
KR102318648B1
KR102318648B1 KR1020177010046A KR20177010046A KR102318648B1 KR 102318648 B1 KR102318648 B1 KR 102318648B1 KR 1020177010046 A KR1020177010046 A KR 1020177010046A KR 20177010046 A KR20177010046 A KR 20177010046A KR 102318648 B1 KR102318648 B1 KR 102318648B1
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KR
South Korea
Prior art keywords
wafer
polishing
surface plate
polishing head
detection sensor
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Active
Application number
KR1020177010046A
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English (en)
Korean (ko)
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KR20170076664A (ko
Inventor
준이치 우에노
미치토 사토
카오루 이시이
히로미 키시다
요스케 카나이
유야 나카니시
Original Assignee
신에쯔 한도타이 가부시키가이샤
후지코시 기카이 고교 가부시키가이샤
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Publication of KR20170076664A publication Critical patent/KR20170076664A/ko
Application granted granted Critical
Publication of KR102318648B1 publication Critical patent/KR102318648B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020177010046A 2014-10-30 2015-09-24 연마장치 Active KR102318648B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-221600 2014-10-30
JP2014221600A JP6141814B2 (ja) 2014-10-30 2014-10-30 研磨装置
PCT/JP2015/004842 WO2016067518A1 (ja) 2014-10-30 2015-09-24 研磨装置

Publications (2)

Publication Number Publication Date
KR20170076664A KR20170076664A (ko) 2017-07-04
KR102318648B1 true KR102318648B1 (ko) 2021-10-28

Family

ID=55856888

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177010046A Active KR102318648B1 (ko) 2014-10-30 2015-09-24 연마장치

Country Status (8)

Country Link
US (1) US10414017B2 (enExample)
JP (1) JP6141814B2 (enExample)
KR (1) KR102318648B1 (enExample)
CN (1) CN107107308B (enExample)
DE (1) DE112015004589T5 (enExample)
SG (1) SG11201702302QA (enExample)
TW (1) TWI633972B (enExample)
WO (1) WO2016067518A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
JP7305178B2 (ja) * 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー 研磨装置
JP7406980B2 (ja) * 2019-12-24 2023-12-28 株式会社荏原製作所 研磨ユニット、基板処理装置、および研磨方法
CN111805410A (zh) * 2020-06-01 2020-10-23 长江存储科技有限责任公司 研磨系统
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
CN112692721B (zh) * 2020-12-23 2022-07-05 华虹半导体(无锡)有限公司 Cmp工艺晶圆定位装置和划痕追踪方法
CN113579989B (zh) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 滑片检测装置和抛光系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059876A (ja) 2001-08-16 2003-02-28 Ebara Corp 目的物の検知器及び検知方法、及びポリッシング装置
US20130122788A1 (en) * 2011-11-16 2013-05-16 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
JP2716653B2 (ja) * 1993-11-01 1998-02-18 不二越機械工業株式会社 ウェーハの研磨装置および研磨方法
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH08247721A (ja) * 1995-03-15 1996-09-27 Omron Corp 寸法測定装置
US20010012108A1 (en) * 1996-07-26 2001-08-09 Paul Holzapfel Methods and apparatus for the in-process measurement of thin film layers
JP3761673B2 (ja) * 1997-06-17 2006-03-29 株式会社荏原製作所 ポリッシング装置
US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
JP2000127033A (ja) * 1998-10-27 2000-05-09 Speedfam-Ipec Co Ltd 研磨装置
JP2001096455A (ja) * 1999-09-28 2001-04-10 Ebara Corp 研磨装置
JP2001133217A (ja) * 1999-11-05 2001-05-18 Keyence Corp 光学式変位計
JP2006011434A (ja) * 2002-03-29 2006-01-12 Hoya Corp マスクブランク用基板、マスクブランクおよび転写用マスクの製造方法
DE10314212B4 (de) 2002-03-29 2010-06-02 Hoya Corp. Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske
CN100387396C (zh) * 2004-04-01 2008-05-14 上海宏力半导体制造有限公司 化学机械研磨机台滑片检测方法
JP2008093811A (ja) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
JP5491273B2 (ja) * 2010-05-11 2014-05-14 ダイトエレクトロン株式会社 ウェーハの面取り装置
CN103831710B (zh) * 2012-11-27 2017-07-25 盛美半导体设备（上海）有限公司 具有晶圆检测装置的研磨头

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059876A (ja) 2001-08-16 2003-02-28 Ebara Corp 目的物の検知器及び検知方法、及びポリッシング装置
US20130122788A1 (en) * 2011-11-16 2013-05-16 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement

Also Published As

Publication number Publication date
SG11201702302QA (en) 2017-05-30
US20170304986A1 (en) 2017-10-26
CN107107308A (zh) 2017-08-29
DE112015004589T5 (de) 2017-08-31
JP6141814B2 (ja) 2017-06-07
JP2016087713A (ja) 2016-05-23
CN107107308B (zh) 2020-04-24
WO2016067518A1 (ja) 2016-05-06
TWI633972B (zh) 2018-09-01
KR20170076664A (ko) 2017-07-04
TW201627103A (zh) 2016-08-01
US10414017B2 (en) 2019-09-17

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