CN107107308B - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
CN107107308B
CN107107308B CN201580059114.6A CN201580059114A CN107107308B CN 107107308 B CN107107308 B CN 107107308B CN 201580059114 A CN201580059114 A CN 201580059114A CN 107107308 B CN107107308 B CN 107107308B
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CN
China
Prior art keywords
wafer
polishing
detection sensor
polishing head
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580059114.6A
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English (en)
Chinese (zh)
Other versions
CN107107308A (zh
Inventor
上野淳一
佐藤三千登
石井薫
岸田敬实
金井洋介
中西勇矢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Original Assignee
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp, Shin Etsu Handotai Co Ltd filed Critical Fujikoshi Machinery Corp
Publication of CN107107308A publication Critical patent/CN107107308A/zh
Application granted granted Critical
Publication of CN107107308B publication Critical patent/CN107107308B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201580059114.6A 2014-10-30 2015-09-24 研磨装置 Active CN107107308B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-221600 2014-10-30
JP2014221600A JP6141814B2 (ja) 2014-10-30 2014-10-30 研磨装置
PCT/JP2015/004842 WO2016067518A1 (ja) 2014-10-30 2015-09-24 研磨装置

Publications (2)

Publication Number Publication Date
CN107107308A CN107107308A (zh) 2017-08-29
CN107107308B true CN107107308B (zh) 2020-04-24

Family

ID=55856888

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580059114.6A Active CN107107308B (zh) 2014-10-30 2015-09-24 研磨装置

Country Status (8)

Country Link
US (1) US10414017B2 (enExample)
JP (1) JP6141814B2 (enExample)
KR (1) KR102318648B1 (enExample)
CN (1) CN107107308B (enExample)
DE (1) DE112015004589T5 (enExample)
SG (1) SG11201702302QA (enExample)
TW (1) TWI633972B (enExample)
WO (1) WO2016067518A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
JP7305178B2 (ja) * 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー 研磨装置
JP7406980B2 (ja) * 2019-12-24 2023-12-28 株式会社荏原製作所 研磨ユニット、基板処理装置、および研磨方法
CN111805410A (zh) * 2020-06-01 2020-10-23 长江存储科技有限责任公司 研磨系统
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
CN112692721B (zh) * 2020-12-23 2022-07-05 华虹半导体(无锡)有限公司 Cmp工艺晶圆定位装置和划痕追踪方法
CN113579989B (zh) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 滑片检测装置和抛光系统

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
JP2716653B2 (ja) * 1993-11-01 1998-02-18 不二越機械工業株式会社 ウェーハの研磨装置および研磨方法
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH08247721A (ja) * 1995-03-15 1996-09-27 Omron Corp 寸法測定装置
US20010012108A1 (en) * 1996-07-26 2001-08-09 Paul Holzapfel Methods and apparatus for the in-process measurement of thin film layers
JP3761673B2 (ja) * 1997-06-17 2006-03-29 株式会社荏原製作所 ポリッシング装置
US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
JP2000127033A (ja) * 1998-10-27 2000-05-09 Speedfam-Ipec Co Ltd 研磨装置
JP2001096455A (ja) * 1999-09-28 2001-04-10 Ebara Corp 研磨装置
JP2001133217A (ja) * 1999-11-05 2001-05-18 Keyence Corp 光学式変位計
JP2003059876A (ja) * 2001-08-16 2003-02-28 Ebara Corp 目的物の検知器及び検知方法、及びポリッシング装置
JP2006011434A (ja) * 2002-03-29 2006-01-12 Hoya Corp マスクブランク用基板、マスクブランクおよび転写用マスクの製造方法
DE10314212B4 (de) 2002-03-29 2010-06-02 Hoya Corp. Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske
CN100387396C (zh) * 2004-04-01 2008-05-14 上海宏力半导体制造有限公司 化学机械研磨机台滑片检测方法
JP2008093811A (ja) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
JP5491273B2 (ja) * 2010-05-11 2014-05-14 ダイトエレクトロン株式会社 ウェーハの面取り装置
US9862070B2 (en) * 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
CN103831710B (zh) * 2012-11-27 2017-07-25 盛美半导体设备（上海）有限公司 具有晶圆检测装置的研磨头

Also Published As

Publication number Publication date
KR102318648B1 (ko) 2021-10-28
SG11201702302QA (en) 2017-05-30
US20170304986A1 (en) 2017-10-26
CN107107308A (zh) 2017-08-29
DE112015004589T5 (de) 2017-08-31
JP6141814B2 (ja) 2017-06-07
JP2016087713A (ja) 2016-05-23
WO2016067518A1 (ja) 2016-05-06
TWI633972B (zh) 2018-09-01
KR20170076664A (ko) 2017-07-04
TW201627103A (zh) 2016-08-01
US10414017B2 (en) 2019-09-17

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