KR102295262B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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KR102295262B1
KR102295262B1 KR1020180068090A KR20180068090A KR102295262B1 KR 102295262 B1 KR102295262 B1 KR 102295262B1 KR 1020180068090 A KR1020180068090 A KR 1020180068090A KR 20180068090 A KR20180068090 A KR 20180068090A KR 102295262 B1 KR102295262 B1 KR 102295262B1
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South Korea
Prior art keywords
mold
substrate
imprint material
imprint
pressing
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English (en)
Korean (ko)
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KR20180136903A (ko
Inventor
노리카즈 바바
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020180068090A 2017-06-15 2018-06-14 임프린트 장치 및 물품 제조 방법 Active KR102295262B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017117887A JP6978859B2 (ja) 2017-06-15 2017-06-15 インプリント装置、および物品の製造方法
JPJP-P-2017-117887 2017-06-15

Publications (2)

Publication Number Publication Date
KR20180136903A KR20180136903A (ko) 2018-12-26
KR102295262B1 true KR102295262B1 (ko) 2021-08-31

Family

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KR1020180068090A Active KR102295262B1 (ko) 2017-06-15 2018-06-14 임프린트 장치 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US10831098B2 (enExample)
JP (1) JP6978859B2 (enExample)
KR (1) KR102295262B1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220120579A (ko) * 2019-12-25 2022-08-30 싸이백스 가부시키가이샤 임프린트 장치 및 임프린트 방법
JP7414627B2 (ja) * 2020-04-15 2024-01-16 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP7391806B2 (ja) * 2020-09-16 2023-12-05 キオクシア株式会社 インプリント装置、情報処理装置、及びインプリント方法
US20220197134A1 (en) * 2020-12-23 2022-06-23 Canon Kabushiki Kaisha System and Method of Determining Shaping Parameters Based on Contact Line Motion
US12194671B2 (en) 2021-07-30 2025-01-14 Canon Kabushiki Kaisha Information processing apparatus, molding apparatus, molding method, and article manufacturing method
JP7361831B2 (ja) * 2021-07-30 2023-10-16 キヤノン株式会社 情報処理装置、成形装置、成形方法及び物品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302088A (ja) 2008-06-10 2009-12-24 Bondtech Inc 転写方法および転写装置
JP2010034132A (ja) 2008-07-25 2010-02-12 Bondtech Inc 傾斜調整機構およびこの傾斜調整機構の制御方法
US20150076724A1 (en) * 2013-09-13 2015-03-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, detecting method, and method of manufacturing device
JP2016225542A (ja) 2015-06-02 2016-12-28 キヤノン株式会社 インプリント装置、インプリント方法、および、物品の製造方法
JP2017055115A (ja) 2015-09-08 2017-03-16 キヤノン株式会社 インプリント装置、物品製造方法、レシピ生成装置、レシピを変更する方法およびプログラム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3958344B2 (ja) * 2005-06-07 2007-08-15 キヤノン株式会社 インプリント装置、インプリント方法及びチップの製造方法
JP6385177B2 (ja) 2014-07-16 2018-09-05 キヤノン株式会社 モールド、インプリント装置および物品製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009302088A (ja) 2008-06-10 2009-12-24 Bondtech Inc 転写方法および転写装置
JP2010034132A (ja) 2008-07-25 2010-02-12 Bondtech Inc 傾斜調整機構およびこの傾斜調整機構の制御方法
US20150076724A1 (en) * 2013-09-13 2015-03-19 Canon Kabushiki Kaisha Imprint apparatus, imprint method, detecting method, and method of manufacturing device
JP2015056589A (ja) 2013-09-13 2015-03-23 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP2016225542A (ja) 2015-06-02 2016-12-28 キヤノン株式会社 インプリント装置、インプリント方法、および、物品の製造方法
JP2017055115A (ja) 2015-09-08 2017-03-16 キヤノン株式会社 インプリント装置、物品製造方法、レシピ生成装置、レシピを変更する方法およびプログラム

Also Published As

Publication number Publication date
KR20180136903A (ko) 2018-12-26
US10831098B2 (en) 2020-11-10
US20180364565A1 (en) 2018-12-20
JP6978859B2 (ja) 2021-12-08
JP2019004055A (ja) 2019-01-10

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