KR102293762B1 - 반도체 장치 검사용 소켓 - Google Patents

반도체 장치 검사용 소켓 Download PDF

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Publication number
KR102293762B1
KR102293762B1 KR1020170055038A KR20170055038A KR102293762B1 KR 102293762 B1 KR102293762 B1 KR 102293762B1 KR 1020170055038 A KR1020170055038 A KR 1020170055038A KR 20170055038 A KR20170055038 A KR 20170055038A KR 102293762 B1 KR102293762 B1 KR 102293762B1
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KR
South Korea
Prior art keywords
contact pin
socket
semiconductor package
contact
base
Prior art date
Application number
KR1020170055038A
Other languages
English (en)
Korean (ko)
Other versions
KR20180121717A (ko
Inventor
박관기
Original Assignee
아주야마이찌전기공업(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아주야마이찌전기공업(주) filed Critical 아주야마이찌전기공업(주)
Priority to KR1020170055038A priority Critical patent/KR102293762B1/ko
Priority to PCT/KR2017/009944 priority patent/WO2018199403A1/fr
Priority to TW110125105A priority patent/TWI766753B/zh
Priority to TW106132608A priority patent/TWI752087B/zh
Publication of KR20180121717A publication Critical patent/KR20180121717A/ko
Application granted granted Critical
Publication of KR102293762B1 publication Critical patent/KR102293762B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020170055038A 2017-04-28 2017-04-28 반도체 장치 검사용 소켓 KR102293762B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020170055038A KR102293762B1 (ko) 2017-04-28 2017-04-28 반도체 장치 검사용 소켓
PCT/KR2017/009944 WO2018199403A1 (fr) 2017-04-28 2017-09-11 Douille de test de dispositifs à semi-conducteur
TW110125105A TWI766753B (zh) 2017-04-28 2017-09-22 半導體裝置檢查用插座
TW106132608A TWI752087B (zh) 2017-04-28 2017-09-22 半導體裝置檢查用插座

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170055038A KR102293762B1 (ko) 2017-04-28 2017-04-28 반도체 장치 검사용 소켓

Publications (2)

Publication Number Publication Date
KR20180121717A KR20180121717A (ko) 2018-11-08
KR102293762B1 true KR102293762B1 (ko) 2021-08-25

Family

ID=63918413

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170055038A KR102293762B1 (ko) 2017-04-28 2017-04-28 반도체 장치 검사용 소켓

Country Status (3)

Country Link
KR (1) KR102293762B1 (fr)
TW (2) TWI752087B (fr)
WO (1) WO2018199403A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102088204B1 (ko) * 2019-08-22 2020-03-16 주식회사 프로이천 핀 보드
CN112992599B (zh) * 2019-12-13 2023-02-17 天津平高智能电气有限公司 真空灭弧室真空度测量装置
KR102673342B1 (ko) 2021-10-26 2024-06-10 (주)마이크로컨텍솔루션 반도체 칩 테스트 소켓
KR102641973B1 (ko) * 2023-03-31 2024-02-29 보이드코리아유한회사 컨텍트핀안전정렬삽입부가 적용된 반도체 패키지 검사용 소켓 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086318A (ja) * 2001-09-11 2003-03-20 Enplas Corp 電気部品用ソケット
JP2003163064A (ja) * 2001-11-27 2003-06-06 Yamaichi Electronics Co Ltd Ｉｃソケット
JP2004139939A (ja) * 2002-10-21 2004-05-13 Texas Instr Japan Ltd 半導体装置用ソケットおよび半導体装置のソケットへの着脱方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746710B2 (ja) * 2001-12-12 2006-02-15 株式会社エンプラス 電気部品用ソケット
JP3716843B2 (ja) * 2003-07-15 2005-11-16 株式会社エンプラス 電気部品用ソケット
KR101246105B1 (ko) * 2011-07-07 2013-03-20 주식회사 오킨스전자 반도체 패키지 테스트용 소켓
US20160178663A1 (en) * 2014-12-23 2016-06-23 Intel Corporation Formed wire probe interconnect for test die contactor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003086318A (ja) * 2001-09-11 2003-03-20 Enplas Corp 電気部品用ソケット
JP2003163064A (ja) * 2001-11-27 2003-06-06 Yamaichi Electronics Co Ltd Ｉｃソケット
JP2004139939A (ja) * 2002-10-21 2004-05-13 Texas Instr Japan Ltd 半導体装置用ソケットおよび半導体装置のソケットへの着脱方法

Also Published As

Publication number Publication date
TWI752087B (zh) 2022-01-11
TW202138828A (zh) 2021-10-16
KR20180121717A (ko) 2018-11-08
TWI766753B (zh) 2022-06-01
WO2018199403A1 (fr) 2018-11-01
TW201839416A (zh) 2018-11-01

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