KR102259427B1 - 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

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Publication number
KR102259427B1
KR102259427B1 KR1020190126478A KR20190126478A KR102259427B1 KR 102259427 B1 KR102259427 B1 KR 102259427B1 KR 1020190126478 A KR1020190126478 A KR 1020190126478A KR 20190126478 A KR20190126478 A KR 20190126478A KR 102259427 B1 KR102259427 B1 KR 102259427B1
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South Korea
Prior art keywords
die
release film
resin
molding
pressing member
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KR1020190126478A
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English (en)
Korean (ko)
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KR20200062023A (ko
Inventor
타케아키 타카
코스케 아라키
Original Assignee
토와 가부시기가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C2043/3272—Component parts, details or accessories; Auxiliary operations driving means
    • B29C2043/3283—Component parts, details or accessories; Auxiliary operations driving means for moving moulds or mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/40—Engine management systems

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020190126478A 2018-11-26 2019-10-11 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 Active KR102259427B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018220061A JP7018377B2 (ja) 2018-11-26 2018-11-26 成形型、樹脂成形装置、樹脂成形品の製造方法
JPJP-P-2018-220061 2018-11-26

Publications (2)

Publication Number Publication Date
KR20200062023A KR20200062023A (ko) 2020-06-03
KR102259427B1 true KR102259427B1 (ko) 2021-05-31

Family

ID=70830539

Family Applications (1)

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KR1020190126478A Active KR102259427B1 (ko) 2018-11-26 2019-10-11 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (4)

Country Link
JP (1) JP7018377B2 (https=)
KR (1) KR102259427B1 (https=)
CN (1) CN111216301B (https=)
TW (1) TW202019657A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7530769B2 (ja) * 2020-08-25 2024-08-08 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP2023113996A (ja) * 2022-02-04 2023-08-17 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2024014193A (ja) * 2022-07-22 2024-02-01 アピックヤマダ株式会社 樹脂封止装置
JP2025181470A (ja) * 2024-05-31 2025-12-11 Ｔｏｗａ株式会社 上型、樹脂成形装置、及び樹脂成形品の製造方法
TWI900294B (zh) * 2024-10-18 2025-10-01 中國大陸商無錫艾方芯動自動化設備有限公司 一種操作窗結構

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016112721A (ja) 2014-12-11 2016-06-23 Ｔｏｗａ株式会社 離型フィルムセット装置及び方法、並びに該装置を備えた樹脂封止用圧縮成形装置

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Publication number Priority date Publication date Assignee Title
US6132669A (en) * 1997-08-14 2000-10-17 The Elizabeth And Sandor Valyi Foundation, Inc. Process for preparing a molded article
JP2000299334A (ja) 1999-04-14 2000-10-24 Apic Yamada Corp 樹脂封止装置
JP4268389B2 (ja) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5121238B2 (ja) * 2007-01-29 2013-01-16 住友重機械工業株式会社 樹脂封止方法
JP5409549B2 (ja) * 2010-08-23 2014-02-05 住友重機械工業株式会社 圧縮成形用金型及び圧縮成形方法
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
US20130337614A1 (en) * 2012-06-14 2013-12-19 Infineon Technologies Ag Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatus
TWI565105B (zh) * 2012-07-09 2017-01-01 山田尖端科技股份有限公司 樹脂模塑裝置以及樹脂模塑方法
JP6346474B2 (ja) * 2014-03-17 2018-06-20 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド金型
JP6456254B2 (ja) * 2015-06-16 2019-01-23 アピックヤマダ株式会社 フィルム搬送装置及びフィルム搬送方法並びに樹脂モールド装置
JP6827283B2 (ja) * 2016-08-03 2021-02-10 Ｔｏｗａ株式会社 成形型、樹脂成形装置及び樹脂成形品の製造方法
JP6349376B2 (ja) * 2016-12-07 2018-06-27 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、並びに圧縮成形装置及び樹脂成形品製造方法
JP6723185B2 (ja) * 2017-03-29 2020-07-15 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016112721A (ja) 2014-12-11 2016-06-23 Ｔｏｗａ株式会社 離型フィルムセット装置及び方法、並びに該装置を備えた樹脂封止用圧縮成形装置

Also Published As

Publication number Publication date
JP2020082509A (ja) 2020-06-04
TW202019657A (zh) 2020-06-01
KR20200062023A (ko) 2020-06-03
CN111216301B (zh) 2022-04-01
CN111216301A (zh) 2020-06-02
JP7018377B2 (ja) 2022-02-10

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