KR102246419B1 - 전기 인터페이스 - Google Patents

전기 인터페이스 Download PDF

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Publication number
KR102246419B1
KR102246419B1 KR1020177008336A KR20177008336A KR102246419B1 KR 102246419 B1 KR102246419 B1 KR 102246419B1 KR 1020177008336 A KR1020177008336 A KR 1020177008336A KR 20177008336 A KR20177008336 A KR 20177008336A KR 102246419 B1 KR102246419 B1 KR 102246419B1
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KR
South Korea
Prior art keywords
connection
plane
electrical
contact surface
connection plane
Prior art date
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Active
Application number
KR1020177008336A
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English (en)
Korean (ko)
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KR20170082504A (ko
Inventor
산딥 산카라라만
Original Assignee
로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게
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Application filed by 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게 filed Critical 로젠버거 호흐프리쿠벤츠테흐닉 게엠베하 운트 코. 카게
Publication of KR20170082504A publication Critical patent/KR20170082504A/ko
Application granted granted Critical
Publication of KR102246419B1 publication Critical patent/KR102246419B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/526—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures the printed circuits being on the same board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020177008336A 2014-11-06 2015-11-03 전기 인터페이스 Active KR102246419B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202014008844.6 2014-11-06
DE202014008844.6U DE202014008844U1 (de) 2014-11-06 2014-11-06 Elektrisches Interface
PCT/EP2015/002212 WO2016070992A1 (de) 2014-11-06 2015-11-03 Elektrisches interface

Publications (2)

Publication Number Publication Date
KR20170082504A KR20170082504A (ko) 2017-07-14
KR102246419B1 true KR102246419B1 (ko) 2021-05-03

Family

ID=52017724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177008336A Active KR102246419B1 (ko) 2014-11-06 2015-11-03 전기 인터페이스

Country Status (9)

Country Link
US (1) US10230183B2 (https=)
EP (1) EP3216089B1 (https=)
JP (1) JP6559790B2 (https=)
KR (1) KR102246419B1 (https=)
CN (1) CN107078423B (https=)
CA (1) CA2963290A1 (https=)
DE (1) DE202014008844U1 (https=)
TW (1) TWM525567U (https=)
WO (1) WO2016070992A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202014008844U1 (de) * 2014-11-06 2014-11-24 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Interface
DE202014009499U1 (de) 2014-11-28 2015-01-16 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Winkelverbinder zur differentiellen Übertragung von Datensignalen
KR20230031546A (ko) 2021-08-27 2023-03-07 삼성전자주식회사 반도체 모듈용 모듈 기판 및 반도체 메모리 모듈

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258390A (ja) 2009-04-28 2010-11-11 Kyocer Slc Technologies Corp 配線基板
US20120243184A1 (en) 2011-03-23 2012-09-27 Via Technologies, Inc. Differential signal pair transmission structure, wiring board and electronic module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843657B2 (en) * 2001-01-12 2005-01-18 Litton Systems Inc. High speed, high density interconnect system for differential and single-ended transmission applications
AU2003263799A1 (en) * 2002-07-24 2004-02-09 Litton Systems, Inc. Interconnection system
SG120200A1 (en) 2004-08-27 2006-03-28 Micron Technology Inc Slanted vias for electrical circuits on circuit boards and other substrates
TWI294682B (en) * 2006-02-03 2008-03-11 Siliconware Precision Industries Co Ltd Semiconductor package substrate
WO2008105478A1 (ja) * 2007-02-27 2008-09-04 Kyocera Corporation 配線基板、電気信号伝送システムおよび電子機器
WO2009119849A1 (ja) * 2008-03-28 2009-10-01 京セラ株式会社 複合配線基板
US7850492B1 (en) 2009-11-03 2010-12-14 Panduit Corp. Communication connector with improved crosstalk compensation
CN102117993B (zh) * 2009-12-30 2013-05-08 富士康(昆山)电脑接插件有限公司 电连接器
JP5595289B2 (ja) * 2011-01-06 2014-09-24 富士通コンポーネント株式会社 コネクタ
US8920199B2 (en) * 2012-02-13 2014-12-30 Commscope, Inc. Of North Carolina Patch cord having a plug with differential transmission lines
TW201345209A (zh) * 2012-04-17 2013-11-01 Hon Hai Prec Ind Co Ltd 等化器
DE202014008844U1 (de) * 2014-11-06 2014-11-24 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Interface
DE202014009499U1 (de) 2014-11-28 2015-01-16 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Winkelverbinder zur differentiellen Übertragung von Datensignalen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258390A (ja) 2009-04-28 2010-11-11 Kyocer Slc Technologies Corp 配線基板
US20120243184A1 (en) 2011-03-23 2012-09-27 Via Technologies, Inc. Differential signal pair transmission structure, wiring board and electronic module

Also Published As

Publication number Publication date
EP3216089A1 (de) 2017-09-13
DE202014008844U1 (de) 2014-11-24
US20170317438A1 (en) 2017-11-02
CN107078423B (zh) 2019-04-16
CN107078423A (zh) 2017-08-18
US10230183B2 (en) 2019-03-12
CA2963290A1 (en) 2016-05-12
JP6559790B2 (ja) 2019-08-14
WO2016070992A1 (de) 2016-05-12
EP3216089B1 (de) 2019-02-13
JP2017539068A (ja) 2017-12-28
KR20170082504A (ko) 2017-07-14
TWM525567U (zh) 2016-07-11

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