KR102244950B1 - An Apparatus for Inspecting a Life Time of a Emitting Element with a 3-Dimensional Arrangement Structure of Test Jig and a Method for Inspecting the Same Using thereof - Google Patents

Abstract

The present invention relates to an optical device durability inspection apparatus having a three-dimensional array inspection jig structure and a method for inspecting optical device durability therefrom, and specifically, a three-dimensional array inspection jig for continuously inspecting an optical element accommodated in a three-dimensionally arranged inspection jig. It relates to an optical device durability test apparatus and an optical device durability test method thereof. The optical device durability inspection apparatus having a three-dimensional array inspection jig structure includes a jig magazine 20 in which a plurality of inspection trays 22_1 to 22_N are accommodated; And an inspection robot 10 disposed above the jig magazine 20, wherein each of the inspection trays 22_1 to 22_N is accommodated in a structure to be received and discharged from the jig magazine 20, and the inspection robot ( 10) has a sensor unit 11 movable in the XYZ axis direction.

Description

An Apparatus for Inspecting a Life Time of a Emitting Element with a 3-Dimensional Arrangement Structure of Test Jig and a Method for Inspecting the Same Using thereof}

The present invention relates to an optical device durability inspection apparatus having a three-dimensional array inspection jig structure and a method for inspecting optical device durability therefrom, and specifically, a three-dimensional array inspection jig for continuously inspecting an optical element accommodated in a three-dimensionally arranged inspection jig. It relates to an optical device durability test apparatus and an optical device durability test method thereof.

Optical devices such as LEDs, organic light-emitting diodes (OLEDs), laser diodes (LD), or photodiodes (PD) are optical properties such as aging properties, durability, or luminance during development, production, or manufacturing. Needs to be tested. For such optical device inspection, in general, an optical device chip or module may be fixed to an inspection jig, and the optical device chip or module fixed to each inspection jig needs to be inspected while the inspection device is moved. For inspection efficiency, it is advantageous that a plurality of optical device chips are fixed to a plurality of inspection jigs in advance and successively performed by an inspection unit. Various inspection devices for inspecting optical devices are known in the art.

Patent Publication No. 10-2013-0019792 performs a life test of OLED using a Peltier element, but the Peltier element is mounted on a heating plate assembly, and the heating plate assembly is equipped with the Peltier element and faces the OLED. And a heat sink installed on the thermoelectric plate, and a cooling fan attached to the heat sink, and a plurality of Peltier elements are mounted on the thermoelectric plate, and an interval between the plurality of Peltier elements is 0 to 70 mm, the thermoelectric plate has a seating groove in which a Peltier element is installed, a plurality of heating plate assemblies are installed in a horizontal and vertical direction, and a distance between the plurality of heating plate assemblies is 0 to 200 mm, and the thermoelectric plate Disclosed is an OLED life prediction test apparatus, characterized in that an insertion groove into which a heat sink is inserted is formed in the plate.

Patent Registration No. 10-1547921 relates to a work stage on which a work table is mounted so that the rear surface of an organic electroluminescent display type panel faces upward; A plurality of probe units contacting a pad portion formed on a front surface of the panel accommodated in the work table to perform inspection on the panel; A probe stage for moving the probe unit in a Z-axis direction so that the probe unit may contact or release contact with the pad unit; A pressing jig for restricting upward movement of the panel by contacting an upper edge of the panel corresponding to a portion in which the probe unit and the pad part contact; A jig stage for moving the pressing jig in the Z-axis direction so that the pressing jig can contact or release contact with the upper edge portion; And a base portion on which the work stage, the probe stage, and the jig stage are mounted.

When a plurality of optical device chips are inspected, an inspection structure is required to enable continuous inspection. However, the prior art does not disclose an inspection structure in which each optical device chip fixed to a plurality of inspection jigs arranged on a jig tray can be continuously inspected.

The present invention has the following objects to solve the problems of the prior art.

Prior Art 1: Patent Publication No. 10-2013-0019792 (Kumo Institute of Technology Industry-Academic Cooperation Foundation, published on February 27, 2013) OLED lifetime prediction test device Prior Art 2: Patent Registration No. 10-1547921 (Lukeen Technologies Inc., published on November 3, 2014) Auto probe inspection device and organic electroluminescent display type panel inspection method using the same

It is an object of the present invention to provide an optical device durability test apparatus having a three-dimensional array inspection jig structure that enables a plurality of optical devices to be continuously inspected and reliability of the test result, and a method for testing optical device durability therefrom. will be.

According to a preferred embodiment of the present invention, an optical device durability inspection apparatus having a three-dimensional array inspection jig structure includes: a jig magazine in which a plurality of inspection trays are accommodated; And an inspection robot disposed above the jig magazine, wherein each inspection tray is accommodated in a structure to be received and discharged from the jig magazine, and the inspection robot has a sensor unit movable in the XYZ axis direction.

According to another suitable embodiment of the present invention, temperature conditions of each inspection tray are set in the jig magazine.

According to another preferred embodiment of the present invention, a method for inspecting optical device durability using a three-dimensional array inspection jig structure includes the steps of arranging a plurality of trays in a magazine in a matrix structure; Setting one direction in which the respective trays are discharged and received; Setting coordinates of each of the trays and coordinates of an inspection jig disposed on each of the trays at the discharging and receiving positions; Setting storage conditions of the respective trays in the magazine; Disposing an inspection robot having a sensor unit for inspection of an optical device chip fixed to the inspection jig; Discharging one of the plurality of trays; Checking coordinates of the discharged tray and the inspection jig disposed on the discharged tray by a control unit; Inspecting the respective inspection jig by moving the sensor unit; And transmitting the inspection information to the control unit and receiving the discharged tray, wherein the tray is moved in the X-axis direction, and the inspection robot is disposed to be movable along the XYZ axis.

The inspection apparatus according to the present invention allows a plurality of optical elements to be continuously inspected while an optical element array is formed in a three-dimensional matrix structure, thereby improving inspection efficiency and productivity. In addition, the inspection apparatus according to the present invention improves inspection efficiency by maintaining the optical element in a predetermined condition. In addition, the inspection apparatus according to the present invention is suitable for durability inspection requiring a long period of inspection for a plurality of inspection modules.

1 schematically shows an embodiment of an inspection apparatus according to the present invention.
2 shows an embodiment of a process in which an optical device is inspected in the inspection apparatus according to the present invention.
3 shows an embodiment of an inspection jig applied to the inspection apparatus according to the present invention.
4A and 4B illustrate an embodiment of an inspection method according to the present invention.

In the following, the present invention will be described in detail with reference to the embodiments shown in the accompanying drawings, but the embodiments are for a clear understanding of the present invention, and the present invention is not limited thereto. In the following description, components having the same reference numerals in different drawings have similar functions, so if they are not necessary for the understanding of the invention, they will not be described repeatedly, and well-known components will be briefly described or omitted, but the present invention It should not be understood as being excluded from the embodiment of.

1 schematically shows an embodiment of an inspection apparatus according to the present invention.

Referring to FIG. 1, the inspection apparatus includes a jig magazine 20 in which a plurality of inspection trays 22_1 to 22_N are accommodated; And an inspection robot 10 disposed above the jig magazine 20, wherein each of the inspection trays 22_1 to 22_N is accommodated in a structure to be received and discharged from the jig magazine 20, and the inspection robot ( 10) includes a sensor unit 11 movable in the XYZ-axis direction.

The inspection apparatus according to the present invention can be applied to any optical device characteristic test including an optical device such as an LED (LED), an organic light emitting diode (OLED), a laser diode (LD) or a photodiode (PD). In addition, the inspection apparatus according to the present invention may perform any tests related to an optical device, including a durability test, an aging test, an electrical property test, and an optical property test. Each test can be suitably conducted according to a method known in the art or according to the structure of the inspection apparatus according to the present invention. In the inspection apparatus according to the present invention, a sample may be prepared, for example, for testing an organic light-emitting device. In addition, it is possible to evaluate the lifespan by measuring changes in electrical and optical characteristics in real time while continuously deteriorating by supplying power to the prepared samples. In the inspection apparatus according to the present invention, setting conditions for inspection, the structure of a sensor unit, or processing of inspection data can be made according to methods known in the art, and the present invention is not limited thereto.

The jig magazine 20 may have a box shape and may include a box-shaped magazine frame 21. The magazine frame 21 may be divided into units of a matrix structure, and the inspection trays 22_1 to 22_N may be disposed in each unit in a structure capable of receiving or discharging. By forming the jig magazine 20 in a matrix structure, setting of coordinates along the XYZ axis is simplified. Each unit may have the same size or may be made in different sizes. In addition, each of the inspection trays 22_1 to 22_N with respect to the magazine frame 21 is disposed to be movable in one direction. Specifically, it is disposed to move in a direction perpendicular to the arrangement direction of the units, and each of the test trays 22_1 to 22_N may be discharged or received in a sliding manner. If necessary, the moving handle 211 may be formed on the test trays 22_1 to 22_N.

The inspection robot 10 may be disposed so as to be movable from the upper end to the lower end of the jig magazine 20 and movable from the left end to the right end of the jig magazine 20. The inspection robot 10 may include a sensor unit 11 for inspecting an optical device chip and a movement guide G for moving the sensor unit 11. The sensor unit 11 may have a structure that is coupled to the moving guide G by a moving bracket 13 to move along a moving direction of the inspection trays 22_1 to 22_N and a direction perpendicular thereto. The inspection robot 10 may be coupled to the sensor unit 11 and the sensor unit 11 to check the position of an optical element or include an image optical system 14 for image processing.

Each of the test trays 22_1 to 22_N may be disposed to be received and discharged along the Y-axis direction, for example, and the sensor unit 11 includes a moving guide G disposed along the X, Y, or Z axis directions. Can be moved along. In addition, when the inspection trays 22_1 to 22_N to be inspected are discharged from the jig magazine 20, the optical elements fixed to each inspection jig can be inspected. The inspection may be, for example, such as luminance, and may be detected by the sensor unit 11. When the inspection of all the inspection jigs disposed on the discharged inspection trays 22_1 to 22_N is completed, other inspection trays 22_1 to 22_N may be inspected.

In the inspection apparatus according to the present invention, the inspection robot 10 may include, for example, a sensor unit 11 capable of measuring luminance, and may be applied to detection of changes in brightness or luminance over a long period of time or detection of durability. However, the sensor unit 11 may include various optical characteristic detection units.

As described above, the inspection robot 10 has a structure capable of inspecting the entire inspection jig accommodated in the jig magazine 20 while being moved along the XYZ axis.

2 shows an embodiment of a process in which an optical device is inspected in the inspection apparatus according to the present invention.

Referring to FIG. 2A, one inspection tray 22_K may be discharged from the jig magazine 20 for inspection. A plurality of inspection jigs 24 may be disposed on the inspection tray 22_K, and the inspection robot 10 performs optical device characteristics such as luminance inspection for each inspection jig 24 disposed on the inspection tray 22_K. Can be inspected.

The sensor unit 11 may be moved along the movement guides X, Y, and Z arranged along the X, Y, and Z axes described above, and may be positioned at the test start point of the test tray 22_K. 1 The movement guide X may be disposed above the jig magazine 20 along the length direction. In addition, one moving bracket 131 may be disposed to be movable along the first moving guide X, and the two moving brackets 132 may be coupled to the first moving bracket 131. And the two moving brackets 132 may be moved along the two moving guides (Y). Thereafter, the inspection robot 10 may be coupled to the three moving brackets 133 arranged to be movable along the three moving guides Z and moved along the Z-axis direction to be disposed above the predetermined inspection jig 24. And, if necessary, the position of the inspection housing 12 or the sensor unit 11 may be precisely adjusted along the Z-axis direction by the cylinder unit. The sensor unit 11 is positioned above the inspection jig 24 to inspect the luminance of the optical element disposed on the inspection jig 24. In order to check the position between the sensor unit 11 and the inspection jig 24, a near-field detection unit such as an ultrasonic sensor may be disposed in the inspection housing 12 or the sensor unit 11.

According to the method presented above, the sensor unit 11 may be moved and positioned on the first inspection jig 24. And when the inspection of the first inspection jig 24 is completed, it is moved along the 1 moving guide (X) or the 2 moving guide (Y), so that the second inspection jig 24 is inspected and inspection data can be obtained. have. When the inspection of all the inspection jigs 24 arranged on the inspection tray 22_K is completed in this way, the inspection tray 22_K may be accommodated in the jig magazine 20. In addition, the other inspection tray 22_L is discharged, and the sensor unit 11 is moved along the 1 or 2 movement guide to inspect the inspection jig 24 disposed on the other inspection tray 22_L. In this way, the inspection of all the inspection trays 22_1 to 22_N accommodated in the jig magazine 20 may be completed.

The movement guides X, Y, and Z may be arranged in various ways to move the sensor unit 11 to a predetermined position. As shown in (B) of FIG. 2, the moving bracket 13 may be disposed to be movable on the two moving guides Y. One movement guide (X) extending along the X-axis direction for the XYZ axis movement of the sensor unit 11; 2 movement guides Y arranged to be movable along the 1 movement guide X and 3 movement guides Z that move the 1 movement guide X along the Z-axis direction may be arranged. The 1, 2 and 3 moving guides (X, Y, Z) may be made of a rail structure, a sliding structure, or a conveying belt structure, but are not limited thereto and may be made of any structure known in the art. As described above, the XYZ axis movement of the inspection robot 10 according to the present invention may be performed in various ways, and the present invention is not limited to the presented embodiment.

The inspection apparatus according to the present invention is suitable for inspection that takes a long time for durability inspection such as luminance characteristics over time of an optical device, but is not limited thereto. Each optical device chip accommodated in the jig magazine 20 may be inspected at regular intervals, and the jig magazine 20 may include a condition setting unit. For example, the jig magazine 20 may set temperature, humidity, or air atmosphere for each of the test trays 22_1 to 22_N. In addition, each of the inspection trays 22_1 to 22_N may be stored under suitable conditions for inspection.

Hereinafter, an embodiment of an inspection jig disposed on each of the inspection trays 22_1 to 22_L will be described.

3 shows an embodiment of an inspection jig 24 applied to the inspection apparatus according to the present invention.

Referring to FIG. 3, the inspection jig 24 includes a lower jig 241 on which an optical device chip 30 is disposed; And an upper jig 242 in contact with the lower jig 241. In addition, the optical device chip 30 may be disposed inside the inspection jig 24. The optical device chip includes, for example, a base layer 31 on which an optical device 33 such as an organic light emitting device is disposed; And a wiring pattern 32 connecting the optical device 33 to an electrode disposed on the inspection jig 24.

When the optical device chip 30 is accommodated in the inspection jig 24 and power is supplied to the inspection jig 24 while the inspection jig 24 is closed, the optical device chip 30 may emit light. In addition, the inspection jig 24 in which the optical device chip 30 is accommodated may be disposed on the inspection tray and accommodated in the jig magazine. In addition, for periodic luminance inspection, the inspection tray is discharged to the jig magazine by an appropriate driving device, and luminance inspection of the optical device chip in the light emitting state can be performed.

The inspection jig 24 may be arranged in a two-dimensional matrix structure on each inspection tray. With respect to the inspection jig 24 arranged in this way, the inspection robot may inspect each inspection jig 24 while moving in the XYZ three-dimensional direction. The inspection tray that has been inspected is loaded into the inspection magazine through the driving device, and when the inspection trays that need to be inspected are discharged through the respective driving devices, the sensor unit moves in the XYZ direction and starts to inspect the optical elements of the inspection tray. .

The inspection jig 24 may be inspected by the inspection robot in various ways, and the present invention is not limited to the presented embodiments.

4A and 4B illustrate an embodiment of an inspection method according to the present invention.

Referring to FIG. 4A, the inspection method according to the present invention includes the steps of arranging a plurality of trays in a magazine in a matrix structure (P41); Setting one direction in which the respective trays are discharged and received (P42); Setting the coordinates of the respective trays and the coordinates of the inspection jig disposed on each of the trays at the discharging and receiving positions (P43); Setting storage conditions of the respective trays in the magazine (P44); Disposing an inspection robot having a sensor unit for inspection of the optical device chip fixed to the inspection jig (P45); Discharging one of the plurality of trays (P46); Checking coordinates of the discharged tray and the inspection jig disposed on the discharged tray by a control unit (P47); The step (48) of inspecting each of the inspection jig by moving the sensor unit; And a step (P49) of transmitting inspection information to the control unit and receiving the discharged tray, wherein the tray is moved in the X-axis direction, and the inspection robot is disposed to be movable along the XYZ axis.

The inspection method according to the present invention can be performed continuously by an automatic process. The entire operating process can be controlled by the control unit 41. The plurality of inspection trays 22 may be disposed to be accommodated or discharged in a box-shaped jig magazine (P41). In addition, in order to set the moving coordinates of the sensor unit installed in the inspection robot 10, the moving direction of each inspection tray may be determined (P42). When the moving direction of the inspection tray 22 is determined, coordinates for each inspection tray 22 and the inspection jig disposed on the inspection tray 22 may be set by the coordinate setting unit 43 (P43). The inspection coordinates may be 3-axis coordinates along the XYZ axis. Storage conditions for each inspection tray 22 arranged in the jig magazine may be set by the condition setting unit 45 (P44). The test conditions may include, for example, temperature, humidity, or air atmosphere conditions, and may be set independently for each test tray 22 or for the entire jig magazine. In this way, a storage condition is set so that the inspection jig disposed on each inspection tray 22 may be inspected at regular intervals while the inspection tray 22 is stored in the jig magazine. A sensor unit may be disposed (P45), and the control unit 41 may transmit inspection coordinates to the operation setting unit 42. The operation setting unit 42 may control the movement of the sensor unit according to the transmitted coordinates. In order to move the sensor unit, the position of the sensor unit may be detected by the position sensor 47. In addition, whether or not the inspection tray 22 is received or discharged may be confirmed by the status sensor 46. The status sensor 46 may also have a function of detecting the storage status of each inspection tray 22.

When one inspection tray 22 is discharged for inspection (P46), the inspection robot 10 is moved to the inspection position so that each inspection jig can be inspected (P48). In addition, when the inspection data is transmitted to the control unit 41 and the inspection is completed, the inspection tray 22 may be accommodated in the jig magazine again (P49). During the inspection process, the position of the inspection tray 22 and the position of the inspection jig may be confirmed by the position sensor 47, and the operation setting unit 42 may move the sensor unit according to a predetermined processor.

The inspection method may be performed in various ways, and the present invention is not limited to the presented embodiments.

The inspection apparatus according to the present invention allows a plurality of optical elements to be continuously inspected, while an array of optical elements is arranged in a three-dimensional matrix structure, thereby improving inspection efficiency. In addition, the inspection apparatus according to the present invention improves inspection efficiency while improving inspection efficiency by maintaining the optical element in a predetermined condition. In addition, the inspection apparatus according to the present invention is suitable for durability inspection requiring a long period of inspection for a plurality of inspection modules.

The present invention has been described in detail above with reference to the presented embodiments, but those of ordinary skill in this field will be able to make various modifications and modifications without departing from the technical spirit of the present invention with reference to the presented embodiments. . The present invention is not limited by such modifications and modifications, but is limited by the claims appended below.

10: inspection robot 11: sensor unit
12: inspection housing 13: moving bracket
14: image optical system 20: jig magazine
21: magazine frames 22_1 to 22_N: inspection tray
24: inspection jig 30: optical device chip
31: base layer 32: wiring pattern
33: optical element 41: control unit
42: operation setting unit 43: coordinate setting unit
45: condition setting unit 46: status sensor
47: position sensor 131: 1 moving bracket
132: 2 moving bracket 133: 3 moving bracket
211: moving handle 241: lower jig
242: upper jig G: moving guide
X: 1 moving guide Y: 2 moving guide
Z: 3 moving guide

Claims (2)

A jig magazine 20 in which a plurality of inspection trays 22_1 to 22_N are accommodated in a matrix structure; And
Including; an inspection robot 10 disposed above the jig magazine 20,
The jig magazine 20 includes a box-shaped magazine frame 21 divided into units of a matrix structure in which a plurality of inspection trays 22_1 to 22_N can be stored or discharged, respectively, and a plurality of inspection trays 22_1 to 22_N Is arranged to move in the Y-axis direction, which is a direction perpendicular to the arrangement direction of the units,
The inspection robot 10 has a sensor unit 11 that is movable in the XYZ axis direction, and a temperature condition for each inspection tray 22_1 to 22_N is set in the jig magazine 20. 3D array inspection Optical device durability inspection device with jig structure.
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