KR102244352B1 - 기판 반송 기구, 기판 처리 장치 및 기판 반송 방법 - Google Patents

기판 반송 기구, 기판 처리 장치 및 기판 반송 방법 Download PDF

Info

Publication number
KR102244352B1
KR102244352B1 KR1020190106633A KR20190106633A KR102244352B1 KR 102244352 B1 KR102244352 B1 KR 102244352B1 KR 1020190106633 A KR1020190106633 A KR 1020190106633A KR 20190106633 A KR20190106633 A KR 20190106633A KR 102244352 B1 KR102244352 B1 KR 102244352B1
Authority
KR
South Korea
Prior art keywords
arm
substrate
rotation shaft
support region
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020190106633A
Other languages
English (en)
Korean (ko)
Other versions
KR20200026138A (ko
Inventor
다카미 후카사와
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20200026138A publication Critical patent/KR20200026138A/ko
Application granted granted Critical
Publication of KR102244352B1 publication Critical patent/KR102244352B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H01L21/67742—
    • H01L21/67196—
    • H01L21/67201—
    • H01L21/67754—
    • H01L21/67766—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR1020190106633A 2018-08-31 2019-08-29 기판 반송 기구, 기판 처리 장치 및 기판 반송 방법 Active KR102244352B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-163103 2018-08-31
JP2018163103A JP7183635B2 (ja) 2018-08-31 2018-08-31 基板搬送機構、基板処理装置及び基板搬送方法

Publications (2)

Publication Number Publication Date
KR20200026138A KR20200026138A (ko) 2020-03-10
KR102244352B1 true KR102244352B1 (ko) 2021-04-23

Family

ID=69639975

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190106633A Active KR102244352B1 (ko) 2018-08-31 2019-08-29 기판 반송 기구, 기판 처리 장치 및 기판 반송 방법

Country Status (3)

Country Link
US (1) US10872798B2 (https=)
JP (1) JP7183635B2 (https=)
KR (1) KR102244352B1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023043088A1 (ko) * 2021-09-16 2023-03-23 주식회사 나인벨 기판 교체시간이 단축된 반도체 기판 처리장치

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7225613B2 (ja) * 2018-09-03 2023-02-21 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
KR102833850B1 (ko) * 2020-03-24 2025-07-14 주식회사 원익아이피에스 이송로봇 및 이를 포함하는 기판처리시스템
US12283508B2 (en) * 2020-04-07 2025-04-22 Kawasaki Jukogyo Kabushiki Kaisha In-vacuum twin-arm robot
US11358809B1 (en) * 2021-03-01 2022-06-14 Applied Materials, Inc. Vacuum robot apparatus for variable pitch access

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294786A (ja) 2005-04-08 2006-10-26 Ulvac Japan Ltd 基板搬送システム

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
JP2808826B2 (ja) * 1990-05-25 1998-10-08 松下電器産業株式会社 基板の移し換え装置
US6366830B2 (en) * 1995-07-10 2002-04-02 Newport Corporation Self-teaching robot arm position method to compensate for support structure component alignment offset
US6360144B1 (en) * 1995-07-10 2002-03-19 Newport Corporation Self-teaching robot arm position method
JPH11188671A (ja) * 1997-12-26 1999-07-13 Daihen Corp ２アーム方式の搬送用ロボット装置
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
JPH11300663A (ja) * 1998-04-24 1999-11-02 Mecs Corp 薄型基板搬送装置
US7891935B2 (en) * 2002-05-09 2011-02-22 Brooks Automation, Inc. Dual arm robot
US7578649B2 (en) * 2002-05-29 2009-08-25 Brooks Automation, Inc. Dual arm substrate transport apparatus
JP2004235538A (ja) * 2003-01-31 2004-08-19 Tokyo Electron Ltd 搬送装置，真空処理装置およびｏリング
US9691651B2 (en) * 2005-01-28 2017-06-27 Brooks Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
US8376685B2 (en) * 2004-06-09 2013-02-19 Brooks Automation, Inc. Dual scara arm
KR100935537B1 (ko) * 2006-11-01 2010-01-07 주식회사 아이피에스 웨이퍼이송로봇, 이를 이용한 웨이퍼가공시스템 및웨이퍼처리방법
US8950998B2 (en) * 2007-02-27 2015-02-10 Brooks Automation, Inc. Batch substrate handling
US8752449B2 (en) * 2007-05-08 2014-06-17 Brooks Automation, Inc. Substrate transport apparatus with multiple movable arms utilizing a mechanical switch mechanism
JP4784599B2 (ja) * 2007-12-28 2011-10-05 東京エレクトロン株式会社 真空処理装置及び真空処理方法並びに記憶媒体
TWI465599B (zh) 2008-12-29 2014-12-21 Ｋ Ｃ 科技股份有限公司 原子層沉積裝置
CN102326244B (zh) * 2009-01-11 2014-12-17 应用材料公司 用于在电子器件制造中传输基板的机械手系统、装置及方法
JP5395271B2 (ja) * 2010-08-17 2014-01-22 キヤノンアネルバ株式会社 基板搬送装置、電子デバイスの製造システムおよび電子デバイスの製造方法
JP5610952B2 (ja) * 2010-09-24 2014-10-22 日本電産サンキョー株式会社 産業用ロボット
KR20140087038A (ko) * 2011-12-15 2014-07-08 다즈모 가부시키가이샤 웨이퍼 반송장치
US8961099B2 (en) * 2012-01-13 2015-02-24 Novellus Systems, Inc. Dual arm vacuum robot with common drive pulley
CN104428884B (zh) * 2012-07-05 2017-10-24 应用材料公司 吊杆驱动装置、多臂机械手装置、电子器件处理系统及用于在电子器件制造系统中传送基板的方法
JP5990359B2 (ja) 2012-10-04 2016-09-14 平田機工株式会社 搬入出ロボット
US9190306B2 (en) * 2012-11-30 2015-11-17 Lam Research Corporation Dual arm vacuum robot
US10224232B2 (en) * 2013-01-18 2019-03-05 Persimmon Technologies Corporation Robot having two arms with unequal link lengths
US9149936B2 (en) * 2013-01-18 2015-10-06 Persimmon Technologies, Corp. Robot having arm with unequal link lengths
US9281222B2 (en) * 2013-03-15 2016-03-08 Applied Materials, Inc. Wafer handling systems and methods
US10427303B2 (en) * 2013-03-15 2019-10-01 Applied Materials, Inc. Substrate deposition systems, robot transfer apparatus, and methods for electronic device manufacturing
US10424498B2 (en) * 2013-09-09 2019-09-24 Persimmon Technologies Corporation Substrate transport vacuum platform
CN106463438B (zh) * 2014-01-28 2019-09-10 布鲁克斯自动化公司 基板运输设备
KR101866625B1 (ko) * 2014-09-03 2018-06-11 가부시키가이샤 알박 반송 장치 및 진공 장치
WO2016056119A1 (ja) * 2014-10-10 2016-04-14 川崎重工業株式会社 基板搬送ロボットおよびその運転方法
KR102417929B1 (ko) * 2015-08-07 2022-07-06 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US20170125269A1 (en) * 2015-10-29 2017-05-04 Aixtron Se Transfer module for a multi-module apparatus
TWI707754B (zh) * 2016-06-28 2020-10-21 美商應用材料股份有限公司 包括間隔上臂與交錯腕部的雙機器人以及包括該者之方法
JP6403722B2 (ja) * 2016-07-21 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法、プログラム
JP2018032797A (ja) * 2016-08-25 2018-03-01 ローツェ株式会社 搬送装置
US10580682B2 (en) * 2017-02-15 2020-03-03 Persimmon Technologies, Corp. Material-handling robot with multiple end-effectors
CN108933097B (zh) * 2017-05-23 2023-06-23 东京毅力科创株式会社 真空输送组件和基片处理装置
JP6951923B2 (ja) * 2017-09-27 2021-10-20 東京エレクトロン株式会社 基板処理装置、基板処理方法及びコンピュータ記憶媒体
CN109994358B (zh) * 2017-12-29 2021-04-27 中微半导体设备(上海)股份有限公司 一种等离子处理系统和等离子处理系统的运行方法
JP6653722B2 (ja) * 2018-03-14 2020-02-26 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置
JP7090469B2 (ja) * 2018-05-15 2022-06-24 東京エレクトロン株式会社 基板処理装置
US10943805B2 (en) * 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
JP7014055B2 (ja) * 2018-06-15 2022-02-01 東京エレクトロン株式会社 真空処理装置、真空処理システム、及び真空処理方法
JP7177332B2 (ja) * 2018-07-03 2022-11-24 シンフォニアテクノロジー株式会社 搬送装置
JP7225613B2 (ja) * 2018-09-03 2023-02-21 東京エレクトロン株式会社 基板搬送機構、基板処理装置及び基板搬送方法
US11192239B2 (en) * 2018-10-05 2021-12-07 Brooks Automation, Inc. Substrate processing apparatus
CN112219269B (zh) * 2018-11-19 2024-08-20 玛特森技术公司 用于加工工件的系统和方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294786A (ja) 2005-04-08 2006-10-26 Ulvac Japan Ltd 基板搬送システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023043088A1 (ko) * 2021-09-16 2023-03-23 주식회사 나인벨 기판 교체시간이 단축된 반도체 기판 처리장치

Also Published As

Publication number Publication date
JP2020035954A (ja) 2020-03-05
JP7183635B2 (ja) 2022-12-06
KR20200026138A (ko) 2020-03-10
US10872798B2 (en) 2020-12-22
US20200075376A1 (en) 2020-03-05

Similar Documents

Publication Publication Date Title
KR102244352B1 (ko) 기판 반송 기구, 기판 처리 장치 및 기판 반송 방법
CN108933097B (zh) 真空输送组件和基片处理装置
JP5503006B2 (ja) 基板処理システム、搬送モジュール、基板処理方法及び半導体素子の製造方法
CN102064123B (zh) 半导体被处理基板的真空处理系统及半导体被处理基板的真空处理方法
KR102244354B1 (ko) 기판 반송 기구, 기판 처리 장치 및 기판 반송 방법
KR102491212B1 (ko) 진공 처리 장치 및 기판 반송 방법
KR102355575B1 (ko) 진공 처리 장치
KR20200074934A (ko) 진공 반송 모듈 및 기판 처리 장치
CN102347256A (zh) 真空处理装置
KR20120006950A (ko) 진공 처리 장치
KR20190020042A (ko) 기판 처리 장치
US11804393B2 (en) Wafer processing apparatus including equipment front end module (EFEM) and wafer processing method using the same
US12217984B2 (en) Wafer processing apparatus including EFEM and method of processing wafer
US9962840B2 (en) Substrate conveyance apparatus
CN113451186B (zh) 传送机器人及包括此的基板处理系统

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 6