JP7183635B2 - 基板搬送機構、基板処理装置及び基板搬送方法 - Google Patents

基板搬送機構、基板処理装置及び基板搬送方法 Download PDF

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JP7183635B2
JP7183635B2 JP2018163103A JP2018163103A JP7183635B2 JP 7183635 B2 JP7183635 B2 JP 7183635B2 JP 2018163103 A JP2018163103 A JP 2018163103A JP 2018163103 A JP2018163103 A JP 2018163103A JP 7183635 B2 JP7183635 B2 JP 7183635B2
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arm
substrate
support
rotating
distance
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JP2020035954A (ja
JP2020035954A5 (https=
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貴光 深澤
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2018163103A priority Critical patent/JP7183635B2/ja
Priority to US16/548,652 priority patent/US10872798B2/en
Priority to KR1020190106633A priority patent/KR102244352B1/ko
Publication of JP2020035954A publication Critical patent/JP2020035954A/ja
Publication of JP2020035954A5 publication Critical patent/JP2020035954A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2018163103A 2018-08-31 2018-08-31 基板搬送機構、基板処理装置及び基板搬送方法 Active JP7183635B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018163103A JP7183635B2 (ja) 2018-08-31 2018-08-31 基板搬送機構、基板処理装置及び基板搬送方法
US16/548,652 US10872798B2 (en) 2018-08-31 2019-08-22 Substrate transfer mechanism, substrate processing apparatus, and substrate transfer method
KR1020190106633A KR102244352B1 (ko) 2018-08-31 2019-08-29 기판 반송 기구, 기판 처리 장치 및 기판 반송 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018163103A JP7183635B2 (ja) 2018-08-31 2018-08-31 基板搬送機構、基板処理装置及び基板搬送方法

Publications (3)

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JP2020035954A JP2020035954A (ja) 2020-03-05
JP2020035954A5 JP2020035954A5 (https=) 2021-07-26
JP7183635B2 true JP7183635B2 (ja) 2022-12-06

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US (1) US10872798B2 (https=)
JP (1) JP7183635B2 (https=)
KR (1) KR102244352B1 (https=)

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JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
KR102833850B1 (ko) * 2020-03-24 2025-07-14 주식회사 원익아이피에스 이송로봇 및 이를 포함하는 기판처리시스템
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Also Published As

Publication number Publication date
KR102244352B1 (ko) 2021-04-23
JP2020035954A (ja) 2020-03-05
KR20200026138A (ko) 2020-03-10
US10872798B2 (en) 2020-12-22
US20200075376A1 (en) 2020-03-05

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