KR102203019B1 - 점착 시트 - Google Patents

점착 시트 Download PDF

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Publication number
KR102203019B1
KR102203019B1 KR1020157024751A KR20157024751A KR102203019B1 KR 102203019 B1 KR102203019 B1 KR 102203019B1 KR 1020157024751 A KR1020157024751 A KR 1020157024751A KR 20157024751 A KR20157024751 A KR 20157024751A KR 102203019 B1 KR102203019 B1 KR 102203019B1
Authority
KR
South Korea
Prior art keywords
pressure
sensitive adhesive
layer
adhesive layer
thermally expandable
Prior art date
Application number
KR1020157024751A
Other languages
English (en)
Korean (ko)
Other versions
KR20150127088A (ko
Inventor
다카마사 히라야마
가즈히로 기타야마
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20150127088A publication Critical patent/KR20150127088A/ko
Application granted granted Critical
Publication of KR102203019B1 publication Critical patent/KR102203019B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
KR1020157024751A 2013-03-15 2014-03-12 점착 시트 KR102203019B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013053848 2013-03-15
JPJP-P-2013-053848 2013-03-15
PCT/JP2014/056548 WO2014142192A1 (ja) 2013-03-15 2014-03-12 粘着シート

Publications (2)

Publication Number Publication Date
KR20150127088A KR20150127088A (ko) 2015-11-16
KR102203019B1 true KR102203019B1 (ko) 2021-01-14

Family

ID=51536843

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157024751A KR102203019B1 (ko) 2013-03-15 2014-03-12 점착 시트

Country Status (5)

Country Link
JP (1) JPWO2014142192A1 (zh)
KR (1) KR102203019B1 (zh)
CN (1) CN105051137A (zh)
TW (1) TWI659084B (zh)
WO (1) WO2014142192A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105492557B (zh) * 2013-08-29 2018-11-02 三井化学东赛璐株式会社 粘接膜和半导体装置的制造方法
JP6448333B2 (ja) * 2014-12-02 2019-01-09 日東電工株式会社 粘着シート
EP3296373B1 (en) 2015-05-08 2021-07-28 Bando Chemical Industries, Ltd. Optical transparent adhesive sheet, method for producing optical transparent adhesive sheet, laminate and display device with touch panel
CN108137999B (zh) 2015-09-29 2021-02-02 阪东化学株式会社 光学透明粘着片、层叠体及其制法、带触摸屏的显示装置
EP3382517A4 (en) * 2015-11-26 2019-08-07 Bando Chemical Industries, Ltd. OPTICAL TRANSPARENT ADHESIVE FOIL, METHOD FOR PRODUCING AN OPTICAL TRANSPARENT ADHESIVE FOIL, LAMINATED BODY AND DISPLAY DEVICE WITH A TOUCH PANEL
JP6783570B2 (ja) * 2016-07-11 2020-11-11 日東電工株式会社 粘着シート
JP6887766B2 (ja) * 2016-07-19 2021-06-16 日東電工株式会社 粘着シート
JP7048184B2 (ja) * 2016-12-02 2022-04-05 スリーエム イノベイティブ プロパティズ カンパニー ポリマー多層材料及びその製造方法
WO2018139175A1 (ja) * 2017-01-26 2018-08-02 コニカミノルタ株式会社 機能性フィルム積層体、及び、機能性フィルム積層体の製造方法
CN110476241B (zh) * 2017-03-31 2023-05-09 琳得科株式会社 半导体装置的制造方法及双面粘合片
CN110462816B (zh) * 2017-03-31 2023-09-19 琳得科株式会社 半导体装置的制造方法及粘合片
KR20180136029A (ko) 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
JP7006661B2 (ja) * 2019-06-14 2022-01-24 カシオ計算機株式会社 造形物の製造方法及び造形装置
CN110775940B (zh) * 2019-10-31 2023-08-15 潍坊歌尔微电子有限公司 Mems传感器组件制造方法、以及以该法制造的mems传感器组件
JP2022155610A (ja) * 2021-03-31 2022-10-14 日東電工株式会社 粘着シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007069380A (ja) * 2005-09-05 2007-03-22 Nitto Denko Corp 加熱剥離型粘着シート用セパレータ及びセパレータ付き加熱剥離型粘着シート
JP2008115273A (ja) 2006-11-04 2008-05-22 Nitto Denko Corp 熱剥離性粘着シート及び被着体回収方法
JP2012136717A (ja) * 2012-04-23 2012-07-19 Nitto Denko Corp 熱剥離型粘着シート及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317981A (ja) * 1986-07-09 1988-01-25 F S K Kk 粘着シ−ト
JP4703833B2 (ja) 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP4428908B2 (ja) * 2002-04-08 2010-03-10 日東電工株式会社 粘着シートを用いた被着体加工方法
JP5689336B2 (ja) * 2011-03-03 2015-03-25 日東電工株式会社 加熱剥離型粘着シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007069380A (ja) * 2005-09-05 2007-03-22 Nitto Denko Corp 加熱剥離型粘着シート用セパレータ及びセパレータ付き加熱剥離型粘着シート
JP2008115273A (ja) 2006-11-04 2008-05-22 Nitto Denko Corp 熱剥離性粘着シート及び被着体回収方法
JP2012136717A (ja) * 2012-04-23 2012-07-19 Nitto Denko Corp 熱剥離型粘着シート及びその製造方法

Also Published As

Publication number Publication date
CN105051137A (zh) 2015-11-11
KR20150127088A (ko) 2015-11-16
TW201441333A (zh) 2014-11-01
TWI659084B (zh) 2019-05-11
JPWO2014142192A1 (ja) 2017-02-16
WO2014142192A1 (ja) 2014-09-18

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