KR102199991B1 - 발광 소자 및 이를 구비한 라이트 유닛 - Google Patents

발광 소자 및 이를 구비한 라이트 유닛 Download PDF

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Publication number
KR102199991B1
KR102199991B1 KR1020140064310A KR20140064310A KR102199991B1 KR 102199991 B1 KR102199991 B1 KR 102199991B1 KR 1020140064310 A KR1020140064310 A KR 1020140064310A KR 20140064310 A KR20140064310 A KR 20140064310A KR 102199991 B1 KR102199991 B1 KR 102199991B1
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KR
South Korea
Prior art keywords
light emitting
disposed
pad
pads
layer
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Expired - Fee Related
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KR1020140064310A
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English (en)
Korean (ko)
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KR20150136814A (ko
Inventor
이건화
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엘지이노텍 주식회사
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Priority to KR1020140064310A priority Critical patent/KR102199991B1/ko
Priority to US14/673,501 priority patent/US9472742B2/en
Priority to JP2015089142A priority patent/JP6496601B2/ja
Priority to EP15169314.0A priority patent/EP2950359B1/en
Priority to CN201510284707.4A priority patent/CN105280798B/zh
Publication of KR20150136814A publication Critical patent/KR20150136814A/ko
Application granted granted Critical
Publication of KR102199991B1 publication Critical patent/KR102199991B1/ko
Assigned to 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 reassignment 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 권리의 전부이전등록 Assignors: 엘지이노텍 주식회사
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
KR1020140064310A 2014-05-28 2014-05-28 발광 소자 및 이를 구비한 라이트 유닛 Expired - Fee Related KR102199991B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020140064310A KR102199991B1 (ko) 2014-05-28 2014-05-28 발광 소자 및 이를 구비한 라이트 유닛
US14/673,501 US9472742B2 (en) 2014-05-28 2015-03-30 Light emitting device and light unit having the same
JP2015089142A JP6496601B2 (ja) 2014-05-28 2015-04-24 発光素子
EP15169314.0A EP2950359B1 (en) 2014-05-28 2015-05-27 A light emitting device
CN201510284707.4A CN105280798B (zh) 2014-05-28 2015-05-28 发光器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140064310A KR102199991B1 (ko) 2014-05-28 2014-05-28 발광 소자 및 이를 구비한 라이트 유닛

Publications (2)

Publication Number Publication Date
KR20150136814A KR20150136814A (ko) 2015-12-08
KR102199991B1 true KR102199991B1 (ko) 2021-01-11

Family

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KR1020140064310A Expired - Fee Related KR102199991B1 (ko) 2014-05-28 2014-05-28 발광 소자 및 이를 구비한 라이트 유닛

Country Status (5)

Country Link
US (1) US9472742B2 (https=)
EP (1) EP2950359B1 (https=)
JP (1) JP6496601B2 (https=)
KR (1) KR102199991B1 (https=)
CN (1) CN105280798B (https=)

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CN104081547A (zh) * 2012-02-15 2014-10-01 松下电器产业株式会社 发光装置以及其制造方法
US10644210B2 (en) * 2016-04-01 2020-05-05 Nichia Corporation Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member
JP7011148B2 (ja) * 2016-04-01 2022-01-26 日亜化学工業株式会社 発光素子載置用基体の製造方法及びそれを用いた発光装置の製造方法並びに発光素子載置用基体及びそれを用いた発光装置
KR102455096B1 (ko) * 2016-10-11 2022-10-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 및 발광소자 패키지
KR101743022B1 (ko) * 2016-10-31 2017-06-02 신화인터텍 주식회사 방열 시트 및 그 제조 방법
KR102356216B1 (ko) * 2017-05-30 2022-01-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
KR102473399B1 (ko) * 2017-06-26 2022-12-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
US10497846B2 (en) * 2017-07-11 2019-12-03 Lg Innotek Co., Ltd. Light emitting device package
KR102432216B1 (ko) * 2017-07-11 2022-08-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
US10497827B2 (en) * 2017-07-21 2019-12-03 Lg Innotek Co., Ltd. Light emitting device package
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KR102393666B1 (ko) * 2017-09-01 2022-05-03 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102393035B1 (ko) * 2017-09-01 2022-05-02 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102401824B1 (ko) * 2017-09-01 2022-05-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102455086B1 (ko) * 2017-09-12 2022-10-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원장치
EP3483943B1 (en) * 2017-09-12 2021-04-28 LG Innotek Co., Ltd. Light emitting device package
KR102401826B1 (ko) * 2017-09-15 2022-05-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 이를 포함하는 조명장치
CN107818931B (zh) * 2017-09-30 2021-10-19 厦门市三安光电科技有限公司 半导体微元件的转移方法及转移装置
DE102017123773B4 (de) * 2017-10-12 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigeelement und Anzeigevorrichtung
KR102426118B1 (ko) * 2017-10-13 2022-07-27 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
KR102433841B1 (ko) 2017-10-20 2022-08-18 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102426833B1 (ko) * 2017-11-01 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
WO2019088701A1 (ko) 2017-11-01 2019-05-09 엘지이노텍 주식회사 발광소자 패키지 및 광원 장치
KR102509064B1 (ko) * 2017-11-03 2023-03-10 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 이를 포함하는 조명장치
KR102471688B1 (ko) * 2017-11-10 2022-11-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지, 광원장치 및 발광소자 패키지 제조방법
KR102486038B1 (ko) 2017-12-01 2023-01-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102455087B1 (ko) * 2017-12-11 2022-10-14 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
KR102413223B1 (ko) * 2017-12-19 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102539278B1 (ko) * 2018-01-12 2023-06-05 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102595927B1 (ko) * 2018-04-11 2023-10-30 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지, 발광소자 패키지 제조방법 및 광원 장치
KR102689067B1 (ko) * 2018-09-13 2024-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지 및 광원 장치
US11699688B2 (en) * 2019-12-03 2023-07-11 Nichia Corporation Surface-emitting light source and method of manufacturing the same
CN111430404B (zh) * 2020-04-26 2024-05-14 厦门未来显示技术研究院有限公司 可用于微转移的微元件及其制作和转移方法、显示装置
KR102581156B1 (ko) * 2020-05-15 2023-09-21 루미레즈 엘엘씨 방출 강도의 구성가능한 공간 분포를 갖는 발광 디바이스
TWI752707B (zh) 2020-11-03 2022-01-11 財團法人工業技術研究院 具有通孔的基板及其製造方法
KR102571257B1 (ko) * 2021-06-11 2023-08-25 주식회사 로티 조명용 유기 발광소자 및 그 제조 방법
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CN115000270B (zh) 2022-06-16 2023-12-01 惠州华星光电显示有限公司 光源模组及显示装置

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Also Published As

Publication number Publication date
EP2950359B1 (en) 2022-10-19
US9472742B2 (en) 2016-10-18
JP2015226056A (ja) 2015-12-14
JP6496601B2 (ja) 2019-04-03
EP2950359A1 (en) 2015-12-02
US20150349223A1 (en) 2015-12-03
CN105280798A (zh) 2016-01-27
CN105280798B (zh) 2019-01-18
KR20150136814A (ko) 2015-12-08

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