KR102196867B1 - 솔더 마스크 잉크 조성물 - Google Patents

솔더 마스크 잉크 조성물 Download PDF

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Publication number
KR102196867B1
KR102196867B1 KR1020150114293A KR20150114293A KR102196867B1 KR 102196867 B1 KR102196867 B1 KR 102196867B1 KR 1020150114293 A KR1020150114293 A KR 1020150114293A KR 20150114293 A KR20150114293 A KR 20150114293A KR 102196867 B1 KR102196867 B1 KR 102196867B1
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KR
South Korea
Prior art keywords
solder mask
solvent
ink composition
composition
cps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020150114293A
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English (en)
Korean (ko)
Other versions
KR20160026699A (ko
Inventor
우 일리앙
에이. 너거 브라이언
Original Assignee
제록스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제록스 코포레이션 filed Critical 제록스 코포레이션
Publication of KR20160026699A publication Critical patent/KR20160026699A/ko
Application granted granted Critical
Publication of KR102196867B1 publication Critical patent/KR102196867B1/ko
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/58—Ethylene oxide or propylene oxide copolymers, e.g. pluronics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Ink Jet (AREA)
KR1020150114293A 2014-08-28 2015-08-13 솔더 마스크 잉크 조성물 Expired - Fee Related KR102196867B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/471,893 US9796864B2 (en) 2014-08-28 2014-08-28 Solder mask ink composition
US14/471,893 2014-08-28

Publications (2)

Publication Number Publication Date
KR20160026699A KR20160026699A (ko) 2016-03-09
KR102196867B1 true KR102196867B1 (ko) 2020-12-30

Family

ID=55312447

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150114293A Expired - Fee Related KR102196867B1 (ko) 2014-08-28 2015-08-13 솔더 마스크 잉크 조성물

Country Status (9)

Country Link
US (1) US9796864B2 (enExample)
JP (1) JP2016050311A (enExample)
KR (1) KR102196867B1 (enExample)
BR (1) BR102015018917A2 (enExample)
CA (1) CA2901003C (enExample)
DE (1) DE102015215957B4 (enExample)
MX (1) MX382880B (enExample)
RU (1) RU2672441C2 (enExample)
TW (1) TW201607996A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9606430B2 (en) 2014-08-28 2017-03-28 Xerox Corporation Method of aerosol printing a solder mask ink composition
CN113549369A (zh) * 2021-07-05 2021-10-26 江苏海田电子材料有限公司 抗裂纹阻焊塞孔油墨及其制备方法
CN116694128B (zh) * 2023-06-28 2023-11-24 鹤山市炎墨科技有限公司 一种含有嵌段共聚物的防焊油墨及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338612A (ja) 2001-05-11 2002-11-27 Toyobo Co Ltd 光硬化性組成物およびその硬化方法
JP2007219384A (ja) 2006-02-20 2007-08-30 Fujifilm Corp パターン形成方法
WO2010047264A1 (ja) 2008-10-20 2010-04-29 住友ベークライト株式会社 スプレー塗布用ポジ型感光性樹脂組成物及びそれを用いた貫通電極の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1105851A1 (ru) * 1982-01-06 1984-07-30 Горьковский государственный университет им.Н.И.Лобачевского Фотополимеризующа с композици
DE3374413D1 (en) * 1982-06-24 1987-12-17 Ciba Geigy Ag Photopolymerisable coating, photopolymerisable material and its use
JPS5975955A (ja) * 1982-10-22 1984-04-28 Kansai Paint Co Ltd 自己熱硬化性塗料用樹脂組成物
IL94474A (en) * 1989-06-09 1993-07-08 Morton Int Inc Photoimageable compositions
JPH0338330A (ja) * 1989-07-05 1991-02-19 Hitachi Chem Co Ltd エポキシ樹脂積層板の製造方法
US6458509B1 (en) * 1999-04-30 2002-10-01 Toagosei Co., Ltd. Resist compositions
JP2002336993A (ja) * 2001-03-16 2002-11-26 Tamura Kaken Co Ltd ソルダペースト組成物及びリフローはんだ付方法
JP2004087336A (ja) * 2002-08-27 2004-03-18 Sumitomo Bakelite Co Ltd 絶縁膜用材料、絶縁膜用コーティングワニス、及びこれを用いた絶縁膜
JP5256645B2 (ja) * 2006-05-31 2013-08-07 三菱化学株式会社 保護膜用熱硬化性組成物、硬化物、及び液晶表示装置
US7964032B2 (en) * 2006-10-17 2011-06-21 Momentive Performance Materials Inc. Fluorine-free trisiloxane surfactant compositions for use in coatings and printing ink compositions
JP5569216B2 (ja) * 2010-07-27 2014-08-13 Ｊｎｃ株式会社 熱硬化性組成物およびその用途
EP2592098A1 (de) * 2011-11-10 2013-05-15 Sika Technology AG Pyridinylgruppen aufweisende Härter für Epoxidharze

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338612A (ja) 2001-05-11 2002-11-27 Toyobo Co Ltd 光硬化性組成物およびその硬化方法
JP2007219384A (ja) 2006-02-20 2007-08-30 Fujifilm Corp パターン形成方法
WO2010047264A1 (ja) 2008-10-20 2010-04-29 住友ベークライト株式会社 スプレー塗布用ポジ型感光性樹脂組成物及びそれを用いた貫通電極の製造方法

Also Published As

Publication number Publication date
CA2901003A1 (en) 2016-02-28
KR20160026699A (ko) 2016-03-09
RU2015132830A3 (enExample) 2018-09-19
BR102015018917A2 (pt) 2016-03-01
DE102015215957A1 (de) 2016-03-03
MX2015010463A (es) 2016-07-08
RU2015132830A (ru) 2017-02-09
JP2016050311A (ja) 2016-04-11
DE102015215957B4 (de) 2021-05-20
US9796864B2 (en) 2017-10-24
CA2901003C (en) 2018-04-24
TW201607996A (zh) 2016-03-01
US20160060471A1 (en) 2016-03-03
RU2672441C2 (ru) 2018-11-14
MX382880B (es) 2025-03-13

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