KR102175521B1 - 정전척으로부터 손상된 에폭시를 제거하는 방법 - Google Patents

정전척으로부터 손상된 에폭시를 제거하는 방법 Download PDF

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Publication number
KR102175521B1
KR102175521B1 KR1020130112919A KR20130112919A KR102175521B1 KR 102175521 B1 KR102175521 B1 KR 102175521B1 KR 1020130112919 A KR1020130112919 A KR 1020130112919A KR 20130112919 A KR20130112919 A KR 20130112919A KR 102175521 B1 KR102175521 B1 KR 102175521B1
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South Korea
Prior art keywords
electrostatic chuck
epoxy band
epoxy
band
coolant
Prior art date
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KR1020130112919A
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English (en)
Korean (ko)
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KR20140038909A (ko
Inventor
홍 시
퉈촨 후앙
얀 팡
크리프 라크로와
닐 뉴튼
리쉬 차트레
Original Assignee
램 리써치 코포레이션
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Publication of KR20140038909A publication Critical patent/KR20140038909A/ko
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Publication of KR102175521B1 publication Critical patent/KR102175521B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B08B1/143—Wipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130112919A 2012-09-21 2013-09-23 정전척으로부터 손상된 에폭시를 제거하는 방법 Active KR102175521B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/624,822 US9105676B2 (en) 2012-09-21 2012-09-21 Method of removing damaged epoxy from electrostatic chuck
US13/624,822 2012-09-21

Publications (2)

Publication Number Publication Date
KR20140038909A KR20140038909A (ko) 2014-03-31
KR102175521B1 true KR102175521B1 (ko) 2020-11-09

Family

ID=50318568

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130112919A Active KR102175521B1 (ko) 2012-09-21 2013-09-23 정전척으로부터 손상된 에폭시를 제거하는 방법

Country Status (5)

Country Link
US (1) US9105676B2 (https=)
JP (1) JP6335458B2 (https=)
KR (1) KR102175521B1 (https=)
CN (1) CN103681415B (https=)
TW (1) TWI591754B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9869392B2 (en) * 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
JP5811513B2 (ja) 2014-03-27 2015-11-11 Toto株式会社 静電チャック
US9999947B2 (en) * 2015-05-01 2018-06-19 Component Re-Engineering Company, Inc. Method for repairing heaters and chucks used in semiconductor processing
US10340171B2 (en) * 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US10629416B2 (en) * 2017-01-23 2020-04-21 Infineon Technologies Ag Wafer chuck and processing arrangement
CN107952727A (zh) * 2017-11-30 2018-04-24 芜湖通潮精密机械股份有限公司 静电卡盘产品污染物清洗处理的方法
CN108598022B (zh) * 2018-05-08 2021-05-14 睿昇电子科技(深圳)有限公司 一种半导体电子器件封装外观除胶设备及除胶方法
JP7213691B2 (ja) * 2019-01-07 2023-01-27 日本特殊陶業株式会社 静電チャック
KR20230034452A (ko) * 2021-09-02 2023-03-10 주식회사 템네스트 반도체 웨이퍼 제조 장치 및 그 내식성 향상 방법
TWI888077B (zh) * 2024-03-27 2025-06-21 萬潤科技股份有限公司 作業方法及裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2867051B2 (ja) * 1989-12-28 1999-03-08 住友シチックス株式会社 ウエーハの剥離方法
JP2002026362A (ja) * 2000-07-13 2002-01-25 Canon Inc 積層体の加工方法及び加工装置
JP2007129142A (ja) * 2005-11-07 2007-05-24 Ngk Insulators Ltd 基板載置部材の分離方法及び再利用方法
JP2010129845A (ja) * 2008-11-28 2010-06-10 Creative Technology:Kk 静電チャック及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624734B2 (en) * 2001-09-21 2003-09-23 Abb Technology Ag DC voltage/current heating/gelling/curing of resin encapsulated distribution transformer coils
WO2004112123A1 (ja) * 2003-06-17 2004-12-23 Creative Technology Corporation 双極型静電チャック
CN100370592C (zh) * 2005-12-08 2008-02-20 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘
US20080092806A1 (en) * 2006-10-19 2008-04-24 Applied Materials, Inc. Removing residues from substrate processing components
US8291565B2 (en) * 2008-10-10 2012-10-23 Lam Research Corporation Method of refurbishing bipolar electrostatic chuck
JP5423632B2 (ja) * 2010-01-29 2014-02-19 住友大阪セメント株式会社 静電チャック装置
US20120118510A1 (en) * 2010-11-15 2012-05-17 Applied Materials, Inc. Method for debonding components in a chamber
US20120154974A1 (en) * 2010-12-16 2012-06-21 Applied Materials, Inc. High efficiency electrostatic chuck assembly for semiconductor wafer processing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2867051B2 (ja) * 1989-12-28 1999-03-08 住友シチックス株式会社 ウエーハの剥離方法
JP2002026362A (ja) * 2000-07-13 2002-01-25 Canon Inc 積層体の加工方法及び加工装置
JP2007129142A (ja) * 2005-11-07 2007-05-24 Ngk Insulators Ltd 基板載置部材の分離方法及び再利用方法
JP2010129845A (ja) * 2008-11-28 2010-06-10 Creative Technology:Kk 静電チャック及びその製造方法

Also Published As

Publication number Publication date
TW201421610A (zh) 2014-06-01
JP6335458B2 (ja) 2018-05-30
KR20140038909A (ko) 2014-03-31
TWI591754B (zh) 2017-07-11
JP2014068011A (ja) 2014-04-17
US20140083461A1 (en) 2014-03-27
US9105676B2 (en) 2015-08-11
CN103681415A (zh) 2014-03-26
CN103681415B (zh) 2017-01-11

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