KR102166134B1 - 빔 포지셔너의 레이저 방출-기반 제어 - Google Patents

빔 포지셔너의 레이저 방출-기반 제어 Download PDF

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Publication number
KR102166134B1
KR102166134B1 KR1020157023854A KR20157023854A KR102166134B1 KR 102166134 B1 KR102166134 B1 KR 102166134B1 KR 1020157023854 A KR1020157023854 A KR 1020157023854A KR 20157023854 A KR20157023854 A KR 20157023854A KR 102166134 B1 KR102166134 B1 KR 102166134B1
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South Korea
Prior art keywords
laser
pulse
work piece
laser pulses
propagation
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Korean (ko)
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KR20150132127A (ko
Inventor
조셉 프란켈
밥 보체인
더그 깁슨
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일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드
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Publication of KR20150132127A publication Critical patent/KR20150132127A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020157023854A 2013-03-15 2014-03-15 빔 포지셔너의 레이저 방출-기반 제어 Active KR102166134B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361800903P 2013-03-15 2013-03-15
US61/800,903 2013-03-15
PCT/US2014/030043 WO2014145305A1 (en) 2013-03-15 2014-03-15 Laser emission-based control of beam positioner

Publications (2)

Publication Number Publication Date
KR20150132127A KR20150132127A (ko) 2015-11-25
KR102166134B1 true KR102166134B1 (ko) 2020-10-16

Family

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Application Number Title Priority Date Filing Date
KR1020157023854A Active KR102166134B1 (ko) 2013-03-15 2014-03-15 빔 포지셔너의 레이저 방출-기반 제어

Country Status (6)

Country Link
US (1) US9527159B2 (https=)
JP (1) JP6516722B2 (https=)
KR (1) KR102166134B1 (https=)
CN (1) CN105102174B (https=)
TW (1) TWI583477B (https=)
WO (1) WO2014145305A1 (https=)

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JP5338890B2 (ja) * 2011-12-15 2013-11-13 Ｊｆｅスチール株式会社 レーザ溶接の溶接位置検出装置および溶接位置検出方法
EP2961012A1 (en) * 2014-06-26 2015-12-30 Light Speed Marker, S.L. Laser system for modifying objects
CN107850554B (zh) 2015-08-26 2021-09-07 伊雷克托科学工业股份有限公司 相对于气流的镭射扫描定序及方向
KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
CN110139727B (zh) 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
US20180207748A1 (en) * 2017-01-23 2018-07-26 Lumentum Operations Llc Machining processes using a random trigger feature for an ultrashort pulse laser
DE102018205270A1 (de) * 2018-04-09 2019-10-10 Scanlab Gmbh Laserstrahlpositioniersystem, Laserbearbeitungsvorrichtung und Steuerungsverfahren
KR20250039487A (ko) * 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
TWI843784B (zh) 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN112570881A (zh) * 2020-11-27 2021-03-30 沧州领创激光科技有限公司 一种用于激光切割机的视觉寻边与定位方法
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger
US11683090B1 (en) 2022-01-18 2023-06-20 T-Mobile Usa, Inc. Laser-based enhancement of signal propagation path for mobile communications
CN117782773B (zh) * 2024-02-26 2024-05-31 中国地质大学（武汉） 多脉冲飞秒激光剥蚀固体样品的进样器和剥蚀方法
CN119426811A (zh) * 2024-11-04 2025-02-14 深圳市熹扬科技有限公司 激光雕刻机及对焦高度检测方法

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JP2010167491A (ja) 2008-12-24 2010-08-05 Toshiba Mach Co Ltd パルスレーザ加工装置
JP2011056521A (ja) 2009-09-07 2011-03-24 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工条件の決定方法

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JP2005533658A (ja) 2002-07-23 2005-11-10 松下電器産業株式会社 超短パルスレーザを用いたレーザ加工方法及びレーザ加工装置
JP2010167491A (ja) 2008-12-24 2010-08-05 Toshiba Mach Co Ltd パルスレーザ加工装置
JP2011056521A (ja) 2009-09-07 2011-03-24 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工条件の決定方法

Also Published As

Publication number Publication date
CN105102174A (zh) 2015-11-25
JP6516722B2 (ja) 2019-05-22
US20140312013A1 (en) 2014-10-23
TW201446374A (zh) 2014-12-16
JP2016516585A (ja) 2016-06-09
WO2014145305A1 (en) 2014-09-18
TWI583477B (zh) 2017-05-21
KR20150132127A (ko) 2015-11-25
US9527159B2 (en) 2016-12-27
CN105102174B (zh) 2017-05-31

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