JP2016516585A5 - - Google Patents

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Publication number
JP2016516585A5
JP2016516585A5 JP2016503316A JP2016503316A JP2016516585A5 JP 2016516585 A5 JP2016516585 A5 JP 2016516585A5 JP 2016503316 A JP2016503316 A JP 2016503316A JP 2016503316 A JP2016503316 A JP 2016503316A JP 2016516585 A5 JP2016516585 A5 JP 2016516585A5
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JP
Japan
Prior art keywords
laser
pulse
workpiece
positioner
sorting device
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JP2016503316A
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English (en)
Japanese (ja)
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JP6516722B2 (ja
JP2016516585A (ja
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Priority claimed from PCT/US2014/030043 external-priority patent/WO2014145305A1/en
Publication of JP2016516585A publication Critical patent/JP2016516585A/ja
Publication of JP2016516585A5 publication Critical patent/JP2016516585A5/ja
Application granted granted Critical
Publication of JP6516722B2 publication Critical patent/JP6516722B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016503316A 2013-03-15 2014-03-15 ビームポジショナのレーザ出射に基づく制御 Expired - Fee Related JP6516722B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361800903P 2013-03-15 2013-03-15
US61/800,903 2013-03-15
PCT/US2014/030043 WO2014145305A1 (en) 2013-03-15 2014-03-15 Laser emission-based control of beam positioner

Publications (3)

Publication Number Publication Date
JP2016516585A JP2016516585A (ja) 2016-06-09
JP2016516585A5 true JP2016516585A5 (https=) 2017-04-06
JP6516722B2 JP6516722B2 (ja) 2019-05-22

Family

ID=51537945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016503316A Expired - Fee Related JP6516722B2 (ja) 2013-03-15 2014-03-15 ビームポジショナのレーザ出射に基づく制御

Country Status (6)

Country Link
US (1) US9527159B2 (https=)
JP (1) JP6516722B2 (https=)
KR (1) KR102166134B1 (https=)
CN (1) CN105102174B (https=)
TW (1) TWI583477B (https=)
WO (1) WO2014145305A1 (https=)

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EP2961012A1 (en) * 2014-06-26 2015-12-30 Light Speed Marker, S.L. Laser system for modifying objects
CN107850554B (zh) 2015-08-26 2021-09-07 伊雷克托科学工业股份有限公司 相对于气流的镭射扫描定序及方向
KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
CN110139727B (zh) 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
US20180207748A1 (en) * 2017-01-23 2018-07-26 Lumentum Operations Llc Machining processes using a random trigger feature for an ultrashort pulse laser
DE102018205270A1 (de) * 2018-04-09 2019-10-10 Scanlab Gmbh Laserstrahlpositioniersystem, Laserbearbeitungsvorrichtung und Steuerungsverfahren
KR20250039487A (ko) * 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
TWI843784B (zh) 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
CN112570881A (zh) * 2020-11-27 2021-03-30 沧州领创激光科技有限公司 一种用于激光切割机的视觉寻边与定位方法
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger
US11683090B1 (en) 2022-01-18 2023-06-20 T-Mobile Usa, Inc. Laser-based enhancement of signal propagation path for mobile communications
CN117782773B (zh) * 2024-02-26 2024-05-31 中国地质大学(武汉) 多脉冲飞秒激光剥蚀固体样品的进样器和剥蚀方法
CN119426811A (zh) * 2024-11-04 2025-02-14 深圳市熹扬科技有限公司 激光雕刻机及对焦高度检测方法

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