KR102156690B1 - 전자 부품의 실장 장치와 실장 방법 및 패키지 부품의 제조 방법 - Google Patents

전자 부품의 실장 장치와 실장 방법 및 패키지 부품의 제조 방법 Download PDF

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Publication number
KR102156690B1
KR102156690B1 KR1020180089852A KR20180089852A KR102156690B1 KR 102156690 B1 KR102156690 B1 KR 102156690B1 KR 1020180089852 A KR1020180089852 A KR 1020180089852A KR 20180089852 A KR20180089852 A KR 20180089852A KR 102156690 B1 KR102156690 B1 KR 102156690B1
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KR
South Korea
Prior art keywords
mounting
stage
support substrate
electronic component
semiconductor chip
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KR1020180089852A
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English (en)
Korean (ko)
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KR20190013670A (ko
Inventor
마사노리 하시모토
노리유키 후세
야스히로 야마다
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20190013670A publication Critical patent/KR20190013670A/ko
Application granted granted Critical
Publication of KR102156690B1 publication Critical patent/KR102156690B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
KR1020180089852A 2017-08-01 2018-08-01 전자 부품의 실장 장치와 실장 방법 및 패키지 부품의 제조 방법 KR102156690B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017149192A JP6781677B2 (ja) 2017-08-01 2017-08-01 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
JPJP-P-2017-149192 2017-08-01

Publications (2)

Publication Number Publication Date
KR20190013670A KR20190013670A (ko) 2019-02-11
KR102156690B1 true KR102156690B1 (ko) 2020-09-16

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KR1020180089852A KR102156690B1 (ko) 2017-08-01 2018-08-01 전자 부품의 실장 장치와 실장 방법 및 패키지 부품의 제조 방법

Country Status (3)

Country Link
JP (1) JP6781677B2 (ja)
KR (1) KR102156690B1 (ja)
TW (2) TWI698952B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020262783A1 (ko) * 2019-06-26 2020-12-30 우영관 자동보정 기능을 이용한 인쇄회로기판 부착용 부재플레이트의 부착 방법
CN112447555B (zh) * 2019-08-29 2024-05-14 芝浦机械电子装置株式会社 电子零件的安装装置
JP7350696B2 (ja) 2019-08-29 2023-09-26 芝浦メカトロニクス株式会社 電子部品の実装装置
JPWO2022158076A1 (ja) * 2021-01-19 2022-07-28
JPWO2023286245A1 (ja) * 2021-07-15 2023-01-19
KR102544074B1 (ko) * 2021-07-30 2023-06-15 엘지전자 주식회사 전자부품 실장 장치 및 그 장치의 제어 방법
KR20230138423A (ko) 2022-03-23 2023-10-05 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치 및 실장 방법
CN115172220B (zh) * 2022-07-14 2023-05-02 先之科半导体科技(东莞)有限公司 一种二极管封装设备
CN116169074B (zh) * 2023-02-24 2024-01-23 江苏福明太阳能有限公司 一种电子元器件的制造方法及制造设备

Citations (3)

* Cited by examiner, † Cited by third party
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KR100881908B1 (ko) 2001-08-08 2009-02-04 파나소닉 주식회사 전자부품 실장장치 및 전자부품 실장방법
KR101178760B1 (ko) * 2010-06-30 2012-09-07 야마하하쓰도키 가부시키가이샤 부품 반송 방법, 부품 반송 장치 및 부품 실장 장치
JP2013004615A (ja) * 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法

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JP4839535B2 (ja) * 2001-07-13 2011-12-21 ソニー株式会社 座標補正方法、座標補正装置、および座標補正用基準治具
JP2007072714A (ja) 2005-09-06 2007-03-22 Csk Holdings Corp 画像サービス提供装置及び画像データの受信端末
WO2007072714A1 (ja) * 2005-12-22 2007-06-28 Shibaura Mechatronics Corporation 電子部品の実装装置及び実装方法
JP4665863B2 (ja) 2006-08-08 2011-04-06 パナソニック株式会社 電子部品実装方法
WO2009001627A1 (ja) * 2007-06-28 2008-12-31 Yamaha Motor Co., Ltd. 部品移載装置
JP5030843B2 (ja) 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5344145B2 (ja) * 2008-12-25 2013-11-20 澁谷工業株式会社 ボンディング装置における電子部品と基板の位置合わせ方法
JP5358529B2 (ja) * 2010-07-23 2013-12-04 ヤマハ発動機株式会社 実装機
JP2013058520A (ja) 2011-09-07 2013-03-28 Dainippon Screen Mfg Co Ltd 描画装置、データ補正装置、再配線層の形成方法、および、データ補正方法
JP5774968B2 (ja) * 2011-11-15 2015-09-09 ヤマハ発動機株式会社 部品移載装置および部品移載装置における吸着位置調整方法
JP2013187434A (ja) * 2012-03-09 2013-09-19 Fujitsu Ltd 半導体装置、半導体装置の製造方法、電子装置及び基板
JPWO2014157134A1 (ja) * 2013-03-28 2017-02-16 東レエンジニアリング株式会社 実装方法および実装装置
TW201515160A (zh) * 2013-08-14 2015-04-16 Orion Systems Integration Pte Ltd 接合複數個半導體晶片到基板之設備與方法
JP6320239B2 (ja) * 2013-09-24 2018-05-09 日東電工株式会社 半導体チップ封止用熱硬化性樹脂シート及び半導体パッケージの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100881908B1 (ko) 2001-08-08 2009-02-04 파나소닉 주식회사 전자부품 실장장치 및 전자부품 실장방법
KR101178760B1 (ko) * 2010-06-30 2012-09-07 야마하하쓰도키 가부시키가이샤 부품 반송 방법, 부품 반송 장치 및 부품 실장 장치
JP2013004615A (ja) * 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法

Also Published As

Publication number Publication date
TW201943008A (zh) 2019-11-01
JP6781677B2 (ja) 2020-11-04
JP2019029563A (ja) 2019-02-21
TWI698952B (zh) 2020-07-11
TWI683388B (zh) 2020-01-21
TW201911462A (zh) 2019-03-16
KR20190013670A (ko) 2019-02-11

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