TWI698952B - 電子部件的實裝裝置與實裝方法，及封裝部件的製造方法 - Google Patents

電子部件的實裝裝置與實裝方法，及封裝部件的製造方法 Download PDF

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Publication number
TWI698952B
TWI698952B TW108130627A TW108130627A TWI698952B TW I698952 B TWI698952 B TW I698952B TW 108130627 A TW108130627 A TW 108130627A TW 108130627 A TW108130627 A TW 108130627A TW I698952 B TWI698952 B TW I698952B
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TW
Taiwan
Prior art keywords
mounting
stage
support substrate
semiconductor wafer
wafer
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TW108130627A
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English (en)
Chinese (zh)
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TW201943008A (zh
Inventor
橋本正規
布施憲亨
山田泰弘
Original Assignee
日商芝浦機械電子裝置股份有限公司
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Publication of TW201943008A publication Critical patent/TW201943008A/zh
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Publication of TWI698952B publication Critical patent/TWI698952B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
TW108130627A 2017-08-01 2018-07-24 電子部件的實裝裝置與實裝方法，及封裝部件的製造方法 TWI698952B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017149192A JP6781677B2 (ja) 2017-08-01 2017-08-01 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法
JP2017-149192 2017-08-01

Publications (2)

Publication Number Publication Date
TW201943008A TW201943008A (zh) 2019-11-01
TWI698952B true TWI698952B (zh) 2020-07-11

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TW108130627A TWI698952B (zh) 2017-08-01 2018-07-24 電子部件的實裝裝置與實裝方法，及封裝部件的製造方法
TW107125423A TWI683388B (zh) 2017-08-01 2018-07-24 電子部件的實裝裝置與實裝方法，及封裝部件的製造方法

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TW107125423A TWI683388B (zh) 2017-08-01 2018-07-24 電子部件的實裝裝置與實裝方法，及封裝部件的製造方法

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Country Link
JP (1) JP6781677B2 (ja)
KR (1) KR102156690B1 (ja)
TW (2) TWI698952B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020262783A1 (ko) * 2019-06-26 2020-12-30 우영관 자동보정 기능을 이용한 인쇄회로기판 부착용 부재플레이트의 부착 방법
JP7350696B2 (ja) 2019-08-29 2023-09-26 芝浦メカトロニクス株式会社 電子部品の実装装置
CN112447555B (zh) * 2019-08-29 2024-05-14 芝浦机械电子装置株式会社 电子零件的安装装置
WO2022158076A1 (ja) * 2021-01-19 2022-07-28 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
JP7565240B2 (ja) 2021-03-19 2024-10-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JPWO2023286245A1 (ja) * 2021-07-15 2023-01-19
KR102544074B1 (ko) * 2021-07-30 2023-06-15 엘지전자 주식회사 전자부품 실장 장치 및 그 장치의 제어 방법
TWI844313B (zh) 2022-03-23 2024-06-01 日商芝浦機械電子裝置股份有限公司 電子零件的安裝裝置及安裝方法
CN115172220B (zh) * 2022-07-14 2023-05-02 先之科半导体科技(东莞)有限公司 一种二极管封装设备
CN116169074B (zh) * 2023-02-24 2024-01-23 江苏福明太阳能有限公司 一种电子元器件的制造方法及制造设备
JP2024130261A (ja) * 2023-03-14 2024-09-30 オムロン株式会社 位置計測装置、位置計測方法、及び、位置計測プログラム

Citations (2)

* Cited by examiner, † Cited by third party
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US20100220183A1 (en) * 2007-06-28 2010-09-02 Yamaha Hatsudoki Kabushiki Kaisha Component placing apparatus
US20130120554A1 (en) * 2011-11-15 2013-05-16 Yamaha Hatsudoki Kabushiki Kaisha Component transfer apparatus and suction position adjustment method for component transfer apparatus

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JP4839535B2 (ja) * 2001-07-13 2011-12-21 ソニー株式会社 座標補正方法、座標補正装置、および座標補正用基準治具
CN1229010C (zh) * 2001-08-08 2005-11-23 松下电器产业株式会社 安装电子部件的设备和方法
JP2007072714A (ja) 2005-09-06 2007-03-22 Csk Holdings Corp 画像サービス提供装置及び画像データの受信端末
CN101341587B (zh) * 2005-12-22 2010-10-27 芝浦机械电子株式会社 电子部件的安装装置及安装方法
JP4665863B2 (ja) 2006-08-08 2011-04-06 パナソニック株式会社 電子部品実装方法
JP5030843B2 (ja) 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5344145B2 (ja) * 2008-12-25 2013-11-20 澁谷工業株式会社 ボンディング装置における電子部品と基板の位置合わせ方法
JP5420483B2 (ja) * 2010-06-30 2014-02-19 ヤマハ発動機株式会社 部品搬送方法、部品搬送装置及び部品実装装置
JP5358529B2 (ja) * 2010-07-23 2013-12-04 ヤマハ発動機株式会社 実装機
JP2013004615A (ja) * 2011-06-14 2013-01-07 Hitachi High-Tech Instruments Co Ltd 電子部品実装装置及び電子部品実装方法
JP2013058520A (ja) 2011-09-07 2013-03-28 Dainippon Screen Mfg Co Ltd 描画装置、データ補正装置、再配線層の形成方法、および、データ補正方法
JP2013187434A (ja) * 2012-03-09 2013-09-19 Fujitsu Ltd 半導体装置、半導体装置の製造方法、電子装置及び基板
JPWO2014157134A1 (ja) * 2013-03-28 2017-02-16 東レエンジニアリング株式会社 実装方法および実装装置
WO2015023232A1 (en) * 2013-08-14 2015-02-19 Orion Systems Integration Pte Ltd Apparatus And Method For Bonding A Plurality Of Semiconductor Chips Onto A Substrate
JP6320239B2 (ja) * 2013-09-24 2018-05-09 日東電工株式会社 半導体チップ封止用熱硬化性樹脂シート及び半導体パッケージの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100220183A1 (en) * 2007-06-28 2010-09-02 Yamaha Hatsudoki Kabushiki Kaisha Component placing apparatus
US20130120554A1 (en) * 2011-11-15 2013-05-16 Yamaha Hatsudoki Kabushiki Kaisha Component transfer apparatus and suction position adjustment method for component transfer apparatus

Also Published As

Publication number Publication date
KR20190013670A (ko) 2019-02-11
TW201943008A (zh) 2019-11-01
JP2019029563A (ja) 2019-02-21
JP6781677B2 (ja) 2020-11-04
TW201911462A (zh) 2019-03-16
KR102156690B1 (ko) 2020-09-16
TWI683388B (zh) 2020-01-21

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