KR102145008B1 - 코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 - Google Patents
코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 Download PDFInfo
- Publication number
- KR102145008B1 KR102145008B1 KR1020147036466A KR20147036466A KR102145008B1 KR 102145008 B1 KR102145008 B1 KR 102145008B1 KR 1020147036466 A KR1020147036466 A KR 1020147036466A KR 20147036466 A KR20147036466 A KR 20147036466A KR 102145008 B1 KR102145008 B1 KR 102145008B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- polycyclic aromatic
- condensed polycyclic
- coating agent
- aromatic group
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2012-146163 | 2012-06-28 | ||
JP2012146163A JP6022236B2 (ja) | 2012-06-28 | 2012-06-28 | コーティング剤、電気・電子機器、および電気・電子機器の金属部の保護方法 |
PCT/JP2013/067164 WO2014002919A1 (en) | 2012-06-28 | 2013-06-18 | Coating agent, electrical-electronic equipment, and method for protecting metal parts of electrical-electronic equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150023496A KR20150023496A (ko) | 2015-03-05 |
KR102145008B1 true KR102145008B1 (ko) | 2020-08-18 |
Family
ID=48748483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020147036466A KR102145008B1 (ko) | 2012-06-28 | 2013-06-18 | 코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6022236B2 (ja) |
KR (1) | KR102145008B1 (ja) |
TW (1) | TW201412893A (ja) |
WO (1) | WO2014002919A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI763735B (zh) * | 2016-12-09 | 2022-05-11 | 美商道康寧公司 | 組成物、光漫散器和由其所形成之裝置、及相關方法 |
JP2019131734A (ja) * | 2018-02-01 | 2019-08-08 | 信越化学工業株式会社 | 2液付加反応硬化型放熱シリコーン組成物及びその製造方法 |
EP3663346B1 (de) * | 2018-12-04 | 2023-11-15 | Evonik Operations GmbH | Reaktivsiloxane |
EP3919550A1 (de) * | 2020-06-02 | 2021-12-08 | Evonik Operations GmbH | Lineare acetoxygruppen-tragende siloxane und folgeprodukte |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010007057A (ja) | 2008-05-30 | 2010-01-14 | Toray Ind Inc | シロキサン系樹脂組成物およびこれを用いた光学デバイス |
JP2011256241A (ja) * | 2010-06-07 | 2011-12-22 | Shin-Etsu Chemical Co Ltd | 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6043872B2 (ja) * | 1979-09-29 | 1985-09-30 | 信越化学工業株式会社 | 熱硬化性オルガノポリシロキサン組成物 |
JPH07238259A (ja) * | 1994-03-01 | 1995-09-12 | Toray Dow Corning Silicone Co Ltd | コンフォーマルコーティング剤 |
JP3540356B2 (ja) * | 1994-03-14 | 2004-07-07 | 東レ・ダウコーニング・シリコーン株式会社 | コンフォーマルコーティング剤 |
US5545830A (en) * | 1994-12-30 | 1996-08-13 | Dow Corning Corporation | Curable fluorescent organopolysiloxane compositions |
JP2001192842A (ja) * | 1999-11-05 | 2001-07-17 | Ishizuka Glass Co Ltd | 金属用処理剤、コーティング被膜付金属材料、金属樹脂複合成形体 |
GB0118473D0 (en) * | 2001-07-28 | 2001-09-19 | Dow Corning | High refractive index polysiloxanes and their preparation |
JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
JP2004149611A (ja) * | 2002-10-29 | 2004-05-27 | Dow Corning Toray Silicone Co Ltd | 電気・電子機器の金属製導電部の保護方法 |
JP2007220714A (ja) * | 2006-02-14 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JP5586820B2 (ja) * | 2006-07-21 | 2014-09-10 | 東京応化工業株式会社 | 高屈折率材料 |
JP5231774B2 (ja) * | 2007-09-07 | 2013-07-10 | リンテック株式会社 | 両面粘着シート |
JP5376210B2 (ja) * | 2008-01-31 | 2013-12-25 | 東レ・ファインケミカル株式会社 | 縮合多環式炭化水素基を有するシリコーン共重合体及びその製造方法 |
JP5158594B2 (ja) * | 2008-05-21 | 2013-03-06 | 東レ・ファインケミカル株式会社 | ナフタレン環を有するシリコーン重合体、およびその組成物 |
KR20140048240A (ko) * | 2011-07-07 | 2014-04-23 | 다우 코닝 도레이 캄파니 리미티드 | 오르가노폴리실록산 및 그 제조 방법 |
WO2013005858A1 (ja) * | 2011-07-07 | 2013-01-10 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
-
2012
- 2012-06-28 JP JP2012146163A patent/JP6022236B2/ja active Active
-
2013
- 2013-06-18 WO PCT/JP2013/067164 patent/WO2014002919A1/en active Application Filing
- 2013-06-18 KR KR1020147036466A patent/KR102145008B1/ko active IP Right Grant
- 2013-06-28 TW TW102123349A patent/TW201412893A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010007057A (ja) | 2008-05-30 | 2010-01-14 | Toray Ind Inc | シロキサン系樹脂組成物およびこれを用いた光学デバイス |
JP2011256241A (ja) * | 2010-06-07 | 2011-12-22 | Shin-Etsu Chemical Co Ltd | 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20150023496A (ko) | 2015-03-05 |
JP6022236B2 (ja) | 2016-11-09 |
TW201412893A (zh) | 2014-04-01 |
JP2014009272A (ja) | 2014-01-20 |
WO2014002919A1 (en) | 2014-01-03 |
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E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |