KR102145008B1 - 코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 - Google Patents

코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 Download PDF

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KR102145008B1
KR102145008B1 KR1020147036466A KR20147036466A KR102145008B1 KR 102145008 B1 KR102145008 B1 KR 102145008B1 KR 1020147036466 A KR1020147036466 A KR 1020147036466A KR 20147036466 A KR20147036466 A KR 20147036466A KR 102145008 B1 KR102145008 B1 KR 102145008B1
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South Korea
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polycyclic aromatic
condensed polycyclic
coating agent
aromatic group
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KR1020147036466A
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English (en)
Korean (ko)
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KR20150023496A (ko
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요시쓰구 모리타
마사아키 아마코
미치타카 스토
가쓰야 바바
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듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤
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Application filed by 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 filed Critical 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤
Publication of KR20150023496A publication Critical patent/KR20150023496A/ko
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80Siloxanes having aromatic substituents, e.g. phenyl side groups
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020147036466A 2012-06-28 2013-06-18 코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 KR102145008B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-146163 2012-06-28
JP2012146163A JP6022236B2 (ja) 2012-06-28 2012-06-28 コーティング剤、電気・電子機器、および電気・電子機器の金属部の保護方法
PCT/JP2013/067164 WO2014002919A1 (en) 2012-06-28 2013-06-18 Coating agent, electrical-electronic equipment, and method for protecting metal parts of electrical-electronic equipment

Publications (2)

Publication Number Publication Date
KR20150023496A KR20150023496A (ko) 2015-03-05
KR102145008B1 true KR102145008B1 (ko) 2020-08-18

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KR1020147036466A KR102145008B1 (ko) 2012-06-28 2013-06-18 코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법

Country Status (4)

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JP (1) JP6022236B2 (ja)
KR (1) KR102145008B1 (ja)
TW (1) TW201412893A (ja)
WO (1) WO2014002919A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI763735B (zh) * 2016-12-09 2022-05-11 美商道康寧公司 組成物、光漫散器和由其所形成之裝置、及相關方法
JP2019131734A (ja) * 2018-02-01 2019-08-08 信越化学工業株式会社 2液付加反応硬化型放熱シリコーン組成物及びその製造方法
EP3663346B1 (de) * 2018-12-04 2023-11-15 Evonik Operations GmbH Reaktivsiloxane
EP3919550A1 (de) * 2020-06-02 2021-12-08 Evonik Operations GmbH Lineare acetoxygruppen-tragende siloxane und folgeprodukte

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010007057A (ja) 2008-05-30 2010-01-14 Toray Ind Inc シロキサン系樹脂組成物およびこれを用いた光学デバイス
JP2011256241A (ja) * 2010-06-07 2011-12-22 Shin-Etsu Chemical Co Ltd 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置

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JPS6043872B2 (ja) * 1979-09-29 1985-09-30 信越化学工業株式会社 熱硬化性オルガノポリシロキサン組成物
JPH07238259A (ja) * 1994-03-01 1995-09-12 Toray Dow Corning Silicone Co Ltd コンフォーマルコーティング剤
JP3540356B2 (ja) * 1994-03-14 2004-07-07 東レ・ダウコーニング・シリコーン株式会社 コンフォーマルコーティング剤
US5545830A (en) * 1994-12-30 1996-08-13 Dow Corning Corporation Curable fluorescent organopolysiloxane compositions
JP2001192842A (ja) * 1999-11-05 2001-07-17 Ishizuka Glass Co Ltd 金属用処理剤、コーティング被膜付金属材料、金属樹脂複合成形体
GB0118473D0 (en) * 2001-07-28 2001-09-19 Dow Corning High refractive index polysiloxanes and their preparation
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2004149611A (ja) * 2002-10-29 2004-05-27 Dow Corning Toray Silicone Co Ltd 電気・電子機器の金属製導電部の保護方法
JP2007220714A (ja) * 2006-02-14 2007-08-30 Matsushita Electric Ind Co Ltd 抵抗器およびその製造方法
JP5586820B2 (ja) * 2006-07-21 2014-09-10 東京応化工業株式会社 高屈折率材料
JP5231774B2 (ja) * 2007-09-07 2013-07-10 リンテック株式会社 両面粘着シート
JP5376210B2 (ja) * 2008-01-31 2013-12-25 東レ・ファインケミカル株式会社 縮合多環式炭化水素基を有するシリコーン共重合体及びその製造方法
JP5158594B2 (ja) * 2008-05-21 2013-03-06 東レ・ファインケミカル株式会社 ナフタレン環を有するシリコーン重合体、およびその組成物
KR20140048240A (ko) * 2011-07-07 2014-04-23 다우 코닝 도레이 캄파니 리미티드 오르가노폴리실록산 및 그 제조 방법
WO2013005858A1 (ja) * 2011-07-07 2013-01-10 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010007057A (ja) 2008-05-30 2010-01-14 Toray Ind Inc シロキサン系樹脂組成物およびこれを用いた光学デバイス
JP2011256241A (ja) * 2010-06-07 2011-12-22 Shin-Etsu Chemical Co Ltd 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置

Also Published As

Publication number Publication date
KR20150023496A (ko) 2015-03-05
JP6022236B2 (ja) 2016-11-09
TW201412893A (zh) 2014-04-01
JP2014009272A (ja) 2014-01-20
WO2014002919A1 (en) 2014-01-03

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