KR102145008B1 - 코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 - Google Patents
코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 Download PDFInfo
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- KR102145008B1 KR102145008B1 KR1020147036466A KR20147036466A KR102145008B1 KR 102145008 B1 KR102145008 B1 KR 102145008B1 KR 1020147036466 A KR1020147036466 A KR 1020147036466A KR 20147036466 A KR20147036466 A KR 20147036466A KR 102145008 B1 KR102145008 B1 KR 102145008B1
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- polycyclic aromatic
- condensed polycyclic
- coating agent
- aromatic group
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- 239000011248 coating agent Substances 0.000 title claims abstract description 105
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 21
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 86
- 239000003518 caustics Substances 0.000 claims abstract description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 54
- 125000003342 alkenyl group Chemical group 0.000 claims description 38
- 239000000203 mixture Substances 0.000 claims description 37
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 125000001624 naphthyl group Chemical group 0.000 claims description 21
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 20
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 abstract description 47
- 238000005260 corrosion Methods 0.000 abstract description 47
- -1 anthracenyl ethyl group Chemical group 0.000 description 129
- 229910000077 silane Inorganic materials 0.000 description 29
- 125000003545 alkoxy group Chemical group 0.000 description 26
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 26
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 24
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 18
- 238000000576 coating method Methods 0.000 description 18
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 17
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 16
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- 238000004519 manufacturing process Methods 0.000 description 12
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- 125000001309 chloro group Chemical group Cl* 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
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- 230000000052 comparative effect Effects 0.000 description 6
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical group C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 6
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- 239000011593 sulfur Substances 0.000 description 5
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- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
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- 239000004954 Polyphthalamide Substances 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- MLPRTGXXQKWLDM-UHFFFAOYSA-N hydroxy-methyl-diphenylsilane Chemical compound C=1C=CC=CC=1[Si](O)(C)C1=CC=CC=C1 MLPRTGXXQKWLDM-UHFFFAOYSA-N 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 4
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- 239000005051 trimethylchlorosilane Substances 0.000 description 4
- QHUNJMXHQHHWQP-UHFFFAOYSA-N trimethylsilyl acetate Chemical compound CC(=O)O[Si](C)(C)C QHUNJMXHQHHWQP-UHFFFAOYSA-N 0.000 description 4
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 3
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- KPWVUBSQUODFPP-UHFFFAOYSA-N ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane Chemical compound C=1C=CC=CC=1[Si](C)(C=C)O[Si](C)(C=C)C1=CC=CC=C1 KPWVUBSQUODFPP-UHFFFAOYSA-N 0.000 description 3
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
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- AWFOOUAPWFZKQK-UHFFFAOYSA-N (acetyloxy-methyl-phenylsilyl) acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)C1=CC=CC=C1 AWFOOUAPWFZKQK-UHFFFAOYSA-N 0.000 description 2
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- YQJPWWLJDNCSCN-UHFFFAOYSA-N 1,3-diphenyltetramethyldisiloxane Chemical compound C=1C=CC=CC=1[Si](C)(C)O[Si](C)(C)C1=CC=CC=C1 YQJPWWLJDNCSCN-UHFFFAOYSA-N 0.000 description 2
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- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2012-146163 | 2012-06-28 | ||
| JP2012146163A JP6022236B2 (ja) | 2012-06-28 | 2012-06-28 | コーティング剤、電気・電子機器、および電気・電子機器の金属部の保護方法 |
| PCT/JP2013/067164 WO2014002919A1 (en) | 2012-06-28 | 2013-06-18 | Coating agent, electrical-electronic equipment, and method for protecting metal parts of electrical-electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| KR20150023496A KR20150023496A (ko) | 2015-03-05 |
| KR102145008B1 true KR102145008B1 (ko) | 2020-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020147036466A KR102145008B1 (ko) | 2012-06-28 | 2013-06-18 | 코팅제, 전기-전자 기기, 및 전기-전자 기기의 금속부의 보호 방법 |
Country Status (4)
| Country | Link |
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| JP (1) | JP6022236B2 (fi) |
| KR (1) | KR102145008B1 (fi) |
| TW (1) | TW201412893A (fi) |
| WO (1) | WO2014002919A1 (fi) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI763735B (zh) * | 2016-12-09 | 2022-05-11 | 美商道康寧公司 | 組成物、光漫散器和由其所形成之裝置、及相關方法 |
| JP2019131734A (ja) * | 2018-02-01 | 2019-08-08 | 信越化学工業株式会社 | ２液付加反応硬化型放熱シリコーン組成物及びその製造方法 |
| ES2970332T3 (es) * | 2018-12-04 | 2024-05-28 | Evonik Operations Gmbh | Siloxanos reactivos |
| EP3919550A1 (de) * | 2020-06-02 | 2021-12-08 | Evonik Operations GmbH | Lineare acetoxygruppen-tragende siloxane und folgeprodukte |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010007057A (ja) | 2008-05-30 | 2010-01-14 | Toray Ind Inc | シロキサン系樹脂組成物およびこれを用いた光学デバイス |
| JP2011256241A (ja) * | 2010-06-07 | 2011-12-22 | Shin-Etsu Chemical Co Ltd | 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6043872B2 (ja) * | 1979-09-29 | 1985-09-30 | 信越化学工業株式会社 | 熱硬化性オルガノポリシロキサン組成物 |
| JPH07238259A (ja) * | 1994-03-01 | 1995-09-12 | Toray Dow Corning Silicone Co Ltd | コンフォーマルコーティング剤 |
| JP3540356B2 (ja) * | 1994-03-14 | 2004-07-07 | 東レ・ダウコーニング・シリコーン株式会社 | コンフォーマルコーティング剤 |
| US5545830A (en) * | 1994-12-30 | 1996-08-13 | Dow Corning Corporation | Curable fluorescent organopolysiloxane compositions |
| JP2001192842A (ja) * | 1999-11-05 | 2001-07-17 | Ishizuka Glass Co Ltd | 金属用処理剤、コーティング被膜付金属材料、金属樹脂複合成形体 |
| GB0118473D0 (en) * | 2001-07-28 | 2001-09-19 | Dow Corning | High refractive index polysiloxanes and their preparation |
| JP4409160B2 (ja) * | 2002-10-28 | 2010-02-03 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP2004149611A (ja) * | 2002-10-29 | 2004-05-27 | Dow Corning Toray Silicone Co Ltd | 電気・電子機器の金属製導電部の保護方法 |
| JP2007220714A (ja) * | 2006-02-14 | 2007-08-30 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
| JP5586820B2 (ja) * | 2006-07-21 | 2014-09-10 | 東京応化工業株式会社 | 高屈折率材料 |
| JP5231774B2 (ja) * | 2007-09-07 | 2013-07-10 | リンテック株式会社 | 両面粘着シート |
| JP5376210B2 (ja) * | 2008-01-31 | 2013-12-25 | 東レ・ファインケミカル株式会社 | 縮合多環式炭化水素基を有するシリコーン共重合体及びその製造方法 |
| JP5158594B2 (ja) * | 2008-05-21 | 2013-03-06 | 東レ・ファインケミカル株式会社 | ナフタレン環を有するシリコーン重合体、およびその組成物 |
| US20140187733A1 (en) * | 2011-07-07 | 2014-07-03 | Dow Corning Toray Co., Ltd. | Organopolysiloxane, And Method For Producing Same |
| US20140191161A1 (en) * | 2011-07-07 | 2014-07-10 | Masaaki Amako | Curable Silicon Composition, Cured Product Thereof, And Optical Semiconductor Device |
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2012
- 2012-06-28 JP JP2012146163A patent/JP6022236B2/ja active Active
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2013
- 2013-06-18 WO PCT/JP2013/067164 patent/WO2014002919A1/en active Application Filing
- 2013-06-18 KR KR1020147036466A patent/KR102145008B1/ko active IP Right Grant
- 2013-06-28 TW TW102123349A patent/TW201412893A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010007057A (ja) | 2008-05-30 | 2010-01-14 | Toray Ind Inc | シロキサン系樹脂組成物およびこれを用いた光学デバイス |
| JP2011256241A (ja) * | 2010-06-07 | 2011-12-22 | Shin-Etsu Chemical Co Ltd | 硬化性オルガノポリシロキサン組成物及びそれを用いた半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014002919A1 (en) | 2014-01-03 |
| KR20150023496A (ko) | 2015-03-05 |
| TW201412893A (zh) | 2014-04-01 |
| JP6022236B2 (ja) | 2016-11-09 |
| JP2014009272A (ja) | 2014-01-20 |
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