KR102142744B1 - 도전성 페이스트, 도전성 막, 전기 회로 및 터치 패널 - Google Patents

도전성 페이스트, 도전성 막, 전기 회로 및 터치 패널 Download PDF

Info

Publication number
KR102142744B1
KR102142744B1 KR1020157022160A KR20157022160A KR102142744B1 KR 102142744 B1 KR102142744 B1 KR 102142744B1 KR 1020157022160 A KR1020157022160 A KR 1020157022160A KR 20157022160 A KR20157022160 A KR 20157022160A KR 102142744 B1 KR102142744 B1 KR 102142744B1
Authority
KR
South Korea
Prior art keywords
conductive
conductive paste
parts
resin
ion trapping
Prior art date
Application number
KR1020157022160A
Other languages
English (en)
Korean (ko)
Other versions
KR20150109406A (ko
Inventor
료 하마사키
Original Assignee
도요보 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도요보 가부시키가이샤 filed Critical 도요보 가부시키가이샤
Publication of KR20150109406A publication Critical patent/KR20150109406A/ko
Application granted granted Critical
Publication of KR102142744B1 publication Critical patent/KR102142744B1/ko

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
KR1020157022160A 2013-01-18 2014-01-10 도전성 페이스트, 도전성 막, 전기 회로 및 터치 패널 KR102142744B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013007582 2013-01-18
JPJP-P-2013-007582 2013-01-18
PCT/JP2014/050293 WO2014112433A1 (ja) 2013-01-18 2014-01-10 導電性ペースト、導電性膜、電気回路及びタッチパネル

Publications (2)

Publication Number Publication Date
KR20150109406A KR20150109406A (ko) 2015-10-01
KR102142744B1 true KR102142744B1 (ko) 2020-08-07

Family

ID=51209524

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157022160A KR102142744B1 (ko) 2013-01-18 2014-01-10 도전성 페이스트, 도전성 막, 전기 회로 및 터치 패널

Country Status (5)

Country Link
JP (1) JP5751509B2 (ja)
KR (1) KR102142744B1 (ja)
CN (1) CN104919538B (ja)
TW (1) TWI525644B (ja)
WO (1) WO2014112433A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259270B2 (ja) * 2013-12-04 2018-01-10 京都エレックス株式会社 熱硬化型導電性ペースト組成物
CN105788702B (zh) * 2014-12-18 2017-09-26 上海宝银电子材料有限公司 一种电容式触摸屏精细线路丝网印刷用导电银浆
CN105788701B (zh) * 2014-12-18 2017-08-01 上海宝银电子材料有限公司 一种电容式触摸屏精细线路激光蚀刻用导电银浆
JP2016173933A (ja) * 2015-03-17 2016-09-29 昭和電工株式会社 導電性ペースト、導電パターン及び導電パターンの製造方法
CN105070349A (zh) * 2015-08-10 2015-11-18 东莞市通美电子科技有限公司 电容式触摸屏专用导电细线印刷银浆及其制备、使用方法
CN107446475A (zh) * 2016-05-30 2017-12-08 太阳油墨制造株式会社 导电性树脂组合物
EP3315562B1 (en) * 2016-09-02 2019-06-26 Teikoku Printing Inks Mfg. Co., Ltd Electroconductive liquid composition
JP6293318B1 (ja) * 2017-01-20 2018-03-14 株式会社トーキン 固体電解コンデンサ
EP3675139A4 (en) * 2017-08-24 2021-05-12 Toyobo Co., Ltd. CONDUCTIVE PASTE, THREE-DIMENSIONAL BOARD, TOUCH SENSOR AND METHOD OF MANUFACTURING THESE PRODUCTS
KR20220020265A (ko) * 2019-06-12 2022-02-18 교토 에렉스 가부시키가이샤 도전성 페이스트 조성물
CN110343454B (zh) * 2019-08-14 2020-10-27 苏州高泰电子技术股份有限公司 导电炭黑涂布液及导电薄膜
CN111925712A (zh) * 2020-08-04 2020-11-13 安徽斯瑞尔阀门有限公司 一种用于止回阀的防锈涂层及其制备方法
CN112309608A (zh) * 2020-11-09 2021-02-02 无锡晶睿光电新材料有限公司 一种抗异色低温导电银浆及其制备方法
CN113450943B (zh) * 2021-09-02 2022-01-04 西安宏星电子浆料科技股份有限公司 一种抗热震型厚膜电路用导体浆料
CN113948236B (zh) * 2021-12-21 2022-03-29 西安宏星电子浆料科技股份有限公司 一种耐磨损高精度油位传感器用厚膜银钯导体浆料
CN115206587A (zh) * 2022-07-05 2022-10-18 北京梦之墨科技有限公司 一种耐盐雾型导电浆料及电子器件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006302825A (ja) * 2005-04-25 2006-11-02 Toyobo Co Ltd 導電性ペースト

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662858A (en) * 1979-10-26 1981-05-29 Fujikura Kasei Kk Electrically conductive coating material
JPS6345702A (ja) * 1986-08-11 1988-02-26 東亞合成株式会社 金属含有ペ−スト
CN1908065B (zh) 2005-08-05 2010-12-08 信越化学工业株式会社 环氧树脂组合物以及半导体装置
KR101181591B1 (ko) * 2006-10-04 2012-09-10 히다치 가세고교 가부시끼가이샤 다이본딩용 수지 페이스트, 반도체장치의 제조방법 및 반도체장치
WO2011046076A1 (ja) * 2009-10-15 2011-04-21 東洋紡績株式会社 導電性ペースト、導電性膜、タッチパネル、及び導電性薄膜の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006302825A (ja) * 2005-04-25 2006-11-02 Toyobo Co Ltd 導電性ペースト

Also Published As

Publication number Publication date
TW201443922A (zh) 2014-11-16
TWI525644B (zh) 2016-03-11
KR20150109406A (ko) 2015-10-01
JP5751509B2 (ja) 2015-07-22
CN104919538A (zh) 2015-09-16
JPWO2014112433A1 (ja) 2017-01-19
WO2014112433A1 (ja) 2014-07-24
CN104919538B (zh) 2018-04-27

Similar Documents

Publication Publication Date Title
KR102142744B1 (ko) 도전성 페이스트, 도전성 막, 전기 회로 및 터치 패널
KR101223408B1 (ko) 도전성 페이스트, 도전성 막, 터치 패널 및 도전성 박막의 제조 방법
JP6458820B2 (ja) レーザーエッチング加工用導電性ペースト、導電性薄膜および導電性積層体
TWI648748B (zh) Conductive paste, conductive coating film, electrical circuit, conductive laminate, and touch panel
JP6343903B2 (ja) 導電性ペースト及びこれを用いた印刷回路
WO2018092762A1 (ja) 導電性ペースト、導電性膜、導電性膜の製造方法、導電性微細配線、導電性微細配線の製造方法。
JP6303367B2 (ja) 導電性ペースト、導電性膜及びタッチパネル
CN111512398B (zh) 导电性浆料

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant