CN104919538B - 导电浆料、导电薄膜、电路及触摸面板 - Google Patents

导电浆料、导电薄膜、电路及触摸面板 Download PDF

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Publication number
CN104919538B
CN104919538B CN201480005275.2A CN201480005275A CN104919538B CN 104919538 B CN104919538 B CN 104919538B CN 201480005275 A CN201480005275 A CN 201480005275A CN 104919538 B CN104919538 B CN 104919538B
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CN
China
Prior art keywords
parts
electrocondution slurry
resin
ion trap
weight
Prior art date
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Application number
CN201480005275.2A
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English (en)
Chinese (zh)
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CN104919538A (zh
Inventor
滨崎亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongyang Textile Mc Co ltd
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Toyobo Co Ltd
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Publication date
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Publication of CN104919538A publication Critical patent/CN104919538A/zh
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Publication of CN104919538B publication Critical patent/CN104919538B/zh
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0323Carbon

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
CN201480005275.2A 2013-01-18 2014-01-10 导电浆料、导电薄膜、电路及触摸面板 Active CN104919538B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-007582 2013-01-18
JP2013007582 2013-01-18
PCT/JP2014/050293 WO2014112433A1 (ja) 2013-01-18 2014-01-10 導電性ペースト、導電性膜、電気回路及びタッチパネル

Publications (2)

Publication Number Publication Date
CN104919538A CN104919538A (zh) 2015-09-16
CN104919538B true CN104919538B (zh) 2018-04-27

Family

ID=51209524

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480005275.2A Active CN104919538B (zh) 2013-01-18 2014-01-10 导电浆料、导电薄膜、电路及触摸面板

Country Status (5)

Country Link
JP (1) JP5751509B2 (ja)
KR (1) KR102142744B1 (ja)
CN (1) CN104919538B (ja)
TW (1) TWI525644B (ja)
WO (1) WO2014112433A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259270B2 (ja) * 2013-12-04 2018-01-10 京都エレックス株式会社 熱硬化型導電性ペースト組成物
CN105788701B (zh) * 2014-12-18 2017-08-01 上海宝银电子材料有限公司 一种电容式触摸屏精细线路激光蚀刻用导电银浆
CN105788702B (zh) * 2014-12-18 2017-09-26 上海宝银电子材料有限公司 一种电容式触摸屏精细线路丝网印刷用导电银浆
JP2016173933A (ja) * 2015-03-17 2016-09-29 昭和電工株式会社 導電性ペースト、導電パターン及び導電パターンの製造方法
CN105070349A (zh) * 2015-08-10 2015-11-18 东莞市通美电子科技有限公司 电容式触摸屏专用导电细线印刷银浆及其制备、使用方法
CN107446475A (zh) * 2016-05-30 2017-12-08 太阳油墨制造株式会社 导电性树脂组合物
EP3315562B1 (en) * 2016-09-02 2019-06-26 Teikoku Printing Inks Mfg. Co., Ltd Electroconductive liquid composition
JP6293318B1 (ja) * 2017-01-20 2018-03-14 株式会社トーキン 固体電解コンデンサ
US20200176146A1 (en) * 2017-08-24 2020-06-04 Toyobo Co., Ltd. Electrically conductive paste, three-dimensional printed circuit, touch sensor, and method for producing the same
CN113924629B (zh) * 2019-06-12 2024-04-09 京都一来电子化学股份有限公司 导电性膏体组合物
CN110343454B (zh) * 2019-08-14 2020-10-27 苏州高泰电子技术股份有限公司 导电炭黑涂布液及导电薄膜
CN111925712A (zh) * 2020-08-04 2020-11-13 安徽斯瑞尔阀门有限公司 一种用于止回阀的防锈涂层及其制备方法
CN112309608A (zh) * 2020-11-09 2021-02-02 无锡晶睿光电新材料有限公司 一种抗异色低温导电银浆及其制备方法
CN113450943B (zh) * 2021-09-02 2022-01-04 西安宏星电子浆料科技股份有限公司 一种抗热震型厚膜电路用导体浆料
CN113948236B (zh) * 2021-12-21 2022-03-29 西安宏星电子浆料科技股份有限公司 一种耐磨损高精度油位传感器用厚膜银钯导体浆料
CN115206587A (zh) * 2022-07-05 2022-10-18 北京梦之墨科技有限公司 一种耐盐雾型导电浆料及电子器件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662858A (en) * 1979-10-26 1981-05-29 Fujikura Kasei Kk Electrically conductive coating material
JPS6345702A (ja) * 1986-08-11 1988-02-26 東亞合成株式会社 金属含有ペ−スト
JP4547623B2 (ja) * 2005-04-25 2010-09-22 東洋紡績株式会社 導電性ペースト
US20070029682A1 (en) 2005-08-05 2007-02-08 Shin-Etsu Chemical Co., Ltd. Epoxy resin composition and semiconductor device
KR101181591B1 (ko) * 2006-10-04 2012-09-10 히다치 가세고교 가부시끼가이샤 다이본딩용 수지 페이스트, 반도체장치의 제조방법 및 반도체장치
CN102576581B (zh) * 2009-10-15 2015-07-22 东洋纺织株式会社 导电性膏、导电性膜、触摸面板以及导电性薄膜的制造方法

Also Published As

Publication number Publication date
TWI525644B (zh) 2016-03-11
JP5751509B2 (ja) 2015-07-22
TW201443922A (zh) 2014-11-16
KR102142744B1 (ko) 2020-08-07
JPWO2014112433A1 (ja) 2017-01-19
CN104919538A (zh) 2015-09-16
KR20150109406A (ko) 2015-10-01
WO2014112433A1 (ja) 2014-07-24

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PB01 Publication
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SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP02 Change in the address of a patent holder

Address after: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan

Patentee after: TOYOBO Co.,Ltd.

Address before: Japan's Osaka Osaka North Doushima Haji chome 2 times 8

Patentee before: TOYOBO Co.,Ltd.

CP02 Change in the address of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20230801

Address after: South Building, Meitian Twin Towers, No. 13-1, Meitian 1-chome, Kita ku, Osaka City, Osaka Prefecture, Japan

Patentee after: Dongyang Textile MC Co.,Ltd.

Address before: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan

Patentee before: TOYOBO Co.,Ltd.

TR01 Transfer of patent right