KR102136782B1 - 리드 프레임을 제조하는 방법 - Google Patents

리드 프레임을 제조하는 방법 Download PDF

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Publication number
KR102136782B1
KR102136782B1 KR1020197016537A KR20197016537A KR102136782B1 KR 102136782 B1 KR102136782 B1 KR 102136782B1 KR 1020197016537 A KR1020197016537 A KR 1020197016537A KR 20197016537 A KR20197016537 A KR 20197016537A KR 102136782 B1 KR102136782 B1 KR 102136782B1
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KR
South Korea
Prior art keywords
lead frame
stamping
electrode contact
gap width
connecting bar
Prior art date
Application number
KR1020197016537A
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English (en)
Korean (ko)
Other versions
KR20190082877A (ko
Inventor
위안 시에
유르겐 메르텐스
제 쿠앙 리
난 천
Original Assignee
루미리즈 홀딩 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 루미리즈 홀딩 비.브이. filed Critical 루미리즈 홀딩 비.브이.
Publication of KR20190082877A publication Critical patent/KR20190082877A/ko
Application granted granted Critical
Publication of KR102136782B1 publication Critical patent/KR102136782B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Led Device Packages (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020197016537A 2016-11-11 2017-11-06 리드 프레임을 제조하는 방법 KR102136782B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CNPCT/CN2016/105450 2016-11-11
CN2016105450 2016-11-11
EP16203504.2 2016-12-12
EP16203504 2016-12-12
PCT/EP2017/078293 WO2018087027A1 (fr) 2016-11-11 2017-11-06 Procédé de fabrication d'une grille de connexion

Publications (2)

Publication Number Publication Date
KR20190082877A KR20190082877A (ko) 2019-07-10
KR102136782B1 true KR102136782B1 (ko) 2020-07-23

Family

ID=60702589

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197016537A KR102136782B1 (ko) 2016-11-11 2017-11-06 리드 프레임을 제조하는 방법

Country Status (6)

Country Link
US (1) US20190371989A1 (fr)
EP (1) EP3526821B1 (fr)
JP (1) JP6748303B2 (fr)
KR (1) KR102136782B1 (fr)
CN (1) CN109983591B (fr)
WO (1) WO2018087027A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012657A (ja) 2005-06-28 2007-01-18 Matsushita Electric Ind Co Ltd 半導体装置用リードフレームとその製造方法
JP2007201233A (ja) 2006-01-27 2007-08-09 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
JP2013236005A (ja) * 2012-05-10 2013-11-21 Dainippon Printing Co Ltd Ｌｅｄ用リードフレーム及び当該ｌｅｄ用リードフレームを用いた半導体装置
JP2015144270A (ja) 2013-12-26 2015-08-06 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、ｌｅｄ素子搭載用樹脂付きリードフレーム及び半導体装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650232A (en) * 1970-09-08 1972-03-21 Amp Inc Method and apparatus for manufacturing lead frames
JPS57133655A (en) 1981-02-10 1982-08-18 Pioneer Electronic Corp Lead frame
JPH05144992A (ja) * 1991-11-18 1993-06-11 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
US5631192A (en) * 1995-10-02 1997-05-20 Motorola, Inc. Semiconductor device on an opposed leadframe and method for making
US7193299B2 (en) * 2001-08-21 2007-03-20 Osram Opto Semiconductors Gmbh Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components
JP2003204027A (ja) * 2002-01-09 2003-07-18 Matsushita Electric Ind Co Ltd リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法
US7790500B2 (en) * 2002-04-29 2010-09-07 Unisem (Mauritius) Holdings Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US6996897B2 (en) * 2002-07-31 2006-02-14 Freescale Semiconductor, Inc. Method of making a mount for electronic devices
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
KR100568225B1 (ko) * 2003-11-06 2006-04-07 삼성전자주식회사 리드 프레임 및 이를 적용한 반도체 패키지 제조방법
KR20050083322A (ko) * 2004-02-23 2005-08-26 삼성테크윈 주식회사 반도체 패키지용 리이드 프레임과 이의 제조방법
CN101174508B (zh) * 2006-10-31 2011-11-23 Nec东金株式会社 引线框、倒装端子固体电解电容器及用引线框制造其方法
US7683463B2 (en) * 2007-04-19 2010-03-23 Fairchild Semiconductor Corporation Etched leadframe structure including recesses
CN101312177A (zh) * 2007-05-22 2008-11-26 飞思卡尔半导体（中国）有限公司 用于半导体器件的引线框
US9172012B2 (en) * 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
CN102214631A (zh) * 2010-04-09 2011-10-12 飞思卡尔半导体公司 用于半导体装置的引线框
EP2591279B1 (fr) * 2010-07-08 2013-10-23 Koninklijke Philips N.V. Ensemble d'éclairage à diode électroluminescente de grille de connexion
MY165522A (en) * 2011-01-06 2018-04-02 Carsem M Sdn Bhd Leadframe packagewith die mounted on pedetal that isolates leads
TWI397964B (zh) * 2011-01-19 2013-06-01 Unisem Mauritius Holdings Ltd 部分圖案化之引線框架及其在半導體封裝中製作與使用的方法
CN102738024A (zh) * 2011-04-01 2012-10-17 飞思卡尔半导体公司 半导体封装及其引线框
DE102012109159A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Leiterrahmenverbund, Gehäuseverbund, Baugruppenverbund und Verfahren zum Ermitteln mindestens eines Messwerts einer Messgröße einer elektronischen Baugruppe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007012657A (ja) 2005-06-28 2007-01-18 Matsushita Electric Ind Co Ltd 半導体装置用リードフレームとその製造方法
JP2007201233A (ja) 2006-01-27 2007-08-09 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
JP2013236005A (ja) * 2012-05-10 2013-11-21 Dainippon Printing Co Ltd Ｌｅｄ用リードフレーム及び当該ｌｅｄ用リードフレームを用いた半導体装置
JP2015144270A (ja) 2013-12-26 2015-08-06 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、ｌｅｄ素子搭載用樹脂付きリードフレーム及び半導体装置

Also Published As

Publication number Publication date
EP3526821A1 (fr) 2019-08-21
US20190371989A1 (en) 2019-12-05
CN109983591B (zh) 2022-10-04
KR20190082877A (ko) 2019-07-10
CN109983591A (zh) 2019-07-05
EP3526821B1 (fr) 2020-09-30
WO2018087027A1 (fr) 2018-05-17
JP6748303B2 (ja) 2020-08-26
JP2019536276A (ja) 2019-12-12

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