KR102123407B1 - 전자 장치를 둘러싸기 위한 감압 접착제 - Google Patents

전자 장치를 둘러싸기 위한 감압 접착제 Download PDF

Info

Publication number
KR102123407B1
KR102123407B1 KR1020157007489A KR20157007489A KR102123407B1 KR 102123407 B1 KR102123407 B1 KR 102123407B1 KR 1020157007489 A KR1020157007489 A KR 1020157007489A KR 20157007489 A KR20157007489 A KR 20157007489A KR 102123407 B1 KR102123407 B1 KR 102123407B1
Authority
KR
South Korea
Prior art keywords
sensitive adhesive
pressure
fluorine
elastomer
tetrafluoroethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157007489A
Other languages
English (en)
Korean (ko)
Other versions
KR20150050571A (ko
Inventor
클라우스 카이테-텔겐뷔셔
얀 엘링어
Original Assignee
테사 소시에타스 유로파에아
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테사 소시에타스 유로파에아 filed Critical 테사 소시에타스 유로파에아
Publication of KR20150050571A publication Critical patent/KR20150050571A/ko
Application granted granted Critical
Publication of KR102123407B1 publication Critical patent/KR102123407B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09J127/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/16—Homopolymers or copolymers or vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H01L51/5246—
    • H01L51/5253—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C09J2201/606—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
KR1020157007489A 2012-08-24 2013-07-04 전자 장치를 둘러싸기 위한 감압 접착제 Active KR102123407B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102012215136.2 2012-08-24
DE102012215136 2012-08-24
DE102012219877.6A DE102012219877A1 (de) 2012-08-24 2012-10-30 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung
DE102012219877.6 2012-10-30
PCT/EP2013/064145 WO2014029545A1 (de) 2012-08-24 2013-07-04 Haftklebemasse insbesondere zur kapselung einer elektronischen anordnung

Publications (2)

Publication Number Publication Date
KR20150050571A KR20150050571A (ko) 2015-05-08
KR102123407B1 true KR102123407B1 (ko) 2020-06-16

Family

ID=50069636

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157007489A Active KR102123407B1 (ko) 2012-08-24 2013-07-04 전자 장치를 둘러싸기 위한 감압 접착제

Country Status (11)

Country Link
US (1) US9631127B2 (enExample)
EP (1) EP2888330B1 (enExample)
JP (1) JP6307079B2 (enExample)
KR (1) KR102123407B1 (enExample)
CN (1) CN104736654B (enExample)
BR (1) BR112015003675A2 (enExample)
DE (1) DE102012219877A1 (enExample)
IN (1) IN2015DN01249A (enExample)
PL (1) PL2888330T3 (enExample)
TW (1) TWI582188B (enExample)
WO (1) WO2014029545A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102852393B1 (ko) 2025-01-22 2025-09-01 주식회사 탑런토탈솔루션 밴드 감압접착제 조립장치

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013215149A1 (de) * 2013-08-01 2015-02-19 Conti Temic Microelectronic Gmbh Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät
JP5667282B1 (ja) * 2013-12-27 2015-02-12 古河電気工業株式会社 有機電界発光素子用充填材料及び有機電界発光素子の封止方法
US20170327717A1 (en) 2014-10-29 2017-11-16 Tesa Se Adhesive compounds containing getter materials that can be activated
JP6720473B2 (ja) * 2015-04-09 2020-07-08 Dic株式会社 発光装置、照明器具及び情報表示装置ならびに発光装置の製造方法
JP2017073379A (ja) * 2015-10-09 2017-04-13 荒川化学工業株式会社 非水系二次電池電極用バインダー、非水系二次電池電極形成用スラリー、非水系二次電池電極、非水系二次電池、リチウムイオン二次電池
CN105759511A (zh) * 2016-04-15 2016-07-13 京东方科技集团股份有限公司 显示面板及其制造方法和显示装置及其制造方法
US20190330496A1 (en) * 2016-06-15 2019-10-31 3M Innovative Properties Company Membrane electrode assembly component and method of making an assembly
CN109563397B (zh) 2016-08-10 2021-03-16 3M创新有限公司 氟化压敏粘合剂及其制品
WO2018181766A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 半導体装置の製造方法及び両面粘着シート
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
WO2019027899A1 (en) * 2017-07-31 2019-02-07 Corning Incorporated ACCELERATED THERMAL CROSSLINKING OF PVDF-HFP BY ADDITION OF ORGANIC BASES, AND USE OF CROSS-LINKED PVDF-HFP AS DIELECTRIC GRID MATERIAL FOR ORGANIC TCM DEVICES
DE102017221270B4 (de) * 2017-11-28 2021-08-12 Tesa Se Verfahren zur Herstellung eines Siegelklebebandes und Verwendung
TWI678404B (zh) * 2017-11-29 2019-12-01 住華科技股份有限公司 感壓性黏著組成物、電極複合膜及其製造方法
CN111465669B (zh) 2017-12-06 2022-12-16 3M创新有限公司 阻隔性粘合剂组合物和制品
CN109335253A (zh) * 2018-08-30 2019-02-15 浙江时进包装有限公司 一种新型可重复封合自粘包装袋
CN110750449A (zh) * 2019-09-19 2020-02-04 中山大学 一种测试驱动的网页构件功能抽取方法
JP7445211B2 (ja) 2019-09-25 2024-03-07 大日本印刷株式会社 光学シート及びその製造方法
CN111858367A (zh) * 2020-07-24 2020-10-30 北京达佳互联信息技术有限公司 代码覆盖率测试方法、系统、装置、电子设备及存储介质
KR102905931B1 (ko) 2020-07-27 2025-12-29 삼성전자주식회사 연신 소자, 표시 패널, 센서 및 전자 장치
CN112996235B (zh) * 2021-02-10 2022-09-27 武汉天马微电子有限公司 一种柔性电路板、显示面板及绝缘膜
KR102715152B1 (ko) * 2021-09-03 2024-10-11 한국전자통신연구원 엔캡슐레이션한 유기발광소자 및 이의 제조방법
JP2023067788A (ja) * 2021-10-29 2023-05-16 株式会社リコー 光電変換素子、および光電変換素子モジュール
CN117171057B (zh) * 2023-11-02 2024-01-26 沐曦集成电路(上海)有限公司 芯片软硬件联合仿真阶段的软件代码覆盖率确定系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4647157A (en) 1984-12-04 1987-03-03 Polaroid Corporation Fluoroelastomeric sealants for liquid crystal cells
JP2611498B2 (ja) * 1989-05-26 1997-05-21 ダイキン工業株式会社 含フッ素ゴム組成物

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
JPS584728B2 (ja) 1976-06-30 1983-01-27 ダイキン工業株式会社 含フツ素系多元セグメント化ポリマ−の製法
GB1552046A (en) 1977-02-02 1979-09-05 Ciba Geigy Ag Film adhesives
JPS5386786A (en) 1977-09-30 1978-07-31 Daikin Ind Ltd Polymer having fluoring-containing segment and production
JPS5657811A (en) 1979-10-17 1981-05-20 Daikin Ind Ltd Preparation of liquid fluorine-containing polymer
JPS5759972A (en) 1980-09-26 1982-04-10 Daikin Ind Ltd Pressure-sensitive adhesive composition
EP0107793A1 (en) * 1982-09-29 1984-05-09 Daikin Kogyo Co., Ltd. Carbon fiber-containing fluoroelastomer composition
JPS6028444A (ja) 1983-07-27 1985-02-13 Daikin Ind Ltd 加工容易な含フツ素熱可塑性ゴム組成物
JPS6057811A (ja) 1983-09-09 1985-04-03 Nippon Telegr & Teleph Corp <Ntt> プラステイツク光フアイバコ−ドの製造方法
ATE129518T1 (de) * 1988-12-21 1995-11-15 Raychem Corp Thermoplastischer fluorpolymer-klebstoff.
KR100430958B1 (ko) 1996-11-12 2004-05-12 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 열경화성의 감압성 접착제
DE10048059A1 (de) 2000-09-28 2002-04-18 Henkel Kgaa Klebstoff mit Barriereeigenschaften
KR20040019098A (ko) 2001-08-03 2004-03-04 디에스엠 엔.브이 표시 장치용 경화성 조성물
TW200402456A (en) 2002-06-17 2004-02-16 Sekisui Chemical Co Ltd Adhesive, tape and a double side adhensive tape for sealing organic electroluminescent element; an organic electroluminescent element and method thereof
US7098270B2 (en) 2002-09-10 2006-08-29 Freudenberg-Nok General Partnership Fluoroelastomer composition
JP4123002B2 (ja) 2003-02-19 2008-07-23 Ｎｏｋ株式会社 フッ素ゴム組成物
WO2006001363A1 (ja) * 2004-06-28 2006-01-05 Daikin Industries, Ltd. 含フッ素エラストマー組成物およびそれからなる成形品
US20070135552A1 (en) 2005-12-09 2007-06-14 General Atomics Gas barrier
JP2009088115A (ja) * 2007-09-28 2009-04-23 Shin Etsu Chem Co Ltd 車載用電気電子部品
JP5333442B2 (ja) * 2008-03-27 2013-11-06 ダイキン工業株式会社 パーオキサイド架橋系含フッ素エラストマー組成物
DE102008047964A1 (de) * 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
FR2943349B1 (fr) 2009-03-23 2012-10-26 Arkema France Procede de preparation d'un materiau composite elastomerique a haute teneur en nanotubes
JP5667412B2 (ja) * 2010-10-20 2015-02-12 日本メクトロン株式会社 シール構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4647157A (en) 1984-12-04 1987-03-03 Polaroid Corporation Fluoroelastomeric sealants for liquid crystal cells
JP2611498B2 (ja) * 1989-05-26 1997-05-21 ダイキン工業株式会社 含フッ素ゴム組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102852393B1 (ko) 2025-01-22 2025-09-01 주식회사 탑런토탈솔루션 밴드 감압접착제 조립장치

Also Published As

Publication number Publication date
PL2888330T3 (pl) 2017-09-29
CN104736654B (zh) 2017-10-20
JP2015531807A (ja) 2015-11-05
JP6307079B2 (ja) 2018-04-04
EP2888330B1 (de) 2017-06-21
US20150240134A1 (en) 2015-08-27
TW201418392A (zh) 2014-05-16
IN2015DN01249A (enExample) 2015-06-26
EP2888330A1 (de) 2015-07-01
KR20150050571A (ko) 2015-05-08
CN104736654A (zh) 2015-06-24
BR112015003675A2 (pt) 2017-07-04
WO2014029545A1 (de) 2014-02-27
TWI582188B (zh) 2017-05-11
US9631127B2 (en) 2017-04-25
DE102012219877A1 (de) 2014-02-27

Similar Documents

Publication Publication Date Title
US9631127B2 (en) Pressure-sensitive adhesive material particularly for encasing an electronic arrangement
TWI488242B (zh) 封裝電子零件之方法
TWI493004B (zh) 封裝電子零件之方法
CN102576821B (zh) 封装电子装置的方法
TWI663242B (zh) 用於封裝有機電子元件的膠帶及保護設置在基材上的有機電子元件之方法
JP6228566B2 (ja) 電子的装置のカプセル化方法
KR101915795B1 (ko) 접착제 물질, 특히, 전자 장치를 캡슐화하기 위한 접착제 물질
KR101623220B1 (ko) 접착성 캡슐화 조성물 및 그로 제조된 전자 소자
KR102064332B1 (ko) 접착제 조성물, 특히, 전자 장치를 캡슐화하기 위한 접착제 조성물.
CN101752276A (zh) 封装电子装置的方法
KR20110020862A (ko) 접착성 캡슐화 조성물 및 그것을 사용하여 제조한 전자 소자
KR20170116232A (ko) 유기 전자 디바이스용 소자 밀봉용 수지 조성물, 유기 전자 디바이스용 소자 밀봉용 수지 시트, 유기 일렉트로루미네센스 소자 및 화상 표시 장치
TWI681034B (zh) 具有可活化吸氣劑材料之黏著劑、其用途及應用方法，及保護有機電子裝置之方法
CN107001879A (zh) 包含硅烷水清除剂的oled相容性胶粘剂

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 7