DE102012219877A1 - Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung - Google Patents

Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung Download PDF

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Publication number
DE102012219877A1
DE102012219877A1 DE102012219877.6A DE102012219877A DE102012219877A1 DE 102012219877 A1 DE102012219877 A1 DE 102012219877A1 DE 102012219877 A DE102012219877 A DE 102012219877A DE 102012219877 A1 DE102012219877 A1 DE 102012219877A1
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DE
Germany
Prior art keywords
pressure
fluorine
sensitive adhesive
elastomer
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012219877.6A
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German (de)
English (en)
Inventor
Jan Ellinger
Klaus Keite-Telgenbüscher
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Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Priority to DE102012219877.6A priority Critical patent/DE102012219877A1/de
Priority to CN201380052807.3A priority patent/CN104736654B/zh
Priority to BR112015003675A priority patent/BR112015003675A2/pt
Priority to KR1020157007489A priority patent/KR102123407B1/ko
Priority to EP13735003.9A priority patent/EP2888330B1/de
Priority to PCT/EP2013/064145 priority patent/WO2014029545A1/de
Priority to PL13735003T priority patent/PL2888330T3/pl
Priority to US14/422,203 priority patent/US9631127B2/en
Priority to JP2015527819A priority patent/JP6307079B2/ja
Priority to TW102128657A priority patent/TWI582188B/zh
Publication of DE102012219877A1 publication Critical patent/DE102012219877A1/de
Priority to IN1249DEN2015 priority patent/IN2015DN01249A/en
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09J127/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/16—Homopolymers or copolymers or vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
DE102012219877.6A 2012-08-24 2012-10-30 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung Withdrawn DE102012219877A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE102012219877.6A DE102012219877A1 (de) 2012-08-24 2012-10-30 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung
PCT/EP2013/064145 WO2014029545A1 (de) 2012-08-24 2013-07-04 Haftklebemasse insbesondere zur kapselung einer elektronischen anordnung
BR112015003675A BR112015003675A2 (pt) 2012-08-24 2013-07-04 massa adesiva de aderência, particularmente, para encapsulamento de uma disposição eletrônica
KR1020157007489A KR102123407B1 (ko) 2012-08-24 2013-07-04 전자 장치를 둘러싸기 위한 감압 접착제
EP13735003.9A EP2888330B1 (de) 2012-08-24 2013-07-04 Haftklebemasse insbesondere zur kapselung einer elektronischen anordnung
CN201380052807.3A CN104736654B (zh) 2012-08-24 2013-07-04 特别用于包覆电子组件的压敏粘合剂材料
PL13735003T PL2888330T3 (pl) 2012-08-24 2013-07-04 Przyczepna masa klejąca, w szczególności do uszczelniania układu elektronicznego
US14/422,203 US9631127B2 (en) 2012-08-24 2013-07-04 Pressure-sensitive adhesive material particularly for encasing an electronic arrangement
JP2015527819A JP6307079B2 (ja) 2012-08-24 2013-07-04 特に電子的装置のカプセル化のための感圧接着剤
TW102128657A TWI582188B (zh) 2012-08-24 2013-08-09 用於電子裝置之封裝的壓敏性黏合劑
IN1249DEN2015 IN2015DN01249A (enExample) 2012-08-24 2015-02-16

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012215136 2012-08-24
DE102012215136.2 2012-08-24
DE102012219877.6A DE102012219877A1 (de) 2012-08-24 2012-10-30 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung

Publications (1)

Publication Number Publication Date
DE102012219877A1 true DE102012219877A1 (de) 2014-02-27

Family

ID=50069636

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012219877.6A Withdrawn DE102012219877A1 (de) 2012-08-24 2012-10-30 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung

Country Status (11)

Country Link
US (1) US9631127B2 (enExample)
EP (1) EP2888330B1 (enExample)
JP (1) JP6307079B2 (enExample)
KR (1) KR102123407B1 (enExample)
CN (1) CN104736654B (enExample)
BR (1) BR112015003675A2 (enExample)
DE (1) DE102012219877A1 (enExample)
IN (1) IN2015DN01249A (enExample)
PL (1) PL2888330T3 (enExample)
TW (1) TWI582188B (enExample)
WO (1) WO2014029545A1 (enExample)

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DE102013215149A1 (de) * 2013-08-01 2015-02-19 Conti Temic Microelectronic Gmbh Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät
JP5667282B1 (ja) * 2013-12-27 2015-02-12 古河電気工業株式会社 有機電界発光素子用充填材料及び有機電界発光素子の封止方法
JP6474489B2 (ja) * 2014-10-29 2019-02-27 テーザ・ソシエタス・ヨーロピア 活性化可能なゲッター材料を含む接着剤
JP6720473B2 (ja) * 2015-04-09 2020-07-08 Dic株式会社 発光装置、照明器具及び情報表示装置ならびに発光装置の製造方法
JP2017073379A (ja) * 2015-10-09 2017-04-13 荒川化学工業株式会社 非水系二次電池電極用バインダー、非水系二次電池電極形成用スラリー、非水系二次電池電極、非水系二次電池、リチウムイオン二次電池
CN105759511A (zh) * 2016-04-15 2016-07-13 京东方科技集团股份有限公司 显示面板及其制造方法和显示装置及其制造方法
KR20190020032A (ko) * 2016-06-15 2019-02-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 막 전극 조립체 구성요소 및 조립체의 제조 방법
US10822533B2 (en) 2016-08-10 2020-11-03 3M Innovative Properties Company Fluorinated pressure sensitive adhesives and articles thereof
KR102454056B1 (ko) * 2017-03-31 2022-10-14 린텍 가부시키가이샤 반도체 장치의 제조 방법 및 양면 점착 시트
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
CN110997832B (zh) * 2017-07-31 2023-05-05 康宁股份有限公司 经由添加有机碱的pvdf-hfp的加速热交联以及使用交联的pvdf-hfp作为otft装置的栅极介电材料
DE102017221270B4 (de) * 2017-11-28 2021-08-12 Tesa Se Verfahren zur Herstellung eines Siegelklebebandes und Verwendung
TWI678404B (zh) * 2017-11-29 2019-12-01 住華科技股份有限公司 感壓性黏著組成物、電極複合膜及其製造方法
WO2019111182A1 (en) 2017-12-06 2019-06-13 3M Innovative Properties Company Barrier adhesive compositions and articles
CN109335253A (zh) * 2018-08-30 2019-02-15 浙江时进包装有限公司 一种新型可重复封合自粘包装袋
CN110750449A (zh) * 2019-09-19 2020-02-04 中山大学 一种测试驱动的网页构件功能抽取方法
JP7445211B2 (ja) * 2019-09-25 2024-03-07 大日本印刷株式会社 光学シート及びその製造方法
CN111858367A (zh) * 2020-07-24 2020-10-30 北京达佳互联信息技术有限公司 代码覆盖率测试方法、系统、装置、电子设备及存储介质
US12245368B2 (en) * 2020-07-27 2025-03-04 Samsung Electronics Co., Ltd. Stretchable device and display panel and sensor and electronic device
CN112996235B (zh) * 2021-02-10 2022-09-27 武汉天马微电子有限公司 一种柔性电路板、显示面板及绝缘膜
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JPS533495A (en) 1976-06-30 1978-01-13 Daikin Ind Ltd Preparation of fluorine-containing polymer having plurality of chain segments
JPS5386786A (en) 1977-09-30 1978-07-31 Daikin Ind Ltd Polymer having fluoring-containing segment and production
JPS5657811A (en) 1979-10-17 1981-05-20 Daikin Ind Ltd Preparation of liquid fluorine-containing polymer
DE3138300A1 (de) * 1980-09-26 1982-06-03 Daikin Kogyo Co., Ltd., Osaka Klebstoffmischung
US4491536A (en) * 1982-09-29 1985-01-01 Daikin Kogyo Co., Ltd. Carbon fiber-containing fluoroelastomer composition
US4552604A (en) 1977-02-02 1985-11-12 Ciba Geigy Corporation Bonding method employing film adhesives
US4603175A (en) * 1983-07-27 1986-07-29 Daikin Industries, Inc. Thermoplastic fluoroelastomer composition
DE69019061T2 (de) * 1989-05-26 1995-10-05 Daikin Ind Ltd Fluorhaltige Elastomermischung.
DE68924656T2 (de) * 1988-12-21 1996-08-22 Raychem Corp Thermoplastischer fluorpolymer-klebstoff.
WO1998021287A1 (en) 1996-11-12 1998-05-22 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
WO2002026908A1 (de) 2000-09-28 2002-04-04 Henkel Kommanditgesellschaft Auf Aktien Klebstoffe mit barriereeigenschaften
US20040225025A1 (en) 2001-08-03 2004-11-11 Sullivan Michael G. Curable compositions for display devices
EP1518912A1 (en) 2002-06-17 2005-03-30 Sekisui Chemical Co., Ltd. Adhesive for sealing organic electroluminescent element and use thereof
US20070135552A1 (en) 2005-12-09 2007-06-14 General Atomics Gas barrier
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung

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US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
JPS533495A (en) 1976-06-30 1978-01-13 Daikin Ind Ltd Preparation of fluorine-containing polymer having plurality of chain segments
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US4552604A (en) 1977-02-02 1985-11-12 Ciba Geigy Corporation Bonding method employing film adhesives
JPS5386786A (en) 1977-09-30 1978-07-31 Daikin Ind Ltd Polymer having fluoring-containing segment and production
JPS5657811A (en) 1979-10-17 1981-05-20 Daikin Ind Ltd Preparation of liquid fluorine-containing polymer
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US4491536A (en) * 1982-09-29 1985-01-01 Daikin Kogyo Co., Ltd. Carbon fiber-containing fluoroelastomer composition
US4603175A (en) * 1983-07-27 1986-07-29 Daikin Industries, Inc. Thermoplastic fluoroelastomer composition
DE68924656T2 (de) * 1988-12-21 1996-08-22 Raychem Corp Thermoplastischer fluorpolymer-klebstoff.
DE69019061T2 (de) * 1989-05-26 1995-10-05 Daikin Ind Ltd Fluorhaltige Elastomermischung.
WO1998021287A1 (en) 1996-11-12 1998-05-22 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
WO2002026908A1 (de) 2000-09-28 2002-04-04 Henkel Kommanditgesellschaft Auf Aktien Klebstoffe mit barriereeigenschaften
US20040225025A1 (en) 2001-08-03 2004-11-11 Sullivan Michael G. Curable compositions for display devices
EP1518912A1 (en) 2002-06-17 2005-03-30 Sekisui Chemical Co., Ltd. Adhesive for sealing organic electroluminescent element and use thereof
US20070135552A1 (en) 2005-12-09 2007-06-14 General Atomics Gas barrier
DE102008060113A1 (de) 2008-12-03 2010-07-29 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung

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"Fluoroelastomer Handbook: The Definite Users Guide and Databook, Alber L. Moore, 2005 William Andrew Publishing/Plastics Design Library"
"Handbook of Pressure Sensitive Adhesive Technology" von Donatas Satas (Satas & Associates, Warwick 1999)
A.G. Erlat et. al. in "47th Annual Technical Conference Proceedings-Society of Vacuum Coaters", 2004, Seiten 654 bis 659
ASTM C 611-Verfahrens
ASTM D1003-11 (Procedure A (Hazemeter Byk Hazeguard Dual), Normlichtart D65)
ASTM F-1249
DIN 53380 Teil 3
DIN EN ISO 11664
ISO 29862 (Methode 3)
ISO 4892-2 (Method A, Cycle No.2)
M. E. Gross et al. in "46th Annual Technical Conference Proceedings-Society of Vacuum Coaters", 2003, Seiten 89 bis 92
Norm ASTM D 1003
Produktdatenblatt DAI-EL G-101 von Daikin Industries, Ltd, Stand November 2001 *

Also Published As

Publication number Publication date
TWI582188B (zh) 2017-05-11
EP2888330B1 (de) 2017-06-21
CN104736654B (zh) 2017-10-20
KR102123407B1 (ko) 2020-06-16
US9631127B2 (en) 2017-04-25
CN104736654A (zh) 2015-06-24
WO2014029545A1 (de) 2014-02-27
KR20150050571A (ko) 2015-05-08
IN2015DN01249A (enExample) 2015-06-26
EP2888330A1 (de) 2015-07-01
BR112015003675A2 (pt) 2017-07-04
JP2015531807A (ja) 2015-11-05
US20150240134A1 (en) 2015-08-27
PL2888330T3 (pl) 2017-09-29
TW201418392A (zh) 2014-05-16
JP6307079B2 (ja) 2018-04-04

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