KR102122343B1 - 기판 처리 방법 및 컴퓨터 기억 매체 - Google Patents
기판 처리 방법 및 컴퓨터 기억 매체 Download PDFInfo
- Publication number
- KR102122343B1 KR102122343B1 KR1020157019983A KR20157019983A KR102122343B1 KR 102122343 B1 KR102122343 B1 KR 102122343B1 KR 1020157019983 A KR1020157019983 A KR 1020157019983A KR 20157019983 A KR20157019983 A KR 20157019983A KR 102122343 B1 KR102122343 B1 KR 102122343B1
- Authority
- KR
- South Korea
- Prior art keywords
- polymer
- wafer
- resist
- film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H01L21/0337—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
- H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
- H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
-
- H01L21/02118—
-
- H01L21/0273—
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013015301A JP5847738B2 (ja) | 2013-01-30 | 2013-01-30 | 基板処理方法、プログラム及びコンピュータ記憶媒体 |
| JPJP-P-2013-015301 | 2013-01-30 | ||
| PCT/JP2014/051225 WO2014119444A1 (ja) | 2013-01-30 | 2014-01-22 | 基板処理方法及びコンピュータ記憶媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150114476A KR20150114476A (ko) | 2015-10-12 |
| KR102122343B1 true KR102122343B1 (ko) | 2020-06-12 |
Family
ID=51262157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157019983A Active KR102122343B1 (ko) | 2013-01-30 | 2014-01-22 | 기판 처리 방법 및 컴퓨터 기억 매체 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5847738B2 (enExample) |
| KR (1) | KR102122343B1 (enExample) |
| WO (1) | WO2014119444A1 (enExample) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008036491A (ja) | 2006-08-03 | 2008-02-21 | Nippon Telegr & Teleph Corp <Ntt> | パターン形成方法及びモールド |
| WO2012014700A1 (ja) | 2010-07-28 | 2012-02-02 | 株式会社 東芝 | パターン形成方法及びポリマーアロイ下地材料 |
| JP2012061531A (ja) | 2010-09-14 | 2012-03-29 | Tokyo Ohka Kogyo Co Ltd | ブロックコポリマーを含む層のパターン形成方法 |
| WO2012046770A1 (ja) | 2010-10-07 | 2012-04-12 | 東京応化工業株式会社 | ガイドパターン形成用ネガ型現像用レジスト組成物、ガイドパターン形成方法、ブロックコポリマーを含む層のパターン形成方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62136028A (ja) * | 1985-12-10 | 1987-06-19 | Matsushita Electric Ind Co Ltd | 有機膜のパタ−ン形成方法 |
-
2013
- 2013-01-30 JP JP2013015301A patent/JP5847738B2/ja active Active
-
2014
- 2014-01-22 KR KR1020157019983A patent/KR102122343B1/ko active Active
- 2014-01-22 WO PCT/JP2014/051225 patent/WO2014119444A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008036491A (ja) | 2006-08-03 | 2008-02-21 | Nippon Telegr & Teleph Corp <Ntt> | パターン形成方法及びモールド |
| WO2012014700A1 (ja) | 2010-07-28 | 2012-02-02 | 株式会社 東芝 | パターン形成方法及びポリマーアロイ下地材料 |
| JP2012061531A (ja) | 2010-09-14 | 2012-03-29 | Tokyo Ohka Kogyo Co Ltd | ブロックコポリマーを含む層のパターン形成方法 |
| WO2012046770A1 (ja) | 2010-10-07 | 2012-04-12 | 東京応化工業株式会社 | ガイドパターン形成用ネガ型現像用レジスト組成物、ガイドパターン形成方法、ブロックコポリマーを含む層のパターン形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150114476A (ko) | 2015-10-12 |
| JP2014146740A (ja) | 2014-08-14 |
| WO2014119444A1 (ja) | 2014-08-07 |
| JP5847738B2 (ja) | 2016-01-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5919210B2 (ja) | 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム | |
| KR101788908B1 (ko) | 기판 처리 방법, 컴퓨터 기억 매체 및 기판 처리 시스템 | |
| KR101751551B1 (ko) | 기판 처리 시스템, 기판 반송 방법 및 컴퓨터 기억 매체 | |
| JP2014082439A5 (enExample) | ||
| TW201443987A (zh) | 基板處理裝置、基板處理方法、程式及電腦記憶媒體 | |
| JP2014027228A (ja) | 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム | |
| JP6081728B2 (ja) | 基板処理方法、コンピュータ記憶媒体及び基板処理システム | |
| JP5881565B2 (ja) | 基板処理方法、プログラム及びコンピュータ記憶媒体 | |
| KR20160025515A (ko) | 기판 처리 방법, 컴퓨터 기억 매체 및 기판 처리 시스템 | |
| KR102268930B1 (ko) | 기판 처리 방법, 판독 가능한 컴퓨터 기억 매체 및 기판 처리 시스템 | |
| KR102498192B1 (ko) | 기판 처리 방법, 프로그램, 컴퓨터 기억 매체 및 기판 처리 시스템 | |
| JP5837525B2 (ja) | 基板処理方法、プログラム及びコンピュータ記憶媒体 | |
| KR102657313B1 (ko) | 기판 처리 방법 및 컴퓨터 기억 매체 | |
| KR20170060003A (ko) | 기판 처리 방법, 컴퓨터 기억 매체 및 기판 처리 시스템 | |
| JP5847738B2 (ja) | 基板処理方法、プログラム及びコンピュータ記憶媒体 | |
| TWI625786B (zh) | Semiconductor device manufacturing method and semiconductor manufacturing device | |
| KR20230059873A (ko) | 포토리소그래피 장치용 처리 블록 및 이를 이용한 포토리소그래피 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| U11 | Full renewal or maintenance fee paid |
Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE) Year of fee payment: 6 |