KR102112772B1 - 반도체 가공용 테이프 - Google Patents
반도체 가공용 테이프 Download PDFInfo
- Publication number
- KR102112772B1 KR102112772B1 KR1020197013961A KR20197013961A KR102112772B1 KR 102112772 B1 KR102112772 B1 KR 102112772B1 KR 1020197013961 A KR1020197013961 A KR 1020197013961A KR 20197013961 A KR20197013961 A KR 20197013961A KR 102112772 B1 KR102112772 B1 KR 102112772B1
- Authority
- KR
- South Korea
- Prior art keywords
- tape
- adhesive layer
- wafer
- semiconductor processing
- adhesive
- Prior art date
Links
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C09J2201/622—
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2018-061063 | 2018-03-28 | ||
JP2018061063A JP6535118B1 (ja) | 2018-03-28 | 2018-03-28 | 半導体加工用テープ |
PCT/JP2018/026883 WO2019187187A1 (ja) | 2018-03-28 | 2018-07-18 | 半導体加工用テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190113749A KR20190113749A (ko) | 2019-10-08 |
KR102112772B1 true KR102112772B1 (ko) | 2020-05-19 |
Family
ID=67023748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197013961A KR102112772B1 (ko) | 2018-03-28 | 2018-07-18 | 반도체 가공용 테이프 |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6535118B1 (ja) |
KR (1) | KR102112772B1 (ja) |
CN (1) | CN110546737B (ja) |
BR (1) | BR112019019527B1 (ja) |
MY (1) | MY187833A (ja) |
SG (1) | SG11201906508QA (ja) |
TW (1) | TWI735803B (ja) |
WO (1) | WO2019187187A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012174945A (ja) | 2011-02-23 | 2012-09-10 | Furukawa Electric Co Ltd:The | 半導体ウエハの加工方法 |
JP2012209384A (ja) | 2011-03-29 | 2012-10-25 | Lintec Corp | ダイシングテープおよびチップ状部品の製造方法 |
JP2017147293A (ja) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | 接着シートとダイシングテープを用いる半導体装置の製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2521459B2 (ja) * | 1987-02-23 | 1996-08-07 | 日東電工株式会社 | 半導体チツプの製造方法 |
JP4757442B2 (ja) * | 1997-02-10 | 2011-08-24 | リンテック株式会社 | チップ体製造用粘着シート |
JP4358502B2 (ja) | 2002-03-12 | 2009-11-04 | 浜松ホトニクス株式会社 | 半導体基板の切断方法 |
JP2003342393A (ja) * | 2002-05-30 | 2003-12-03 | Mitsubishi Polyester Film Copp | ダイシングテープ用ポリエステル系軟質フィルム |
JP2004273895A (ja) | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | 半導体ウエーハの分割方法 |
JP4754278B2 (ja) | 2005-06-23 | 2011-08-24 | リンテック株式会社 | チップ体の製造方法 |
JP5554118B2 (ja) * | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | ウエハ加工用テープ |
WO2014104189A1 (ja) * | 2012-12-26 | 2014-07-03 | 日立化成株式会社 | エキスパンド方法、半導体装置の製造方法、及び半導体装置 |
JP6021263B2 (ja) * | 2013-01-29 | 2016-11-09 | 日東電工株式会社 | 粘着テープ |
JP6295135B2 (ja) | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
TWI699420B (zh) * | 2015-03-24 | 2020-07-21 | 日商古河電氣工業股份有限公司 | 半導體加工用膠帶 |
JP6429824B2 (ja) * | 2016-03-31 | 2018-11-28 | 古河電気工業株式会社 | 電子デバイスパッケージ用テープ |
-
2018
- 2018-03-28 JP JP2018061063A patent/JP6535118B1/ja active Active
- 2018-07-18 CN CN201880005342.9A patent/CN110546737B/zh active Active
- 2018-07-18 KR KR1020197013961A patent/KR102112772B1/ko active IP Right Grant
- 2018-07-18 SG SG11201906508Q patent/SG11201906508QA/en unknown
- 2018-07-18 MY MYPI2019003948A patent/MY187833A/en unknown
- 2018-07-18 BR BR112019019527-0A patent/BR112019019527B1/pt active IP Right Grant
- 2018-07-18 WO PCT/JP2018/026883 patent/WO2019187187A1/ja active Application Filing
- 2018-09-10 TW TW107131684A patent/TWI735803B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012174945A (ja) | 2011-02-23 | 2012-09-10 | Furukawa Electric Co Ltd:The | 半導体ウエハの加工方法 |
JP2012209384A (ja) | 2011-03-29 | 2012-10-25 | Lintec Corp | ダイシングテープおよびチップ状部品の製造方法 |
JP2017147293A (ja) * | 2016-02-16 | 2017-08-24 | 日立化成株式会社 | 接着シートとダイシングテープを用いる半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20190113749A (ko) | 2019-10-08 |
CN110546737A (zh) | 2019-12-06 |
TWI735803B (zh) | 2021-08-11 |
MY187833A (en) | 2021-10-26 |
WO2019187187A1 (ja) | 2019-10-03 |
SG11201906508QA (en) | 2019-11-28 |
JP2019175959A (ja) | 2019-10-10 |
BR112019019527A2 (pt) | 2020-03-24 |
CN110546737B (zh) | 2020-09-11 |
JP6535118B1 (ja) | 2019-06-26 |
TW201942279A (zh) | 2019-11-01 |
BR112019019527B1 (pt) | 2021-03-16 |
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A201 | Request for examination | ||
A302 | Request for accelerated examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |