KR102095811B1 - 반도체 장치의 제조 방법 - Google Patents
반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR102095811B1 KR102095811B1 KR1020180053172A KR20180053172A KR102095811B1 KR 102095811 B1 KR102095811 B1 KR 102095811B1 KR 1020180053172 A KR1020180053172 A KR 1020180053172A KR 20180053172 A KR20180053172 A KR 20180053172A KR 102095811 B1 KR102095811 B1 KR 102095811B1
- Authority
- KR
- South Korea
- Prior art keywords
- oxide
- layer
- oxide layer
- semiconductor device
- zto
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 85
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 84
- 239000001301 oxygen Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 34
- 229910052738 indium Inorganic materials 0.000 claims abstract description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 7
- 239000011701 zinc Substances 0.000 claims abstract description 7
- 230000008021 deposition Effects 0.000 claims description 40
- 239000002131 composite material Substances 0.000 claims description 13
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical group [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 2
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical group [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 70
- 239000010409 thin film Substances 0.000 abstract description 25
- 239000000463 material Substances 0.000 abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 38
- 230000015572 biosynthetic process Effects 0.000 description 35
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 229910003437 indium oxide Inorganic materials 0.000 description 12
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000011787 zinc oxide Substances 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 206010021143 Hypoxia Diseases 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- -1 ZTO) Chemical compound 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- WGCXSIWGFOQDEG-UHFFFAOYSA-N [Zn].[Sn].[In] Chemical compound [Zn].[Sn].[In] WGCXSIWGFOQDEG-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017152200A JP6841184B2 (ja) | 2017-08-07 | 2017-08-07 | 半導体装置の製造方法 |
JPJP-P-2017-152200 | 2017-08-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190015985A KR20190015985A (ko) | 2019-02-15 |
KR102095811B1 true KR102095811B1 (ko) | 2020-04-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020180053172A KR102095811B1 (ko) | 2017-08-07 | 2018-05-09 | 반도체 장치의 제조 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6841184B2 (zh) |
KR (1) | KR102095811B1 (zh) |
CN (1) | CN109390236B (zh) |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5238383A (en) | 1975-09-19 | 1977-03-24 | Q P Corp | Method and apparatus for detedting eggs invaded by bacteria |
JP5053537B2 (ja) | 2004-11-10 | 2012-10-17 | キヤノン株式会社 | 非晶質酸化物を利用した半導体デバイス |
JP5244331B2 (ja) | 2007-03-26 | 2013-07-24 | 出光興産株式会社 | 非晶質酸化物半導体薄膜、その製造方法、薄膜トランジスタの製造方法、電界効果型トランジスタ、発光装置、表示装置及びスパッタリングターゲット |
GB2471093A (en) * | 2009-06-17 | 2010-12-22 | Cilian Ag | Viral protein expression in ciliates |
KR101652790B1 (ko) * | 2009-11-09 | 2016-08-31 | 삼성전자주식회사 | 트랜지스터와 그 제조방법 및 트랜지스터를 포함하는 전자소자 |
JP5503667B2 (ja) * | 2009-11-27 | 2014-05-28 | 株式会社日立製作所 | 電界効果トランジスタおよび電界効果トランジスタの製造方法 |
KR20110125105A (ko) * | 2010-05-12 | 2011-11-18 | 엘지디스플레이 주식회사 | 산화물 박막 트랜지스터 및 그 제조방법 |
JP5540972B2 (ja) | 2010-07-30 | 2014-07-02 | 日立金属株式会社 | 酸化物半導体ターゲットおよび酸化物半導体膜の製造方法 |
JP2012235104A (ja) * | 2011-04-22 | 2012-11-29 | Kobe Steel Ltd | 薄膜トランジスタ構造、ならびにその構造を備えた薄膜トランジスタおよび表示装置 |
JPWO2013108327A1 (ja) * | 2012-01-20 | 2015-05-11 | パナソニック株式会社 | 薄膜トランジスタ |
KR20130111874A (ko) * | 2012-04-02 | 2013-10-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 표시 장치, 그리고 박막 트랜지스터의 제조 방법 |
JP6082911B2 (ja) * | 2012-06-08 | 2017-02-22 | 株式会社Joled | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
JP5983163B2 (ja) * | 2012-08-07 | 2016-08-31 | 日立金属株式会社 | 酸化物半導体ターゲットおよび酸化物半導体材料、並びにそれらを用いた半導体装置の製造方法 |
KR101417932B1 (ko) * | 2012-12-13 | 2014-07-10 | 성균관대학교산학협력단 | 이중층 구조의 반도체 채널을 구비하는 박막트랜지스터 및 이의 제조방법 |
WO2016092427A1 (en) * | 2014-12-10 | 2016-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
-
2017
- 2017-08-07 JP JP2017152200A patent/JP6841184B2/ja active Active
-
2018
- 2018-05-09 KR KR1020180053172A patent/KR102095811B1/ko active IP Right Grant
- 2018-07-04 CN CN201810725388.XA patent/CN109390236B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2019033143A (ja) | 2019-02-28 |
JP6841184B2 (ja) | 2021-03-10 |
KR20190015985A (ko) | 2019-02-15 |
CN109390236A (zh) | 2019-02-26 |
CN109390236B (zh) | 2021-12-14 |
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