KR102082954B1 - 전자 소자의 봉지 방법 및 기판 접합체 - Google Patents

전자 소자의 봉지 방법 및 기판 접합체 Download PDF

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KR102082954B1
KR102082954B1 KR1020147034557A KR20147034557A KR102082954B1 KR 102082954 B1 KR102082954 B1 KR 102082954B1 KR 1020147034557 A KR1020147034557 A KR 1020147034557A KR 20147034557 A KR20147034557 A KR 20147034557A KR 102082954 B1 KR102082954 B1 KR 102082954B1
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inorganic material
substrate
material layer
forming
electronic element
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KR20150032252A (ko
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다다또모 스가
요시이에 마츠모토
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랜 테크니컬 서비스 가부시키가이샤
다다또모 스가
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Publication of KR20150032252A publication Critical patent/KR20150032252A/ko
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Assigned to 아이세이버즈 재팬 가부시키가이샤 reassignment 아이세이버즈 재팬 가부시키가이샤 권리지분의 전부이전등록 Assignors: 랜 테크니컬 서비스 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/872—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020147034557A 2012-06-15 2013-06-14 전자 소자의 봉지 방법 및 기판 접합체 Active KR102082954B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012135898 2012-06-15
JPJP-P-2012-135898 2012-06-15
PCT/JP2013/066446 WO2013187500A1 (ja) 2012-06-15 2013-06-14 電子素子の封止方法及び基板接合体

Publications (2)

Publication Number Publication Date
KR20150032252A KR20150032252A (ko) 2015-03-25
KR102082954B1 true KR102082954B1 (ko) 2020-02-28

Family

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Application Number Title Priority Date Filing Date
KR1020147034557A Active KR102082954B1 (ko) 2012-06-15 2013-06-14 전자 소자의 봉지 방법 및 기판 접합체

Country Status (5)

Country Link
US (1) US9331305B2 (https=)
JP (2) JP5704619B2 (https=)
KR (1) KR102082954B1 (https=)
CN (1) CN104412706B (https=)
WO (1) WO2013187500A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6409287B2 (ja) * 2014-02-28 2018-10-24 株式会社リコー 有機エレクトロルミネッセンス発光装置および有機エレクトロルミネッセンス発光装置の製造方法、並びに画像形成装置
US9870922B2 (en) * 2014-04-25 2018-01-16 Tadatomo Suga Substrate bonding apparatus and substrate bonding method
CN104600222B (zh) * 2015-02-04 2016-10-19 京东方科技集团股份有限公司 封装方法、显示面板及显示装置
JP2017041412A (ja) * 2015-08-21 2017-02-23 富士フイルム株式会社 電子装置
WO2017145279A1 (ja) * 2016-02-24 2017-08-31 パイオニア株式会社 発光装置の製造方法及び発光装置
JP6427712B2 (ja) * 2016-03-25 2018-11-21 日本碍子株式会社 接合方法
KR102369369B1 (ko) * 2017-08-04 2022-03-02 엘지디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP7045186B2 (ja) * 2017-12-28 2022-03-31 ランテクニカルサービス株式会社 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス
CN110504160A (zh) * 2018-05-16 2019-11-26 梁剑波 半导体器件的制造方法和半导体器件
JP2020091962A (ja) * 2018-12-03 2020-06-11 ランテクニカルサービス株式会社 デバイス封止方法
JP6848008B2 (ja) * 2019-06-06 2021-03-24 マレリ株式会社 接合方法

Citations (3)

* Cited by examiner, † Cited by third party
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JP2003323974A (ja) * 2002-04-30 2003-11-14 Casio Comput Co Ltd Ｅｌパネル及びその製造方法
JP2005347204A (ja) * 2004-06-07 2005-12-15 Canon Inc 有機ｅｌ素子及びその製造方法
JP2008010233A (ja) * 2006-06-28 2008-01-17 Toppan Printing Co Ltd 有機ｅｌパネル

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
JPH0379757A (ja) * 1989-08-23 1991-04-04 Toshiba Corp 真空蒸着による成膜方法とその装置
JP4194771B2 (ja) * 2001-06-29 2008-12-10 オリンパス株式会社 加熱治療装置
KR100442830B1 (ko) * 2001-12-04 2004-08-02 삼성전자주식회사 저온의 산화방지 허메틱 실링 방법
US20040232535A1 (en) * 2003-05-22 2004-11-25 Terry Tarn Microelectromechanical device packages with integral heaters
US7880382B2 (en) * 2006-03-08 2011-02-01 Toppan Printing Co., Ltd. Organic electroluminescence panel and manufacturing method of the same
JP2008218004A (ja) * 2007-02-28 2008-09-18 Hitachi Displays Ltd 有機ｅｌ表示装置
EP1986230A2 (en) * 2007-04-25 2008-10-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing SOI substrate and method of manufacturing semiconductor device
JP5442224B2 (ja) * 2007-07-23 2014-03-12 株式会社半導体エネルギー研究所 Ｓｏｉ基板の製造方法
JP2009199957A (ja) * 2008-02-22 2009-09-03 Seiko Epson Corp 有機発光装置および電子機器
JP2010140980A (ja) * 2008-12-10 2010-06-24 Sony Corp 機能性有機物素子及び機能性有機物装置
US8563113B2 (en) * 2010-04-20 2013-10-22 Corning Incorporated Multi-laminate hermetic barriers and related structures and methods of hermetic sealing
JP2012033729A (ja) * 2010-07-30 2012-02-16 Kyocera Corp 半導体層接合基板の製造方法および発光素子
JP2012089828A (ja) * 2010-09-22 2012-05-10 Toshiba Corp 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003323974A (ja) * 2002-04-30 2003-11-14 Casio Comput Co Ltd Ｅｌパネル及びその製造方法
JP2005347204A (ja) * 2004-06-07 2005-12-15 Canon Inc 有機ｅｌ素子及びその製造方法
JP2008010233A (ja) * 2006-06-28 2008-01-17 Toppan Printing Co Ltd 有機ｅｌパネル

Also Published As

Publication number Publication date
US9331305B2 (en) 2016-05-03
JPWO2013187500A1 (ja) 2016-02-08
US20150171365A1 (en) 2015-06-18
CN104412706B (zh) 2017-05-31
JP5704619B2 (ja) 2015-04-22
JP2015111596A (ja) 2015-06-18
JP6196993B2 (ja) 2017-09-13
CN104412706A (zh) 2015-03-11
WO2013187500A1 (ja) 2013-12-19
KR20150032252A (ko) 2015-03-25

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