KR102049629B1 - Evaporation source - Google Patents
Evaporation source Download PDFInfo
- Publication number
- KR102049629B1 KR102049629B1 KR1020157007556A KR20157007556A KR102049629B1 KR 102049629 B1 KR102049629 B1 KR 102049629B1 KR 1020157007556 A KR1020157007556 A KR 1020157007556A KR 20157007556 A KR20157007556 A KR 20157007556A KR 102049629 B1 KR102049629 B1 KR 102049629B1
- Authority
- KR
- South Korea
- Prior art keywords
- crucible
- housing
- evaporation source
- deposition material
- evaporation
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Since the influence of thermal fluctuation due to contact is hardly transmitted to the deposition material, the temperature distribution of the deposition material can be made uniform, and an evaporation source capable of stabilizing the evaporation amount of the deposition material is provided. A crucible 2 filled with the evaporation material 1, a heating part 3 provided to surround the crucible 2, and a housing 4 accommodating and arranging the crucible 2 and the heating part 3. As an evaporation source comprising a crucible receiving portion 5 at a position higher than the filling surface 1a of the deposition material 1 on the outer surface of the crucible 2 and lower than the opening position of the crucible 2, The crucible receiving portion 5 is supported by a crucible support portion 6 provided inside the housing 4, so that the outer bottom surface of the crucible 2 is lower than the inner bottom surface of the housing 4. The crucible 2 is configured to be housed in the housing 4 in a spaced apart state.
Description
The present invention relates to an evaporation source.
In a vapor deposition apparatus, it is necessary to make uniform the temperature distribution of the vapor deposition material in a crucible at the time of vapor deposition. This is because there is a correlation between the evaporation amount of the vapor deposition material and the temperature.
Here, in order to make the temperature distribution of the vapor deposition material in a crucible uniform, the temperature distribution of a crucible needs to be uniform. This is because the vapor deposition material in the crucible is subjected to heat conduction or radiation from the crucible.
In other words, in order to make the evaporation amount of the evaporation material uniform, it is necessary to make the temperature distribution of the crucible uniform, and in particular, the temperature distribution in the vicinity of the evaporation material of the crucible is important.
Moreover, as a factor which worsens the temperature distribution of a crucible, the crucible contacts with another member is mentioned. For example, when installing the crucible, if the crucible bottom surface comes into contact with the evaporation source holder or insulator, only the contact portion decreases in temperature. In addition, since the contact thermal resistance changes depending on the contact state to the evaporation source holder or insulator, the temperature varies in various ways.
Then, in order to solve the above problems, the technique disclosed by patent document 1 is proposed, for example. The technique disclosed in this patent document 1 provides a leg portion on the bottom surface of the crucible to be stored in the outer box to be heated, and provides a gap between the bottom surface of the crucible and the bottom surface of the outer box, thereby reducing thermal fluctuation due to contact. I want to relax.
However, in the said patent document 1, since the leg part is provided directly under a vapor deposition material, the vicinity of the leg part of a crucible is locally heated by the heat conduction through a leg part, and the evaporation amount of the vapor deposition material of the leg part is different. It seems to increase compared to place.
Therefore, even if the position where the leg portion is provided is the crucible end portion, if the evaporation amount locally increases, the ejection amount of the evaporation material from the opening near the end portion increases, resulting in nonuniformity in the film thickness distribution.
The present invention has been made in view of the above-described phenomenon, and by supporting the crucible at a position higher than the filling surface of the vapor deposition material on the outer surface of the crucible, the outer bottom surface of the crucible is spaced apart from the inner bottom surface of the housing. The crucible can be housed and disposed in the housing, and the contact portion with the housing of the crucible can be placed at a position away from the vapor deposition material, and the influence of thermal fluctuation due to the contact is less likely to be transmitted to the vapor deposition material, and the vapor deposition material It is an object of the present invention to provide an evaporation source capable of uniformizing the temperature distribution of and to stabilize the evaporation amount of the evaporation material.
The gist of the present invention will be described with reference to the accompanying drawings.
A
Moreover, the contact point of the said
The present invention also relates to an evaporation source according to any one of
Moreover, it is related with the evaporation source in any one of
Further, the
In addition, the outer surface of the
The
Furthermore, it is related with the evaporation source in any one of
Further, the
Moreover, the heat reflection member was provided between the said
Since the present invention is constituted as described above, an evaporation source capable of making the influence of thermal fluctuation due to contact hardly transmitted to the deposition material, making it possible to uniformize the temperature distribution of the deposition material, and stabilizing the evaporation amount of the deposition material. Becomes
1 is a schematic cross-sectional view of Embodiment 1. FIG.
2 is a schematic explanatory perspective view of main parts of the first embodiment;
3 is a schematic cross-sectional view of
4 is a schematic explanatory perspective view of main parts of a second embodiment.
5 is a schematic cross-sectional view of another example of the second embodiment.
6 is a schematic explanatory perspective view of a main part of another example of the second embodiment.
EMBODIMENT OF THE INVENTION Embodiment of this invention which thinks it is suitable is demonstrated based on drawing of the action of this invention based on drawing.
The
At this time, the outer bottom surface of the
That is, although local thermal fluctuations occur at the contact portion between the
Therefore, according to the present invention, the
Further, for example, in the case of a linear evaporation source or a so-called line source provided with a plurality of
In addition, since the
Example 1
EMBODIMENT OF THE INVENTION The specific Example 1 of this invention is demonstrated based on FIG.
In Example 1, the
Specifically, Example 1 is an evaporation source having a
Each part is explained concretely.
The
Moreover, the
In addition, the vapor deposition material 1 is generally a powder or a granular body, and in Example 1, the exposed surface (upper surface) when this vapor deposition material 1 was filled in the
The housing | casing 4 is a cylindrical body which the upper part opened from stainless steel, and the
The
In Example 1, the position at which the
As the
Moreover, the contact point of the
In addition, you may make it the structure provided with the temperature regulating mechanism of the
Moreover, the
In addition, it is good also as a structure which provides the
In addition, the heat reflection member (reflector) may be provided between the housing | casing 4 and the
Therefore, according to Example 1, it becomes possible to make uniform the temperature distribution of the
Example 2
The specific Example 2 of this invention is demonstrated based on FIGS.
3 and 4 are linear evaporation sources provided with
In Example 2, the outer side of the
In addition, in Example 2, the
Moreover, the recessed part as the
In Example 2, by providing the
In addition, the
Therefore, according to Example 2, it becomes possible to make the temperature distribution of the
In addition, although Example 2 comprises the
In addition, in this separate example, the sealing
The rest is the same as in Example 1.
In addition, this invention is not limited to Example 1, 2, The specific structure of each structural requirement can be designed suitably.
Claims (10)
An evaporation source comprising a plurality of openings through which evaporation material passes, along a longitudinal direction.
An evaporation source comprising a plurality of crucible receiving parts and a crucible support part, respectively.
The crucible receiving portion and the crucible support portion are configured to be heated by the heating portion.
An evaporation source comprising: a protruding portion protruding toward an inner surface of the housing on an outer surface of the crucible, and the crucible receiving portion provided on the protruding portion.
The crucible is formed by bringing a plurality of partitions into contact with each other, and a sealing member is provided at the contact portion of the partitions.
And a temperature adjusting mechanism of the crucible receiving portion and the crucible support portion.
The crucible support is the evaporation source, characterized in that the heating.
An evaporation source, wherein a heat reflecting member is provided between the housing and the heating unit.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012188691A JP6049355B2 (en) | 2012-08-29 | 2012-08-29 | Evaporation source |
JPJP-P-2012-188691 | 2012-08-29 | ||
PCT/JP2013/071621 WO2014034410A1 (en) | 2012-08-29 | 2013-08-09 | Evaporation source |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150044961A KR20150044961A (en) | 2015-04-27 |
KR102049629B1 true KR102049629B1 (en) | 2019-11-28 |
Family
ID=50183226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020157007556A KR102049629B1 (en) | 2012-08-29 | 2013-08-09 | Evaporation source |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6049355B2 (en) |
KR (1) | KR102049629B1 (en) |
CN (1) | CN104603321B (en) |
TW (1) | TWI589716B (en) |
WO (1) | WO2014034410A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6291696B2 (en) * | 2014-07-28 | 2018-03-14 | 株式会社Joled | Vapor deposition apparatus and evaporation source |
KR101528709B1 (en) * | 2014-09-30 | 2015-06-16 | 에스엔유 프리시젼 주식회사 | depositon crucible for improving evaporation uniformity |
KR101615913B1 (en) * | 2014-11-12 | 2016-05-13 | 에스엔유 프리시젼 주식회사 | Depositing device for thin film |
CN106893981B (en) * | 2017-03-30 | 2019-01-25 | 南京大学 | A kind of crucible for improving evaporation line stability and the source furnace with the crucible |
WO2019054530A1 (en) * | 2017-09-14 | 2019-03-21 | (주)알파플러스 | Vacuum evaporation source |
CN107604318B (en) * | 2017-09-27 | 2019-10-15 | 京东方科技集团股份有限公司 | Crucible heating device |
CN107805782B (en) * | 2017-11-27 | 2019-09-20 | 深圳市华星光电半导体显示技术有限公司 | A kind of evaporation coating device |
CN107916401B (en) * | 2017-12-15 | 2023-09-22 | 合肥鑫晟光电科技有限公司 | Evaporation crucible and evaporation device |
JP6526880B1 (en) * | 2018-06-29 | 2019-06-05 | キヤノントッキ株式会社 | Evaporation source and evaporation apparatus |
WO2020230359A1 (en) * | 2019-05-13 | 2020-11-19 | 株式会社アルバック | Deposition unit, and vacuum deposition device provided with said deposition unit |
JP7088891B2 (en) * | 2019-09-26 | 2022-06-21 | キヤノントッキ株式会社 | Evaporation source equipment and vapor deposition equipment |
CN112912534B (en) * | 2019-10-04 | 2022-06-17 | 株式会社爱发科 | Evaporation source for vacuum evaporation device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006104513A (en) | 2004-10-04 | 2006-04-20 | Toyota Industries Corp | Crucible cooling method in evaporation source, and evaporation source |
KR100784953B1 (en) * | 2006-05-23 | 2007-12-11 | 세메스 주식회사 | Linear type evaporator for manufacturing elements of organic semiconductor device using numerous crucible |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06108236A (en) * | 1992-09-25 | 1994-04-19 | Mitsubishi Electric Corp | Thin film forming device |
JPH07300666A (en) * | 1994-04-27 | 1995-11-14 | Nissin Electric Co Ltd | Production of molecular beam source for silicon evaporation and crucible used for the same |
JPH09209126A (en) * | 1996-02-08 | 1997-08-12 | Idemitsu Kosan Co Ltd | Vacuum deposition device |
KR100434438B1 (en) * | 2002-11-18 | 2004-06-04 | 주식회사 야스 | Circular nozzle source for thermal evaporation process |
JP2005154903A (en) * | 2003-11-26 | 2005-06-16 | Samsung Sdi Co Ltd | Method and apparatus for forming vapor-deposited film |
JP4696710B2 (en) | 2005-06-15 | 2011-06-08 | ソニー株式会社 | Vapor deposition apparatus and vapor deposition source |
KR100712217B1 (en) * | 2005-09-30 | 2007-04-27 | 삼성에스디아이 주식회사 | evaporating source and vacuum evaporating apparatus using the same |
JP5520871B2 (en) * | 2011-03-31 | 2014-06-11 | 株式会社日立ハイテクノロジーズ | Vapor deposition equipment |
-
2012
- 2012-08-29 JP JP2012188691A patent/JP6049355B2/en active Active
-
2013
- 2013-08-05 TW TW102127956A patent/TWI589716B/en active
- 2013-08-09 KR KR1020157007556A patent/KR102049629B1/en active IP Right Grant
- 2013-08-09 CN CN201380044630.2A patent/CN104603321B/en active Active
- 2013-08-09 WO PCT/JP2013/071621 patent/WO2014034410A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006104513A (en) | 2004-10-04 | 2006-04-20 | Toyota Industries Corp | Crucible cooling method in evaporation source, and evaporation source |
KR100784953B1 (en) * | 2006-05-23 | 2007-12-11 | 세메스 주식회사 | Linear type evaporator for manufacturing elements of organic semiconductor device using numerous crucible |
Also Published As
Publication number | Publication date |
---|---|
TWI589716B (en) | 2017-07-01 |
KR20150044961A (en) | 2015-04-27 |
TW201425613A (en) | 2014-07-01 |
CN104603321A (en) | 2015-05-06 |
WO2014034410A1 (en) | 2014-03-06 |
JP2014047365A (en) | 2014-03-17 |
JP6049355B2 (en) | 2016-12-21 |
CN104603321B (en) | 2016-10-26 |
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