KR102019524B1 - 처리액 공급 장치, 처리액 공급 방법 및 기억 매체 - Google Patents

처리액 공급 장치, 처리액 공급 방법 및 기억 매체 Download PDF

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KR102019524B1
KR102019524B1 KR1020140160639A KR20140160639A KR102019524B1 KR 102019524 B1 KR102019524 B1 KR 102019524B1 KR 1020140160639 A KR1020140160639 A KR 1020140160639A KR 20140160639 A KR20140160639 A KR 20140160639A KR 102019524 B1 KR102019524 B1 KR 102019524B1
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South Korea
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processing liquid
pressure
intermediate tank
liquid supply
flow rate
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Korean (ko)
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KR20150058043A (ko
Inventor
다카시 사사
다이스케 이시마루
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
KR1020140160639A 2013-11-20 2014-11-18 처리액 공급 장치, 처리액 공급 방법 및 기억 매체 Active KR102019524B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013240063A JP5999073B2 (ja) 2013-11-20 2013-11-20 処理液供給装置、処理液供給方法及び記憶媒体
JPJP-P-2013-240063 2013-11-20

Publications (2)

Publication Number Publication Date
KR20150058043A KR20150058043A (ko) 2015-05-28
KR102019524B1 true KR102019524B1 (ko) 2019-09-06

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KR1020140160639A Active KR102019524B1 (ko) 2013-11-20 2014-11-18 처리액 공급 장치, 처리액 공급 방법 및 기억 매체

Country Status (4)

Country Link
US (1) US9778571B2 (https=)
JP (1) JP5999073B2 (https=)
KR (1) KR102019524B1 (https=)
TW (1) TWI620029B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6370567B2 (ja) * 2014-03-13 2018-08-08 エイブリック株式会社 現像装置
JP6407833B2 (ja) * 2015-10-13 2018-10-17 東京エレクトロン株式会社 処理液供給装置
JP6407832B2 (ja) * 2015-10-13 2018-10-17 東京エレクトロン株式会社 処理液供給装置
JP6861084B2 (ja) * 2016-08-25 2021-04-21 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
US10518199B2 (en) * 2016-09-08 2019-12-31 Tokyo Electron Limited Treatment solution supply apparatus
JP6987649B2 (ja) * 2018-01-12 2022-01-05 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置及びその脱気方法
JP7072453B2 (ja) * 2018-06-29 2022-05-20 東京エレクトロン株式会社 基板処理装置、および基板処理方法
US11772234B2 (en) 2019-10-25 2023-10-03 Applied Materials, Inc. Small batch polishing fluid delivery for CMP
CN112786479B (zh) * 2019-11-08 2022-12-02 夏泰鑫半导体(青岛)有限公司 管理液体供应的系统与方法
JP7788081B2 (ja) * 2021-11-15 2025-12-18 株式会社リコー 液体供給装置、塗布装置及び画像形成装置
JP7685431B2 (ja) * 2021-12-03 2025-05-29 東京エレクトロン株式会社 処理液供給装置及び処理液排出方法
CN119037923A (zh) * 2024-08-26 2024-11-29 西安奕斯伟材料科技股份有限公司 化学品供应装置及方法、清洗设备、介质和计算机设备
JP7797741B1 (ja) * 2025-11-07 2026-01-13 台灣▲し▼科宏晟科技股分有限公司 化学液体供給システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005527814A (ja) 2002-05-06 2005-09-15 ザ・ビー・オー・シー・グループ・インコーポレイテッド 化学混合物および搬送システムならびにその方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3150690B2 (ja) * 1990-11-28 2001-03-26 東京エレクトロン株式会社 薬液処理装置
JPH09260332A (ja) * 1996-03-18 1997-10-03 Dainippon Screen Mfg Co Ltd 基板処理装置の薬液供給装置
TW382749B (en) * 1996-12-24 2000-02-21 Tokyo Electron Ltd Liquid supplying device
JP3545559B2 (ja) * 1996-12-25 2004-07-21 東京エレクトロン株式会社 処理液供給装置
JP3393534B2 (ja) * 1997-05-16 2003-04-07 タツモ株式会社 処理液供給ノズルシステム
JP3576835B2 (ja) * 1998-10-08 2004-10-13 東京エレクトロン株式会社 薬液供給システムおよび基板処理システム、ならびに液処理方法
JP3628895B2 (ja) * 1999-01-28 2005-03-16 大日本スクリーン製造株式会社 処理液供給装置
US7334708B2 (en) * 2001-07-16 2008-02-26 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical
JP4693175B2 (ja) * 2006-06-27 2011-06-01 東京エレクトロン株式会社 加圧式処理液供給装置
KR100980704B1 (ko) * 2008-09-10 2010-09-08 세메스 주식회사 포토레지스트 공급 장치 및 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005527814A (ja) 2002-05-06 2005-09-15 ザ・ビー・オー・シー・グループ・インコーポレイテッド 化学混合物および搬送システムならびにその方法

Also Published As

Publication number Publication date
JP2015099883A (ja) 2015-05-28
JP5999073B2 (ja) 2016-09-28
US9778571B2 (en) 2017-10-03
TW201533542A (zh) 2015-09-01
US20150140485A1 (en) 2015-05-21
KR20150058043A (ko) 2015-05-28
TWI620029B (zh) 2018-04-01

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