TWI620029B - Treatment liquid supply device, treatment liquid supply method, and memory medium - Google Patents

Treatment liquid supply device, treatment liquid supply method, and memory medium Download PDF

Info

Publication number
TWI620029B
TWI620029B TW103138903A TW103138903A TWI620029B TW I620029 B TWI620029 B TW I620029B TW 103138903 A TW103138903 A TW 103138903A TW 103138903 A TW103138903 A TW 103138903A TW I620029 B TWI620029 B TW I620029B
Authority
TW
Taiwan
Prior art keywords
pressure
processing liquid
liquid supply
intermediate tank
unit
Prior art date
Application number
TW103138903A
Other languages
English (en)
Chinese (zh)
Other versions
TW201533542A (zh
Inventor
佐佐卓志
石丸大輔
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201533542A publication Critical patent/TW201533542A/zh
Application granted granted Critical
Publication of TWI620029B publication Critical patent/TWI620029B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
TW103138903A 2013-11-20 2014-11-10 Treatment liquid supply device, treatment liquid supply method, and memory medium TWI620029B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013240063A JP5999073B2 (ja) 2013-11-20 2013-11-20 処理液供給装置、処理液供給方法及び記憶媒体
JP2013-240063 2013-11-20

Publications (2)

Publication Number Publication Date
TW201533542A TW201533542A (zh) 2015-09-01
TWI620029B true TWI620029B (zh) 2018-04-01

Family

ID=53173636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103138903A TWI620029B (zh) 2013-11-20 2014-11-10 Treatment liquid supply device, treatment liquid supply method, and memory medium

Country Status (4)

Country Link
US (1) US9778571B2 (https=)
JP (1) JP5999073B2 (https=)
KR (1) KR102019524B1 (https=)
TW (1) TWI620029B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6370567B2 (ja) * 2014-03-13 2018-08-08 エイブリック株式会社 現像装置
JP6407833B2 (ja) * 2015-10-13 2018-10-17 東京エレクトロン株式会社 処理液供給装置
JP6407832B2 (ja) * 2015-10-13 2018-10-17 東京エレクトロン株式会社 処理液供給装置
JP6861084B2 (ja) * 2016-08-25 2021-04-21 東京エレクトロン株式会社 基板処理方法、基板処理装置及び記録媒体
US10518199B2 (en) * 2016-09-08 2019-12-31 Tokyo Electron Limited Treatment solution supply apparatus
JP6987649B2 (ja) * 2018-01-12 2022-01-05 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置及びその脱気方法
JP7072453B2 (ja) * 2018-06-29 2022-05-20 東京エレクトロン株式会社 基板処理装置、および基板処理方法
US11772234B2 (en) 2019-10-25 2023-10-03 Applied Materials, Inc. Small batch polishing fluid delivery for CMP
CN112786479B (zh) * 2019-11-08 2022-12-02 夏泰鑫半导体(青岛)有限公司 管理液体供应的系统与方法
JP7788081B2 (ja) * 2021-11-15 2025-12-18 株式会社リコー 液体供給装置、塗布装置及び画像形成装置
JP7685431B2 (ja) * 2021-12-03 2025-05-29 東京エレクトロン株式会社 処理液供給装置及び処理液排出方法
CN119037923A (zh) * 2024-08-26 2024-11-29 西安奕斯伟材料科技股份有限公司 化学品供应装置及方法、清洗设备、介质和计算机设备
JP7797741B1 (ja) * 2025-11-07 2026-01-13 台灣▲し▼科宏晟科技股分有限公司 化学液体供給システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665718A (zh) * 2002-05-06 2005-09-07 美国Boc氧气集团有限公司 化学品混合与输送系统及其方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3150690B2 (ja) * 1990-11-28 2001-03-26 東京エレクトロン株式会社 薬液処理装置
JPH09260332A (ja) * 1996-03-18 1997-10-03 Dainippon Screen Mfg Co Ltd 基板処理装置の薬液供給装置
TW382749B (en) * 1996-12-24 2000-02-21 Tokyo Electron Ltd Liquid supplying device
JP3545559B2 (ja) * 1996-12-25 2004-07-21 東京エレクトロン株式会社 処理液供給装置
JP3393534B2 (ja) * 1997-05-16 2003-04-07 タツモ株式会社 処理液供給ノズルシステム
JP3576835B2 (ja) * 1998-10-08 2004-10-13 東京エレクトロン株式会社 薬液供給システムおよび基板処理システム、ならびに液処理方法
JP3628895B2 (ja) * 1999-01-28 2005-03-16 大日本スクリーン製造株式会社 処理液供給装置
US7334708B2 (en) * 2001-07-16 2008-02-26 L'air Liquide, Societe Anonyme A Directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical
JP4693175B2 (ja) * 2006-06-27 2011-06-01 東京エレクトロン株式会社 加圧式処理液供給装置
KR100980704B1 (ko) * 2008-09-10 2010-09-08 세메스 주식회사 포토레지스트 공급 장치 및 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665718A (zh) * 2002-05-06 2005-09-07 美国Boc氧气集团有限公司 化学品混合与输送系统及其方法

Also Published As

Publication number Publication date
JP2015099883A (ja) 2015-05-28
JP5999073B2 (ja) 2016-09-28
US9778571B2 (en) 2017-10-03
KR102019524B1 (ko) 2019-09-06
TW201533542A (zh) 2015-09-01
US20150140485A1 (en) 2015-05-21
KR20150058043A (ko) 2015-05-28

Similar Documents

Publication Publication Date Title
TWI620029B (zh) Treatment liquid supply device, treatment liquid supply method, and memory medium
KR102711353B1 (ko) 처리액 공급 장치 및 처리액 공급 방법
US11342198B2 (en) Processing liquid supplying apparatus and processing liquid supplying method
US10268116B2 (en) Processing liquid supplying apparatus and method of supplying processing liquid
US9372405B2 (en) Chemical liquid supply method and chemical liquid supply system
KR102508816B1 (ko) 처리액 공급 장치
CN207381371U (zh) 处理液供给装置
CN107808833B (zh) 处理液供给装置
TWI671127B (zh) 處理液供給方法、可讀取之電腦記憶媒體及處理液供給裝置
CN1885166B (zh) 基板处理系统及其控制方法
CN117747484A (zh) 基板处理装置和处理液供给方法
JP4776429B2 (ja) 処理液供給システム、処理液供給方法、処理液供給プログラム及びそのプログラムを記録したコンピュータ読み取り可能な記録媒体
JP3205915U (ja) 処理液供給配管回路
TW202427557A (zh) 基板處理裝置及處理液供給方法
JP2024044994A (ja) 基板処理装置及び処理液供給方法
KR100719710B1 (ko) 포토레지스트 도포장치