KR102004783B1 - 복합 전자부품 및 그 실장 기판 - Google Patents
복합 전자부품 및 그 실장 기판 Download PDFInfo
- Publication number
- KR102004783B1 KR102004783B1 KR1020140012594A KR20140012594A KR102004783B1 KR 102004783 B1 KR102004783 B1 KR 102004783B1 KR 1020140012594 A KR1020140012594 A KR 1020140012594A KR 20140012594 A KR20140012594 A KR 20140012594A KR 102004783 B1 KR102004783 B1 KR 102004783B1
- Authority
- KR
- South Korea
- Prior art keywords
- inductor
- capacitor
- composite
- magnetic
- output terminal
- Prior art date
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 228
- 239000003990 capacitor Substances 0.000 claims abstract description 242
- 239000000919 ceramic Substances 0.000 claims abstract description 29
- 239000010410 layer Substances 0.000 claims description 112
- 239000000126 substance Substances 0.000 claims description 30
- 239000006247 magnetic powder Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 229910000859 α-Fe Inorganic materials 0.000 claims description 16
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- 230000004907 flux Effects 0.000 claims description 9
- 238000004804 winding Methods 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 4
- 239000003381 stabilizer Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 20
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 239000003985 ceramic capacitor Substances 0.000 description 12
- 230000006641 stabilisation Effects 0.000 description 11
- 238000011105 stabilization Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 9
- 239000000696 magnetic material Substances 0.000 description 8
- 230000006866 deterioration Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000000087 stabilizing effect Effects 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910009369 Zn Mg Inorganic materials 0.000 description 1
- 229910007573 Zn-Mg Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140012594A KR102004783B1 (ko) | 2014-02-04 | 2014-02-04 | 복합 전자부품 및 그 실장 기판 |
| JP2014084651A JP6210926B2 (ja) | 2014-02-04 | 2014-04-16 | 複合電子部品及びその実装基板 |
| CN201410191017.XA CN104821232B (zh) | 2014-02-04 | 2014-05-07 | 复合电子组件和安装有复合电子组件的板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140012594A KR102004783B1 (ko) | 2014-02-04 | 2014-02-04 | 복합 전자부품 및 그 실장 기판 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150091853A KR20150091853A (ko) | 2015-08-12 |
| KR102004783B1 true KR102004783B1 (ko) | 2019-07-29 |
Family
ID=53731499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020140012594A KR102004783B1 (ko) | 2014-02-04 | 2014-02-04 | 복합 전자부품 및 그 실장 기판 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6210926B2 (ja) |
| KR (1) | KR102004783B1 (ja) |
| CN (1) | CN104821232B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102073726B1 (ko) * | 2016-12-29 | 2020-02-05 | 주식회사 모다이노칩 | 복합 소자 및 이를 구비하는 전자기기 |
| KR102053356B1 (ko) * | 2018-06-08 | 2019-12-06 | 주식회사 모다이노칩 | 복합 소자의 제조 방법, 이에 의해 제조된 복합 소자 및 이를 구비하는 전자기기 |
| US11515854B2 (en) * | 2018-12-27 | 2022-11-29 | Tdk Corporation | LC composite component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004079973A (ja) * | 2002-08-22 | 2004-03-11 | Mitsubishi Materials Corp | Ｌｃ複合部品 |
| JP2005340585A (ja) * | 2004-05-28 | 2005-12-08 | Murata Mfg Co Ltd | 複合電子部品及びその製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01289307A (ja) * | 1988-05-17 | 1989-11-21 | Matsushita Electric Ind Co Ltd | チップノイズフィルタ |
| JPH07122434A (ja) * | 1993-10-21 | 1995-05-12 | Matsushita Electric Ind Co Ltd | インダクタンス部品および複合部品 |
| JPH0846471A (ja) * | 1994-07-29 | 1996-02-16 | Murata Mfg Co Ltd | 積層型ｌｃ複合部品 |
| JPH08308220A (ja) * | 1995-05-08 | 1996-11-22 | Matsushita Electric Ind Co Ltd | 安定化電源装置 |
| JP3127792B2 (ja) * | 1995-07-19 | 2001-01-29 | 株式会社村田製作所 | Ｌｃ共振器およびｌｃフィルタ |
| JPH1140920A (ja) * | 1997-07-22 | 1999-02-12 | Taiyo Yuden Co Ltd | 複合部品 |
| JP2000021640A (ja) * | 1998-06-29 | 2000-01-21 | Sumitomo Metal Ind Ltd | ノイズフィルタ及びその製造方法 |
| JP2001010820A (ja) * | 1999-06-23 | 2001-01-16 | Tdk Corp | フェライト組成物、フェライト焼結体、積層型電子部品およびこれらの製造方法 |
| JP2003060463A (ja) | 2001-08-09 | 2003-02-28 | Murata Mfg Co Ltd | 積層型ｌｃ複合部品およびその製造方法 |
| JP2006311365A (ja) * | 2005-04-28 | 2006-11-09 | Tdk Corp | ３端子型電子部品およびその使用方法 |
| JP2007134594A (ja) * | 2005-11-11 | 2007-05-31 | Murata Mfg Co Ltd | コモンモードチョークコイル |
| US20120081194A1 (en) * | 2009-05-29 | 2012-04-05 | Harada Industry Co., Ltd | Vehicle-Mounted Noise Filter |
| JP5581145B2 (ja) * | 2009-08-11 | 2014-08-27 | 日本碍子株式会社 | 複合電子部品の製造方法 |
| KR20140011693A (ko) * | 2012-07-18 | 2014-01-29 | 삼성전기주식회사 | 파워 인덕터용 자성체 모듈, 파워 인덕터 및 그 제조 방법 |
-
2014
- 2014-02-04 KR KR1020140012594A patent/KR102004783B1/ko active IP Right Grant
- 2014-04-16 JP JP2014084651A patent/JP6210926B2/ja active Active
- 2014-05-07 CN CN201410191017.XA patent/CN104821232B/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004079973A (ja) * | 2002-08-22 | 2004-03-11 | Mitsubishi Materials Corp | Ｌｃ複合部品 |
| JP2005340585A (ja) * | 2004-05-28 | 2005-12-08 | Murata Mfg Co Ltd | 複合電子部品及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150091853A (ko) | 2015-08-12 |
| JP2015149466A (ja) | 2015-08-20 |
| CN104821232A (zh) | 2015-08-05 |
| CN104821232B (zh) | 2018-11-02 |
| JP6210926B2 (ja) | 2017-10-11 |
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| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |