KR102002411B1 - 아연알루미늄산화염을 포함하는 방열시트 - Google Patents
아연알루미늄산화염을 포함하는 방열시트 Download PDFInfo
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- KR102002411B1 KR102002411B1 KR1020170044070A KR20170044070A KR102002411B1 KR 102002411 B1 KR102002411 B1 KR 102002411B1 KR 1020170044070 A KR1020170044070 A KR 1020170044070A KR 20170044070 A KR20170044070 A KR 20170044070A KR 102002411 B1 KR102002411 B1 KR 102002411B1
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- Prior art keywords
- sheet
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- filler
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- 230000017525 heat dissipation Effects 0.000 title description 8
- 229910001676 gahnite Inorganic materials 0.000 title description 2
- 239000000945 filler Substances 0.000 claims abstract description 31
- 239000002952 polymeric resin Substances 0.000 claims description 12
- 229920003002 synthetic resin Polymers 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 abstract description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 23
- 230000005855 radiation Effects 0.000 description 21
- 239000002245 particle Substances 0.000 description 14
- 238000009413 insulation Methods 0.000 description 13
- 238000001027 hydrothermal synthesis Methods 0.000 description 10
- 239000011787 zinc oxide Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000975 co-precipitation Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000001308 synthesis method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002199 base oil Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 229920000728 polyester Chemical class 0.000 description 1
- 229920000570 polyether Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Chemical class 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229940099259 vaseline Drugs 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
도 2는 본 발명의 바람직한 제2실시예에 의한 방열시트의 단면도이다.
도 3은 본 발명에 의해 합성된 ZnAl2O4의 XRD 실험 결과 그래프이다.
도 4는 본 발명에 의해 제조된 바람직한 제1실시예의 한 방열시트 SEM 사진이다.
도 5는 본 발명에 의해 제조된 바람직한 제2실시예의 한 방열시트 SEM 사진이다.
샘플 | Sheet | Layer 수 | 열전도도 (W/mk) |
절연 전압 (kV/mm) |
두께 (㎛) |
비교예 | ZnAl2O4 | 1 | 1.64 | 9 | <0.3 |
실시예 1 | ZnAl2O4/Cu | 2 | 4.87 | 8 | <0.6 |
실시예 2 | ZnAl2O4/Cu/ZnAl2O4 | 3 | 2.5 | 10 | <1 |
10 : 제1시트
20 : 제2시트
30 : 제3시트
100 : 제1실시예의 방열시트
200 : 제2실시예의 방열시트
Claims (5)
- 제1시트, 제2시트 및 제3시트의 순서대로 적층된 방열시트에 있어서,
상기 제1시트 및 제3시트는, 고분자 수지 및 필러로서 ZnAl2O4를 포함하여 이루어지며,
상기 제2시트는 고분자 수지 및 필러로서 Cu를 포함하여 이루어지며,
상기 제1시트 및 제3시트는, 각 시트의 총중량 중 ZnAl2O4를 포함하는 필러 총량이 50 ~ 80 중량%인 것을 특징으로 하는 방열시트.
- 삭제
- 제1항에서, 상기 고분자 수지는 에폭시계 수지 또는 우레탄계 수지인 것을 특징으로 하는 방열시트.
- 삭제
- 삭제
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KR1020170044070A KR102002411B1 (ko) | 2017-04-05 | 2017-04-05 | 아연알루미늄산화염을 포함하는 방열시트 |
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KR1020170044070A KR102002411B1 (ko) | 2017-04-05 | 2017-04-05 | 아연알루미늄산화염을 포함하는 방열시트 |
Publications (2)
Publication Number | Publication Date |
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KR20180112981A KR20180112981A (ko) | 2018-10-15 |
KR102002411B1 true KR102002411B1 (ko) | 2019-07-23 |
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Families Citing this family (1)
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KR102608137B1 (ko) | 2018-09-20 | 2023-11-29 | 엘지디스플레이 주식회사 | 표시 장치 |
Citations (1)
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KR101573898B1 (ko) * | 2014-07-24 | 2015-12-02 | 가드넥(주) | 방열 시트의 제조방법 및 이에 의해 제조된 방열 시트를 포함하는 열전도성 복합 시트 |
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KR100592603B1 (ko) * | 2002-05-20 | 2006-06-23 | 엔지케이 스파크 플러그 캄파니 리미티드 | 유전체 자기 |
EP2094822A1 (en) | 2006-09-05 | 2009-09-02 | 3M Innovative Properties Company | Thermally conductive grease |
JP2011021069A (ja) | 2009-07-14 | 2011-02-03 | Sakai Chem Ind Co Ltd | 放熱性フィラー組成物、樹脂組成物、放熱性グリース及び放熱性塗料組成物 |
KR101005785B1 (ko) | 2009-09-18 | 2011-01-06 | 주식회사 애드밴엘이디 | 열전도성 그리스 및 이를 이용한 등기구의 방열 장치 |
WO2012147886A1 (ja) | 2011-04-28 | 2012-11-01 | 堺化学工業株式会社 | 六角板状酸化亜鉛粒子、その製造方法、それを配合した化粧料、放熱性フィラー、放熱性樹脂組成物、放熱性グリース及び放熱性塗料組成物 |
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KR101573898B1 (ko) * | 2014-07-24 | 2015-12-02 | 가드넥(주) | 방열 시트의 제조방법 및 이에 의해 제조된 방열 시트를 포함하는 열전도성 복합 시트 |
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