KR101993951B1 - 계측 장치, 리소그래피 장치, 및 물품의 제조 방법 - Google Patents
계측 장치, 리소그래피 장치, 및 물품의 제조 방법 Download PDFInfo
- Publication number
- KR101993951B1 KR101993951B1 KR1020150189157A KR20150189157A KR101993951B1 KR 101993951 B1 KR101993951 B1 KR 101993951B1 KR 1020150189157 A KR1020150189157 A KR 1020150189157A KR 20150189157 A KR20150189157 A KR 20150189157A KR 101993951 B1 KR101993951 B1 KR 101993951B1
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- KR
- South Korea
- Prior art keywords
- mark
- detection data
- reticle
- measurement
- error
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
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- H01L22/26—
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
- G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
- G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7092—Signal processing
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- H01L21/0274—
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- H01L22/30—
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- H01L23/544—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015003608A JP6521637B2 (ja) | 2015-01-09 | 2015-01-09 | 計測装置、リソグラフィ装置及び物品の製造方法 |
| JPJP-P-2015-003608 | 2015-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160086273A KR20160086273A (ko) | 2016-07-19 |
| KR101993951B1 true KR101993951B1 (ko) | 2019-06-27 |
Family
ID=56367503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150189157A Active KR101993951B1 (ko) | 2015-01-09 | 2015-12-30 | 계측 장치, 리소그래피 장치, 및 물품의 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10185235B2 (https=) |
| JP (1) | JP6521637B2 (https=) |
| KR (1) | KR101993951B1 (https=) |
| TW (1) | TWI621000B (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107976870B (zh) * | 2016-10-24 | 2020-12-04 | 上海微电子装备(集团)股份有限公司 | 一种运动台定位误差补偿装置及补偿方法 |
| US10156439B2 (en) * | 2017-03-03 | 2018-12-18 | The Boeing Company | Inspection system for alignment in restricted volumes |
| US11175598B2 (en) * | 2017-06-30 | 2021-11-16 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
| CN111123662B (zh) * | 2020-01-19 | 2022-04-26 | 中国科学院微电子研究所 | 一种获取套刻误差量测数据的方法及装置 |
| CN112408316B (zh) * | 2020-11-20 | 2024-04-12 | 中国科学院上海微系统与信息技术研究所 | 双面超表面结构的制备方法 |
| US20240337952A1 (en) * | 2023-04-04 | 2024-10-10 | Kla Corporation | System and method for determining overlay measurement of a scanning target |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295154A (ja) * | 2005-04-06 | 2006-10-26 | Asml Netherlands Bv | リソグラフィ装置、パターニング組立体および汚染推定法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3391328B2 (ja) * | 1993-02-08 | 2003-03-31 | 株式会社ニコン | 位置合わせ方法、その位置合わせ方法を用いた露光方法、その露光方法を用いたデバイス製造方法、そのデバイス製造方法で製造されたデバイス、並びに位置合わせ装置、その位置合わせ装置を備えた露光装置 |
| JP3594221B2 (ja) | 1999-01-26 | 2004-11-24 | シャープ株式会社 | 半導体集積回路装置のテスト回路 |
| JP2001267206A (ja) * | 2000-03-15 | 2001-09-28 | Canon Inc | 位置合せ方法、露光装置、及び、半導体デバイス生産方法 |
| JP2001319858A (ja) * | 2000-05-09 | 2001-11-16 | Canon Inc | アライメントマーク位置計測方法、露光装置、半導体デバイス製造方法、半導体製造工場および露光装置の保守方法 |
| JP4272862B2 (ja) | 2002-09-20 | 2009-06-03 | キヤノン株式会社 | 位置検出方法、位置検出装置及び露光装置 |
| JP2004235354A (ja) | 2003-01-29 | 2004-08-19 | Canon Inc | 露光装置 |
| JP2005057222A (ja) * | 2003-08-07 | 2005-03-03 | Canon Inc | マーク検出装置、マーク検出方法、マーク検出プログラム、露光装置、デバイスの製造方法、及び、デバイス |
| KR20050120072A (ko) | 2004-06-18 | 2005-12-22 | 동부아남반도체 주식회사 | 반도체 소자의 얼라인 마크 및 그를 이용한 얼라인 방법 |
| US7408618B2 (en) | 2005-06-30 | 2008-08-05 | Asml Netherlands B.V. | Lithographic apparatus substrate alignment |
| JP2007103658A (ja) | 2005-10-04 | 2007-04-19 | Canon Inc | 露光方法および装置ならびにデバイス製造方法 |
| JP5002221B2 (ja) | 2006-09-11 | 2012-08-15 | キヤノン株式会社 | マークの位置を検出する装置 |
| JP5132277B2 (ja) | 2006-12-04 | 2013-01-30 | キヤノン株式会社 | 計測装置、露光装置及びデバイス製造方法 |
| JP4307482B2 (ja) | 2006-12-19 | 2009-08-05 | キヤノン株式会社 | 位置計測装置、露光装置、およびデバイス製造方法 |
| JP2008205393A (ja) * | 2007-02-22 | 2008-09-04 | Canon Inc | アライメントマークの位置検出の条件を決定する方法、露光装置及びデバイスの製造方法 |
| CN100480867C (zh) * | 2007-03-06 | 2009-04-22 | 上海微电子装备有限公司 | 一种基于图像技术的对准系统及对准方法 |
| DE102008004762A1 (de) * | 2008-01-16 | 2009-07-30 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung |
| JP5096965B2 (ja) * | 2008-02-29 | 2012-12-12 | キヤノン株式会社 | 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法 |
| DE102008015631A1 (de) * | 2008-03-20 | 2009-09-24 | Carl Zeiss Sms Gmbh | Verfahren und Vorrichtung zur Vermessung von Masken für die Photolithographie |
| US9360778B2 (en) * | 2012-03-02 | 2016-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for lithography patterning |
| JP6386732B2 (ja) | 2014-01-20 | 2018-09-05 | キヤノン株式会社 | 検出装置、検出方法、及びリソグラフィ装置 |
-
2015
- 2015-01-09 JP JP2015003608A patent/JP6521637B2/ja active Active
- 2015-12-08 TW TW104141149A patent/TWI621000B/zh active
- 2015-12-18 US US14/973,888 patent/US10185235B2/en active Active
- 2015-12-30 KR KR1020150189157A patent/KR101993951B1/ko active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295154A (ja) * | 2005-04-06 | 2006-10-26 | Asml Netherlands Bv | リソグラフィ装置、パターニング組立体および汚染推定法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160086273A (ko) | 2016-07-19 |
| JP6521637B2 (ja) | 2019-05-29 |
| US10185235B2 (en) | 2019-01-22 |
| US20160202620A1 (en) | 2016-07-14 |
| JP2016129212A (ja) | 2016-07-14 |
| TW201626118A (zh) | 2016-07-16 |
| TWI621000B (zh) | 2018-04-11 |
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