KR101990013B1 - Cutting Blade and Cutting Device using the same - Google Patents

Abstract

A cutting blade for manufacturing semiconductor components including a multi-layer ceramic condenser (MLCC) includes: a blade unit having a cutting part made of a polycrystalline diamond (PCD) material manufactured at a predetermined temperature and a predetermined pressure, having a mutually opposite nose inclined surface, and forming a cutting nose in a longitudinal direction and a support extension part extended from the other side of the cutting part to support the cutting unit; and a blade support unit having a receiving coupling part dented to receive a part of the support extension part in a longitudinal direction and to be coupled thereto.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cutting blade,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting blade and a cutting apparatus using the same, and more particularly, to a cutting blade for manufacturing a semiconductor component including an MLCC (Multi Layer Ceramic Condenser) and a cutting apparatus using the same.

With the development of smart phones and electric vehicles, components such as multilayer ceramic capacitors and chip inductors used as components are becoming more sophisticated, lighter, and smaller. In particular, MLCC (Multi-Layer Ceramic Condenser (or Capacitor)) in which a plurality of capacitors are laminated is increasing in size and miniaturization is progressing at the same time. The MLCC is manufactured as a finished part by cutting the MLCC material into a desired size with a cutting device having a blade, after the process of being made into a widely laminated plate. In order to cut the MLCC as the number of layers and the miniaturization progress, the material of the blades is made of a cemented carbide material having an improved hardness.

However, as the number of stacked MLCCs and their miniaturization have increased, there has been an increase in demand for lowering the defect rate, such as improving the uniformity of cut surfaces and electric conduction between layers, when cutting MLCC materials using blades made of cemented carbide. There has been an increased need for blades that are problematic and that can be used for a long time. Therefore, ultra high hardness blades having improved cutting force are required.

We are developing blade using Polycrystalline Diamond (PCD) material, which has hardness about 10 times harder than cemented carbide for advanced MLCC cutting. One method was to develop blades made of PCD (Polycrystalline Diamond). However, when both the blade body and the blade are made of PCD (Polycrystalline Diamond), it is difficult to form blade blades of high precision and is formed at a very high price.

Accordingly, it is an object of the present invention to provide a blade for cutting and a cutting device using the same, which is improved and improved in cutting power and use time by applying an ultra-high hardness material so as to cut an advanced part without defects.

A cutting blade for manufacturing a semiconductor component including an MLCC (Multi Layer Ceramic Condenser) for achieving the object of the present invention comprises a PCD (Polycrystalline Diamond) material manufactured at a predetermined temperature and a predetermined pressure, A blade portion having a cutting edge portion having a cutting edge inclined to form a cutting edge along a longitudinal direction of one side thereof and a support extension portion extending from the other side of the cutting edge portion and supporting the cutting portion; And a blade support portion having a receiving engagement portion formed to receive and engage with at least a portion of the support extension along the longitudinal direction. The cutting force and the life can be improved by providing the cut-out portion for cutting the semiconductor component using a PCD (Polycrystalline Diamond) material.

Here, if the support extension portion has an extension section extending from the cutting section and having an escape angle smaller than the cutting angle of the cutting section, the cut surface of the MLCC contacts the side surface of the blade during the cutting process of the MLCC, .

The blade support portion may be formed of a cemented carbide material having the same or different properties. When the blade support portion is coupled by metal adhesive, brazing or soldering, the blade support portion may support the blade portion. .

The receiving portion has a pair of depressed side surfaces having outward inclination angles. When the supporting extension portion has a cross-sectional shape tangent to the pair of depressed side surfaces, the blade portion is perpendicular to the plate surface of the MLCC So that it is preferable.

According to another aspect of the present invention, there is provided a cutting apparatus comprising: the blade; And a blade driving unit for linearly moving the blade so as to cut perpendicularly to the surface of the workpiece of the semiconductor component for manufacturing a semiconductor component including an MLCC (Multi Layer Ceramic Condenser). The cutting portion for cutting the semiconductor component may be made of PCD (Polycrystalline Diamond) and cut perpendicularly to the surface of the semiconductor component.

According to the present invention, there is an effect that cutting force can be improved by providing a cutting portion for cutting a semiconductor component with a PCD (Polycrystalline Diamond) material.

The support extension portion has a section having an escape angle smaller than the cutting edge angle of the cut portion, so that the cut surface of the MLCC is contacted with the side surface of the blade during the cutting process of the MLCC.

The blade support portion can support the blade portion when the support portion is coupled to the support extension portion by any one of metal adhesive, brazing, and soldering in the receiving and coupling portion.

The receiving portion has a pair of depressed side surfaces having an outward inclination angle and the supporting extension portion has a sectional shape tangent to a pair of depressed side surfaces, the blade portion can maintain a vertical state with respect to the surface of the MLCC during the cutting of the MLCC have.

It is possible to provide a cutting portion for cutting a semiconductor component by using a cutting device having a blade made of a PCD (Polycrystalline Diamond) material and cutting the semiconductor component perpendicularly to the surface of the substrate.

1 is a simplified illustration of a cutting apparatus according to the present invention;
2 is a detailed view of the blade.
3 is a modification of the blade.
Fig. 4 is a manufacturing process diagram of the blade. Fig.

Hereinafter, a cutting apparatus 1 and a blade 10 according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a detailed view (a), (b) of the blade 10, FIG. 3 is a view showing a modification of the blade 10, and FIG. Fig. 4 is a manufacturing process diagram of the blade 10. Fig.

The cutting apparatus (1) includes a blade (10) and a blade driving unit (20). The blade drive unit 20 includes a blade grip unit (not shown) for gripping the blade 10, a vertical coaxial shaft (not shown) connected to the blade grip unit, and a vertical movement motor (Not shown). The blade driving unit 20 linearly moves the blade 10 so as to cut perpendicularly to the surface of the workpiece of the semiconductor component 2 for manufacturing the semiconductor component 2 including the MLCC (Multi Layer Ceramic Condenser 2). The cutting apparatus 1 further includes a control unit (not shown) to control the blade driving unit 20 and to control various matters including the cutting speed. The horizontal / vertical size of the surface of the semiconductor part (2) can be set within the maximum cutting length of the blade (10). The upper and lower coaxial shafts provided in the blade driving unit 20 may be rotated with respect to the axis for the cutting in the transverse direction and the cutting in the longitudinal direction of the substrate surface or the supporting unit for fixing the surface of the workpiece may be rotated with respect to the axis.

The blade 10 includes a blade portion 100 and a blade support portion 200. The blade 10 has a wide and flat shape having one side and the other side, and one side and the other side have a pair of long side and a long side having a short side. The blade unit 100 for cutting is coupled to one side of the pair of long sides and the blade support unit 200 for supporting the blade unit 100 without forming a blade. The blade portion 100 has a cutting portion 110 and a support extension portion 120.

The cutting unit 110 is made of PCD (Polycrystalline Diamond) material manufactured at a predetermined temperature and a predetermined pressure, and has cutting edge slopes 111 facing each other to form a cutting edge 112 along the longitudinal direction of one side. The slope inclined plane 111 is formed by machining the cut edge of the blade unit 100 so as to form a predetermined cutting angle from the center of the slice. As a result, the cutting edge 112 is formed in a straight line by the slanting slant face 111 which is mutually opposite while the slant face 111 is formed, so that the maximum cutting length of the blade 10 is set.

The support extension 120 extends from the other side of the cutout 110 and supports the cutout 110. The support extension 120 is made of a cemented carbide containing tungsten (w) and is made of a different material from the cut portion 110, but is integrally formed. The support extension 120 has an escape extension 121 and a support extension body 122. The escape extension portion 121 is an extension portion extending from the cutout portion 110 at an escape angle smaller than the cutoff angle of the cutout portion 110. The extension section may be formed of a flat, concave or convex curved surface, or a composite surface thereof. It is preferable that the support extending body portion 122 extends from the escape extension portion 121 and does not have a pulling angle or an escape angle because it can be easily processed. In some cases, it may extend at various angles and may have various shapes.

The blade part 100 may be formed extending from the slope 111 of the cutting part 110 to the support extension body 122 without forming the escape extension part 121 in the support extension part 120. It is also possible to start the escape extension portion 121 extending from the cut portion 110 near the end portion of the incline slope 111 starting from the cutting incision 112 at a predetermined escape angle, The elongated body portion 122 can be extended and started. The blade portion 100 may be formed only by the escape extension portion 121 having a predetermined escape angle without forming the support extension main body portion 122 in the support extension portion 120. The support extension 120 may be formed integrally with the support extension body to have a gradually increasing curvature beginning at a predetermined escape angle from the escape extension to the support extension main body area, and may be concave or convex.

Although the cutting portion 110 is formed of polycrystalline diamond (PCD) and the support extension 120 is made of cemented carbide, the cut portion 110 and the support extension 120 do not have mutually accurate boundaries, So that there may be a portion where a material of a mutual mixture is slightly mixed in the boundary region. Also, the support extension 120 may be made of PCD material and formed integrally with the cutout 110.

The blade supporting portion 200 has a receiving portion 210 and a supporting rib 220. The blade support 200 has a pair of planes and a pair of planes formed by connecting a pair of planes and a pair of planes. One of the pair of scenes has a receiving engagement portion 210 formed to receive and engage with at least a portion of the support extension 120 along the length direction. The receiving coupling portion 210 has a recessed left side surface 211 and a recessed right side surface 212 with the blade portion 100 or the supporting extension portion 120 interposed therebetween. The receiving engagement portion 210 is formed to be recessed in the same or similar shape corresponding to the thickness of the support extension portion 120 to be received, that is, the support extension body portion 122, and preferably the thickness of the support extension body portion 122 So that the metal adhesive can be injected. The supporting ribs 220 are formed by recessing at one side of the scene of the blade supporting portion 200.

The left support ribs 221 and the right support ribs 222 are formed with the blade part 100 accommodated therebetween. A rib inclined surface having a predetermined inclination angle corresponding to a part or the whole of each of the depressed side surfaces 211 and 212 may be formed outside each of the support ribs 221 and 222 and the rib inclined surface may be omitted. The inclined surfaces of the ribs of the support ribs 221 and 222 may be formed at the same angle or in a curved shape along the extension of the escape angle of the escape extension 121. In addition, the boundary region between the support ribs 221 and 222 and the corresponding rib inclined surface, that is, the edge region, may include a slope portion at a predetermined angle or a curved portion with a predetermined curvature.

The depth of the receiving coupling part 210 or the height of the supporting rib 220 formed corresponding thereto may be adjusted by a part of the supporting extension part 120 formed on the blade part 100, Or may be configured to receive a portion of or all of the escape extension 121. In one embodiment,

The support extension part 120 of the blade part 100, that is, the support extension main part 122, is coupled to each other while being received in the receiving part 210 of the blade support part 200. A part of the blade part 100, that is, the support extension part 120, for example, the escape extension part 121 and / or the support extension main part 122 and the blade support part 200 are made of cemented carbide materials having the same or different properties . For example, the properties of each material include various factors such as hardness, component ratio, kind of component, or particle size, and at least one of the elements may be provided differently, and one of the hardness may be higher. Preferably a cemented carbide having a similar metal component distribution. The blade support 120, e.g., the support extension body 122, may be coupled to each other at either of the receiving joints 210 by metal adhesive, brazing, or soldering.

Fig. 3 is a view showing a modification of the blade 10. Fig.

3 (a), the supporting extension 320 of the blade unit 100 has a shape becoming narrower as it goes downward, and the supporting rib 320 and the receiving coupling unit 310 are also extended from the supporting extension 120 As shown in Fig. The receiving coupling portion 310 has a pair of depressed side surfaces 311 and 312 having outward inclination angles. The support extension 120 has a cross-sectional shape in contact with the pair of recessed side surfaces 311, 312.

In the embodiment of FIG. 3 (b), the lower end edge region of the support extension 120 has a rounded shape. The supporting ribs 420 are formed by depression of the receiving engagement portion 410. The depressed side surfaces 411 and 412 formed in the depressed area of the receiving engagement part 410 are formed parallel to each other but the depressed side surface of the lower depressed part is rounded to conform to the circular shape of the lower end edge area of the supporting extension part 120, The bottom surface of the receiving and engaging portion 410 is rounded and machined. Since the support extension part 120 is formed by a pair of rounded corner areas, the force at the time of cutting can be dispersed, so that it can be a preferable cross-section.

The provision of the rib inclined surfaces at the outer sides of the respective support ribs 321, 322 (421, 422) in the corresponding regions of the recessed side surfaces 311, 312, 411, 412 in FIGS. This is the same as the embodiment.

Fig. 4 is a manufacturing process diagram of the blade 10. Fig.

4 (a) is an exaggerated view of the sintered plate A as a PCD structure for convenience of explanation. For the manufacture of sintered plate (A), powder of cemented carbide is laid on the bottom in a round frame having a predetermined dimension, and graphite is stacked thereon. The super-high-pressure and ultra-high-pressure sintering process of 1,400 ° C or more and 5 GPa or more is carried out in the state where the cemented carbide powder and graphite are laminated. As a result, the graphite undergoes a phase change to polycrystalline diamond, and the cemented carbide powder is also sintered with the hard cemented carbide to form the upper PCD layer and the lower cemented carbide layer. Thereby forming a sintered plate (A) made of a disk-shaped polycrystalline diamond (PCD) structure having a predetermined thickness and diameter. The portion that can be cut to the longest along the plane perpendicular to the plane of the sintered plate (A) having a round plate shape composed of the polycrystalline diamond layer, i.e., the PCD layer and the cemented carbide layer is selected in the upper region, 100 is cut into a thin plate sintered material having a predetermined thickness corresponding to the thickness of the blade portion 100 at the time of forming the blade 10. That is, the maximum cutting length of the blade 10 can be ensured within a predetermined area in the diameter portion of the sintered plate (A), whereby the size of the surface of the semiconductor component material to be cut can be set. Here, the blade 10 after final processing can be set to a thin plate having a thickness of 1 mm or less in a rectangular shape, and the blade portion 100 is set to be less than the thickness of the blade 10, for example, between 10% and 50% .

FIG. 4 (b) illustrates forming the cut sheet metal sinter and the blade support 200 used for the blade part 100, with the thickness exaggerated. The outer side of the sintered thin sheet material to be used as the blade section 100 before polishing is polished to have a predetermined thickness and height. The receiving part 210 is formed on the upper surface of the blade supporting part 200 to receive the blade part 100 and is formed to have a depressed side on the inner side. A metal adhesive (B) is applied to the recessed receiving portion (210). The metal adhesive B may be applied to one or both of the receiving areas of the receiving part 210 or the blade part 100 and the application of the metal adhesive may be omitted when the two are joined by brazing or soldering.

4 (c) shows a process of joining the blade unit 100 and the blade support unit 200. FIG. The sintered thin plate material to be used as the blade portion 100 before polishing is inserted into the receiving portion 210 and then bonded to each other. The bonding force can be increased according to conditions such as a predetermined pressure, temperature, time, and the like.

FIG. 4 (d) shows the polishing process of the blade unit 100 and the blade support unit 200. The cut thin plate sintered material to be used as the blade section 100 before polishing is joined to the receiving engagement section 210 and polished to form the cutting edge 111, the cutting edge 112, the escape extension section 121, The shape of the upper edge portion of the rib 200 and the rib inclined surface are formed on the outer side thereof. It is possible to secure the centering position of the cutting edge 112 while finally forming the edge slope 111 and to increase the uniformity of the cut surfaces of the cut side semiconductor parts. After the blades 10 thus manufactured are mounted on the blade driving unit 20 of the cutting apparatus 1, the material of the semiconductor parts including the plate-shaped MLCC 2 is cut.

A modified example other than the above embodiment will be described.

The cutting device 1 may further include a camera for picking up a cutting edge 112 of the blade 10 so as to determine whether the cutting edge 112 is normal or not. As a result, it is possible to improve the productivity of the MLCC because it is possible to replace the blades before the defects occur, to reduce the defects, to detect the abnormality of the cutting edges 112 and to replace the blades, thereby reducing the blade replacement time.

The cutting device may further have a clean air jetting portion for jetting clean air toward a cutting position where the cutting operation is performed. Thereby, the defect rate can be further reduced.

The cutting apparatus includes a plurality of gripping portions for gripping the blades, and the gripping portions are rotatably provided with respect to the upper and lower coaxial axes. When the blades are to be replaced, the gripping portions are rotated with respect to the upper and lower coaxial axes, It is also possible to prevent this from being interrupted for a long time.

The cutting force can be improved by providing the cutting portion 110 for cutting the material of the semiconductor part 2 with a PCD (Polycrystalline Diamond) material because of the cutting device 1 and the blade 10 described above. Since the support extension 120 has a section having an escape angle smaller than the cutting angle of the cutting portion 110, the cutting surface of the MLCC 2 contacts the side surface of the blade 10 during the cutting process of the MLCC 2, Can be prevented. The blade support portion 200 can firmly support the blade portion 100 when the blade support portion 200 is coupled with the support extension portion 120 by any one of metal adhesive, brazing or soldering. The receiving extension 210 has a pair of depressed side surfaces 211 and 212 having outward inclination angles and the supporting extension 120 has a cross sectional shape tangent to the pair of depressed side surfaces 211 and 212 so that the MLCC 2 The blade unit 100 can maintain a vertical state with respect to the surface of the MLCC 2. The cutting portion 110 for cutting the semiconductor component 2 is made of PCD (Polycrystalline Diamond) using the cutting device 1 having the blade 10 and cut perpendicularly to the surface of the workpiece of the semiconductor component 2 .

1: Cutting device 2: MLCC, semiconductor parts
10: blade 20: blade driving part
100: blade part 110:
111: inclined slope 112: cutting edge
120: support extension part 121: escape extension part
122: support extension body 200: blade support
210: receiving portion 211: depressed left side
212: depression right side surface 220: support rib
221: left support rib 222: right support rib

Claims (5)

1. A cutting blade for manufacturing a semiconductor component comprising a Multi Layer Ceramic Condenser (MLCC)
A cutting portion formed of a polycrystalline diamond (PCD) material manufactured at a predetermined temperature and a predetermined pressure and having cutting edge slopes facing each other and forming a cutting edge along a longitudinal direction of one side thereof, and a cutting portion extending from the other side of the cutting portion to support the cutting portion A blade portion having a support extension; And
And a blade support portion having a receiving engagement portion formed to receive and engage with at least a portion of the support extension along the longitudinal direction,
Wherein the blade has a rectangular flat shape having a pair of long sides and short sides, the blade portion is provided at one long side, and the blade supporting portion is provided at the other long side.
The method according to claim 1,
Wherein the support extension has an extension section that has an escape angle smaller than the cut angle of the cut section and extends from the cut section.
The method according to claim 1,
Wherein a portion of the blade portion and the blade support portion are made of a cemented carbide material having the same or different properties and are coupled to each other by one of metal bonding, brazing, and soldering in the receiving coupling portion.
The method according to claim 1,
Wherein the receiving engagement portion has a pair of depressed side surfaces having outward inclination angles,
And the support extension has a cross-sectional shape in contact with the pair of depressed side surfaces.
A blade according to any one of claims 1 to 4; And
And a blade driving unit for linearly moving the blade so as to cut perpendicularly to the surface of the material of the semiconductor component for manufacturing a semiconductor component including an MLCC (Multi Layer Ceramic Condenser).

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