TW202029238A - Cutting blade and cutting device using the same - Google Patents

Abstract

The blade for the cut for the manufacture of the semiconductor parts including the MLCC (Multi Layer Ceremic Condenser) comprises the predetermined temperature, the cut out part which along the longitudinal direction forms the cutting in line of one side it has the drawing inclined surface which mutually faces it is made of the PCD (Polycrystalline Diamond) material manufactured in the predetermined pressure, and the blade supporting part which is combined while accommodating at least a part of the support extension part following the longitudinal direction and the blade part having the support extension part which is extended from the other side of the cut out part and supports the cut out part has the accommodation bond part formed with mole.

Description

Blade for cutting and cutting device using the same

The present invention relates to a dicing blade and a dicing device using the same. More specifically, the present invention relates to a dicing blade used to manufacture a semiconductor device including a multilayer ceramic capacitor (Multi Layer Ceramic Condenser) and a dicing device using the same.

With the development of smart phones or electric vehicles, devices such as multilayer ceramic capacitors or chip inductors used as devices have become increasingly more functional, lighter, and smaller. Among them, the number of multilayer ceramic capacitors (MLCC, Multi-Layer Ceramic Condenser (or Capacitor)) in which capacitors are stacked in multiple layers has also increased while miniaturizing. Multilayer ceramic capacitors are first made into a wide-area laminated plate shape, and then a cutting device equipped with a blade is used to cut the material of the multilayer ceramic capacitor into the required size to make a finished device. With the increase in the number of layers and progress in miniaturization, the blade material used to cut the multilayer ceramic capacitor is also made of cemented carbide with increased hardness.

However, because the number of layers and miniaturization of multilayer ceramic capacitors have been greatly enhanced, the use of cemented carbide blades to cut multilayer ceramic capacitor materials has also increased the demand for improving the uniformity of the cutting surface or reducing the defect rate of interlayer electrical communication. Use time has also become a question The problem requires a blade that can be used for a long time. For this reason, it is necessary to develop an ultra-high hardness blade that improves the cutting force.

The prior art uses Polycrystalline Diamond material, which has a hardness of about 10 times that of cemented carbide, to develop a knife edge for cutting greatly enhanced multilayer ceramic capacitors. As one of the methods, relevant personnel are developing polycrystalline diamond blades. However, if the blade body and blade are all polycrystalline diamonds, it is difficult to form a high-precision blade blade, and the price is very high.

Therefore, the object of the present invention is to provide a cutting blade and a cutting device using the same, which apply ultra-high hardness materials in order to cut greatly enhanced devices without causing defects, thereby improving cutting force and prolonging the use time.

The dicing blade used to manufacture semiconductor devices containing multilayer ceramic capacitors (Multi Layer Ceramic Condenser) that can achieve the above-mentioned object of the present invention includes: a blade member provided with a cutting portion and a supporting extension portion, and the cutting portion is set at a preset temperature It is made of a polycrystalline diamond material manufactured under a preset pressure. It has mutually opposite blade line inclined surfaces and forms a cutting blade line along the length direction of one side. The support extension is from the other side of the aforementioned cutting part Extending and supporting the aforementioned cutting portion; and the blade support member is provided with a receiving coupling portion, the receiving coupling portion is formed recessed so as to receive at least a portion of the supporting extension portion in the longitudinal direction Together. The cutting part for cutting the semiconductor device is made of polycrystalline diamond material to improve the cutting force and life.

Here, it is desirable that if the support extension portion is provided with an extension section having a relief angle smaller than the blade line angle of the cutting portion and extending from the cutting portion, build-up can be avoided in the cutting process of the multilayer ceramic capacitor The cutting surface of the ceramic capacitor contacts the side surface of the blade and the cutting defect occurs.

Ideally, a part of the blade member and the blade support member are made of a cemented carbide material with the same or different properties, and if the receiving joint part is joined to each other with one of metal bonding agent, brazing or soldering , The blade support can support the blade.

Here, it is desirable that the accommodating and coupling portion is provided with a pair of recessed side surfaces with an outwardly expanding oblique angle, and if the support extension portion has a cross-sectional shape that contacts the pair of recessed side surfaces, it can be used for cutting the multilayer ceramic capacitor. During the process, keep the blade piece perpendicular to the disc surface of the multilayer ceramic capacitor.

On the other hand, a dicing device that can achieve the object of the present invention includes: the aforementioned blade; and a blade drive unit that drives the aforementioned blade to linearly move in order to manufacture a semiconductor device including a multilayer ceramic capacitor (Multi Layer Ceramic Condenser) so as to control the semiconductor device. The material plate is cut vertically. The cutting part for cutting the semiconductor device is made of polycrystalline diamond material and can be cut perpendicular to the material disk surface of the semiconductor device.

According to the present invention, the cutting portion for cutting the semiconductor device is formed of a polycrystalline diamond material, so that the cutting force can be improved.

The supporting extension includes a section with a smaller relief angle than the cutting edge line angle, so during the cutting of the multilayer ceramic capacitor, the cutting surface of the multilayer ceramic capacitor can be prevented from contacting the side surface of the blade to cause cutting defects.

Between the receiving joints, one of the metal bonding agent, brazing or soldering is combined with the support extension part, and the effect of allowing the blade support to support the blade can be exerted.

The accommodating joint part is provided with a pair of recessed side surfaces with an outwardly expanding inclined angle, and if the supporting extension part has a cross-sectional shape that contacts the pair of recessed side surfaces, it can be used to allow the blade to be used in the process of cutting the multilayer ceramic capacitor. The effect of maintaining the vertical state of the disk surface of the ceramic capacitor.

The cutting part for cutting the semiconductor device with a cutting device equipped with a blade is made of polycrystalline diamond material, and the material disk surface of the semiconductor device can be cut perpendicularly.

1‧‧‧Cutting device

2‧‧‧Multilayer ceramic capacitors, semiconductor devices

10‧‧‧Blade

20‧‧‧Blade drive unit

100‧‧‧Blade Parts

110‧‧‧Cutting Department

111‧‧‧Slanted surface of blade line

112‧‧‧Cutting edge line

120‧‧‧Support extension

121‧‧‧Relief extension

122‧‧‧Support extension body

200‧‧‧Blade support

210‧‧‧Containment Joint

211‧‧‧The left side of the depression

212‧‧‧The right side of the depression

220‧‧‧Support rib

221‧‧‧Left support rib

222‧‧‧Right support rib

[Figure 1] is a schematic illustration of the cutting device of the present invention.

[Figure 2] is a detailed drawing of the blade.

[Figure 3] is a diagram showing a modification of the blade.

[Figure 4] is the manufacturing process diagram of the blade.

The cutting device 1 and the blade 10 of the preferred embodiment of the present invention will be described in detail below with reference to the drawings.

The first figure is a schematic illustration of the cutting device 1 of the present invention, and the second figure is a knife The detailed drawings (a) and (b) of the blade 10, the third image is a diagram showing a modification of the blade 10, and the fourth image is a manufacturing process diagram of the blade 10.

The cutting device 1 includes a blade 10 and a blade drive unit 20. The blade drive unit 20 includes a blade gripping portion (not shown) that holds the blade 10, a vertical movement shaft (not shown) connected to the blade gripping portion, and a vertical movement motor (not shown) that drives the vertical movement shaft to rotate and allows the blade gripping portion to move up and down. Not shown). In order to manufacture the semiconductor device 2 including a multilayer ceramic capacitor (Multi Layer Ceramic Condenser), the blade drive unit 20 moves the blade 10 along a straight line to cut perpendicularly to the material disk surface of the semiconductor device 2. The cutting device 1 is further provided with a control unit (not shown) to control the blade drive unit 20 and control many things including cutting speed. The longitudinal/horizontal dimensions of the material disk surface of the semiconductor device 2 can be set within the maximum cutting length of the blade 10. In order to perform the transverse cutting and longitudinal cutting of the material disk surface, the vertical movement shaft provided in the blade drive unit 20 may rotate the shaft center or the support member that fixes the material disk surface may rotate the shaft center.

The blade 10 includes a blade 100 and a blade support 200. The blade 10 has a wide and flat surface and the other surface, and both the one surface and the other surface present a right-angled quadrilateral with a pair of long sides and short sides. One side of the pair of long sides is combined with the blade member 100 for cutting, and the other side is not formed with a blade to form a blade support 200 supporting the blade member 100 and is combined with the blade holding part. The blade 100 includes a cutting portion 110 and a supporting extension portion 120.

The cutting part 110 is made of a polycrystalline diamond material manufactured under a preset temperature and a preset pressure, and is provided with a cutting edge line 112 that is provided with a blade line inclined surface 111 facing each other and along the length direction of one side. The blade line inclined surface 111 is processed and formed in such a manner that it becomes from the center of the cross section in the cutting surface relative to the length direction of the blade 100 The blade line is formed at a preset angle. Accordingly, the blade line inclined surface 111 is formed, and the cutting blade line 112 is formed in a straight line by the mutually opposed blade line inclined surfaces 111 and the maximum cutting length of the blade 10 is set.

The supporting extension 120 extends from the other side of the cutting part 110 and supports the cutting part 110. The support extension portion 120 is made of cemented carbide containing tungsten (w), and although the material of the cutting portion 110 is different, it is formed integrally. The support extension portion 120 includes a relief extension portion 121 and a support extension body portion 122. The relief extension portion 121 is an extension section having a relief angle smaller than the cutting portion 110 edge line angle and extending from the cutting portion 110. The extension section can be formed with a flat, concave or convex curved surface or a composite surface thereof. The supporting extension body portion 122 is formed by extending from the relief extension portion 121. In order to be easily processed, it is better not to have a blade line angle or a relief angle. Depending on the situation, it can be extended at various angles and can have various shapes.

Moreover, the blade member 100 may not be formed with the relief extension portion 121 in the support extension portion 120 but may be formed to extend to the support extension body portion 122 on the blade line inclined surface 111 of the cutting portion 110. Moreover, the relief extension 121 can be extended from the cutting portion 110 at a preset relief angle from the proximal end portion of the blade line inclined surface 111 starting from the cutting edge line 112 or without the support of the relief extension 121 The extension body portion 122 begins to extend. Moreover, the blade member 100 may not form the support extension body portion 122 at the support extension portion 120 and only form the relief extension portion 121 with a predetermined relief angle. Moreover, the supporting extension 120 may be integrally formed from the relief extension to the area of the supporting extension body at a preset relief angle and with a progressive curvature, or may be formed in a concave shape or a convex shape.

It is stated that the cutting part 110 is made of polycrystalline diamond material and the support extension part 120 is made of cemented carbide. However, the cutting part 110 and the support extension part 120 do not have a precise boundary between each other and are manufactured integrally with each other. There may be a little material in its boundary area The part where the quality is mixed. Moreover, the support extension 120 may also be made of polycrystalline diamond material and formed integrally with the cutting part 110.

The blade support 200 includes a receiving joint 210 and a supporting rib 220. The blade support 200 is formed in a plate shape, and has a pair of plate surfaces, and a pair of long and short side surfaces formed to connect the pair of plate surfaces. One side of the pair of long faces is provided with a recessed accommodating and coupling part 210 so as to accommodate at least a part of the supporting extension part 120 in the longitudinal direction. Accordingly, the blade member 100 accommodated in the accommodating joint 210 is interposed, that is, the recessed left side surface 211 and the recessed right side surface 212 are provided via the support extension portion 120. Corresponding to the support extension portion 120 accommodated in the accommodating joint portion 210, for example, corresponding to the thickness of the support extension body portion 122, formed in a recessed shape the same or similar thereto, ideally, in a manner larger than the thickness of the support extension body portion 122 It is formed in a recessed shape and a metal binder can be injected. The supporting rib 220 is formed by recessing the receiving joint 210 on one side of the long surface of the blade support 200.

With this, the left support rib 221 and the right support rib 222 are formed with the blade 100 accommodated therebetween. A rib inclined surface having a predetermined inclination angle can be formed on the outer side of each supporting rib 221, 222 corresponding to a part of or the entire recessed side surface 211, 212 area, and the rib inclined surface may be omitted. Moreover, the rib inclined surface of each supporting rib 221, 222 may be formed at the same angle along the extension line of the relief angle of the relief extension 121 or formed in a curved shape. Moreover, the boundary area between each of the supporting ribs 221 and 222 and the inclined surface of the rib, that is, the corner area may include an inclined portion with a predetermined angle or a curved portion with a predetermined curvature.

Furthermore, the depth of the accommodating joint 210 or the height of the supporting rib 220 formed corresponding thereto can be formed as described below, and a part of the supporting extension 120 formed on the blade member 100 can be accommodated, for example, as shown in the figure. To accommodate and support a part of the extension body 122 It can be divided or can accommodate all of the supporting extension body portion 122. In addition, it can also be formed to accommodate part or all of the relief extension portion 121.

The support extension portion 120 of the blade member 100, for example, the support extension body portion 122 is coupled to each other in a state of being accommodated in the receiving coupling portion 210 of the blade support member 200. A part of the blade member 100, that is, the supporting extension portion 120, such as the relief extension portion 121 and/or the supporting extension body portion 122, and the blade support member 200 can be made of cemented carbide materials with the same or different properties. For example, the properties of each material include many factors such as hardness, composition ratio, composition type, or particle size. At least one of the factors can be set differently, and the hardness of a certain one can be made higher. Ideally, it is composed of a cemented carbide having a similar metal composition distribution. For the blade support 120, for example, the supporting extension body portion 122 may be combined between the receiving and coupling portions 210 by one of a metal adhesive, brazing or soldering.

The third figure is a diagram showing a modification of the blade 10.

In the embodiment of the third figure (a), the supporting extension 120 of the blade member 100 has a shape that becomes narrower as it goes downward, and the supporting rib 320 and the receiving and coupling portion 310 are also formed corresponding to the shape of the supporting extension 120. The accommodating joint 310 is provided with a pair of recessed side surfaces 311 and 312 with an outwardly expanding inclined angle. The supporting extension 120 has a cross-sectional shape that contacts a pair of concave side surfaces 311 and 312.

In the embodiment of the third figure (b), the corner area of the lower end surface of the supporting extension 120 is circular. The supporting rib 420 is formed by forming a recessed shape for the receiving and connecting portion 410. The recessed side surfaces 411, 412 formed in the recessed area of the accommodating joint portion 410 are formed parallel to each other, but the lower recessed side surface is formed in a circular shape according to the round shape of the corner area of the lower end surface of the supporting extension portion 120. The bottom surface of the receiving and connecting portion 410 is also processed in a circular shape. support The end surface of the extension portion 120 is formed with a pair of rounded corner areas to disperse the force during cutting, so it is a more appropriate end surface.

Like the embodiment in the second figure, the corresponding areas of the concave sides 311, 312, 411, and 412 in the third figure (a) and the third figure (b) are outside the support ribs 321, 322, 421, 422 With inclined ribs.

The fourth figure is a manufacturing process diagram of the blade 10.

For the convenience of description, the fourth figure (a) exaggerates the sintered disc A made of polycrystalline diamond structure. In order to manufacture the sintered disc A, the cemented carbide powder is laid on the bottom in a round mold with preset dimensions and graphite is stacked on it. The ultra-high temperature and ultra-high pressure sintering process at a temperature above 1,400℃ and above 5 GPa is carried out in the state of stacking cemented carbide powder and graphite. Accordingly, the graphite undergoes a phase change to form polycrystalline diamond, and the cemented carbide powder is also sintered into a high-hardness cemented carbide to form the upper polycrystalline diamond layer and the lower cemented carbide layer. Thus, a sintered disc A composed of a disc-shaped polycrystalline diamond (PCD) structure with a predetermined thickness and diameter is formed. For the disc-shaped sintered disc A composed of a polycrystalline diamond layer (that is, a PCD layer) in the upper region and a cemented carbide layer at the lower part in such a sintered manner, the longest one is selected along the direction perpendicular to the disc surface In order to use the cut portion as the blade member 100 before grinding, it is cut into a thin disc sintered body having a predetermined thickness corresponding to the thickness of the blade member 100 when the blade 10 is formed. That is, the maximum cutting length of the blade 10 can be ensured within the predetermined area of the diameter portion of the sintering disc A, and the disc surface size of the semiconductor device material to be cut can be determined based on this. Here, the finally processed blade 10 may be a rectangular thin disk with a thickness of 1 mm or less, and the blade 100 may be set to be smaller than the thickness of the blade 10, for example, may be set to be between 10% and 50% of the blade thickness.

The fourth figure (b) shows the thin disk after cutting used as the blade 100 The knot body and the blade support 200, the figure shows the thickness exaggeratedly. The outer side of the cut thin disc sintered body used as the blade member 100 before grinding is ground to a predetermined thickness and height. On the upper surface of the blade support 200, the receiving and coupling portion 210 of the blade 100 is polished, and the inner side is formed with a concave side surface. The metal adhesive B is applied to the recessed receiving joint 210. The metal adhesive B can be coated on one or both sides of the receiving area of the receiving joint 210 or the blade member 100. If the two are joined by brazing or soldering, the coating of the metal adhesive can be omitted.

The fourth figure (c) shows the process of combining the blade 100 and the blade support 200. The thin disc sintered body after being cut and used as the blade member 100 before grinding is inserted into the receiving joining part 210 and joined to each other. When combining, the binding force can be enhanced according to the preset pressure, temperature, time and other conditions.

The fourth figure (d) shows the grinding process of the blade 100 and the blade support 200. After the thin disc sintered body used as the blade member 100 before grinding is joined to the receiving joint 210, the grinding operation is performed to form the blade line inclined surface 111, the cutting blade line 112, the relief extension 121 and the blade support 200 The shape of the upper corner portion and the inclined surface of the ribs are formed on the outer side. Finally, the edge line inclined surface 111 is formed to ensure the centering position of the cutting edge line 112 and improve the uniformity of the cutting surfaces of the semiconductor devices on both sides after cutting. After the blade 10 manufactured in this way is mounted on the blade drive unit 20 of the cutting device 1, the material of the semiconductor device including the disc-shaped multilayer ceramic capacitor 2 is cut.

Hereinafter, modifications other than the foregoing embodiment will be described.

The aforementioned cutting device may further be provided with a camera for photographing the cutting edge line 112 of the blade 10, so that it can be determined whether the cutting edge line 112 is normal or not. With this, it is possible to replace the blade before failure occurs to reduce the defect rate, grasp the abnormality of the cutting edge line 112, and replace the blade to shorten the blade The replacement time can improve the production efficiency of multilayer ceramic capacitors.

The cutting device may be further provided with a clean air spray unit that sprays clean air to the cutting position where the cutting operation is performed. This can further reduce the defect rate.

The cutting device is provided with a plurality of gripping parts for holding the blades, so that the gripping parts can be rotated relative to the vertical movement axis. When the blade needs to be replaced, the gripping parts can be rotated relative to the vertical movement axis, so that the normal blade can be used for a long time. The cutting operation of the multilayer ceramic capacitor is interrupted.

With the aforementioned cutting device 1 and blade 10, the cutting portion 110 for cutting the material of the semiconductor device 2 is made of polycrystalline diamond material to enhance the cutting force. The supporting extension 120 is provided with a section with a relief angle, which is smaller than the cutting edge angle of the cutting portion 110, so that the cutting surface of the multilayer ceramic capacitor 2 can be prevented from contacting the blade 10 during the cutting process of the multilayer ceramic capacitor 2 Poor cutting occurred on the side surface. The accommodating joints 210 are combined with one of the metal adhesive, brazing or soldering and the supporting extension 120 to allow the blade support 200 to firmly support the blade 100. The accommodating joint 210 has a pair of recessed side surfaces 211, 212 with an outwardly expanding inclined angle, and the supporting extension 120 has a cross-sectional shape that contacts the pair of recessed side surfaces 211, 212, which can be used in the process of cutting the multilayer ceramic capacitor 2 The blade 100 is kept vertical to the disk surface of the multilayer ceramic capacitor 2. The cutting portion 110 for cutting the semiconductor device 2 by the cutting device 1 provided with the blade 10 is made of polycrystalline diamond material, and the material disk surface of the semiconductor device 2 can be cut vertically.

1‧‧‧Cutting device

2‧‧‧Multilayer ceramic capacitors, semiconductor devices

10‧‧‧Blade

20‧‧‧Blade drive unit

Claims (5)

A blade used to manufacture a dicing blade for a semiconductor device including a multilayer ceramic capacitor (Multi Layer Ceramic Condenser). It is characterized by comprising: a blade member, provided with a cutting portion and a supporting extension, and the cutting portion The polycrystalline diamond is made of polycrystalline diamond material manufactured under a preset temperature and a preset pressure. It has mutually opposite blade line inclined surfaces and forms a cutting blade line along the length direction of one side. The support extension is from the aforementioned cutting part The other side extends and supports the cutting portion; and the blade support member is provided with a receiving and coupling portion that is recessed so as to accommodate at least a part of the supporting extension in the longitudinal direction to be coupled; the shape of the blade is provided with a For the flat shape of a right-angled quadrilateral with long sides and short sides, the blade member is provided on one long side, and the blade support member is provided on the other long side. The blade described in item 1 of the scope of patent application, wherein the support extension portion is provided with an extension section having a relief angle smaller than the edge line angle of the cutting section and extending from the cutting section. As described in the first item of the scope of patent application, a part of the blade member and the blade support member are made of cemented carbide materials with the same or different properties, and a metal adhesive, A combination of brazing or soldering. The blade described in item 1 of the scope of patent application, wherein the receiving and coupling portion is provided with a pair of recessed side surfaces with an outwardly expanding inclined angle, The support extension portion has a cross-sectional shape that contacts the pair of concave side surfaces. A dicing device characterized by comprising: the blade described in any one of items 1 to 4 in the scope of patent application; and a blade drive unit for manufacturing a semiconductor device including a multilayer ceramic capacitor (Multi Layer Ceramic Condenser) The blade is driven to move linearly so as to cut the material disk surface of the semiconductor device vertically.

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