JP7336947B2 - Cutting blade and cutting device using the same - Google Patents

Description

The present invention relates to a cutting blade and a cutting apparatus using the same, and more particularly, to a cutting blade and a cutting apparatus using the same for manufacturing semiconductor components including MLCCs (Multi-Layer Ceramic Condenser).

With the development of smart phones and electric vehicles, the parts used as such parts, such as multilayer ceramic capacitors and chip inductors, are becoming more functional, lighter and smaller. In particular, MLCCs (Multi-Layer Ceramic Condensers (or Capacitors)), in which capacitors are laminated in multiple layers, are increasing in the number of laminations and are being miniaturized at the same time. MLCCs are manufactured into finished parts by cutting the MLCC material to the desired size with a cutting device having a blade after the process of being manufactured into a broadly laminated plate. As the number of laminations increases and the size of the MLCC increases, cemented carbide with improved hardness is used as the material for the blade to cut the MLCC.

However, as the number of laminated layers of MLCCs increases and the miniaturization of MLCCs becomes more advanced, when cutting MLCC materials with a blade made of cemented carbide, there is a need to improve the uniformity of the cut surface and reduce the defect rate such as interlayer electrical conductivity. As a result, the usage time of the blade becomes a problem, and the need for a blade that can be used for a long period of time is increasing. Therefore, there is a need for ultra-hard blades with improved cutting power.

For advanced MLCC cutting, we are developing a blade using a PCD (Polycrystalline Diamond) material, which has about 10 times the hardness of cemented carbide. As one method, they tried to develop a blade made of PCD (Polycrystalline Diamond) material. However, when both the blade body and the blade are made of PCD (Polycrystalline Diamond), it is difficult to form a highly precise blade and the manufacturing cost is very high.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a cutting blade and a cutting blade that improve and increase the cutting force and usage time by applying an ultra-hard material so that sophisticated parts can be cut without defects. To provide a cutting device.

A cutting blade for manufacturing semiconductor parts including MLCC (Multi-Layer Ceramic Condenser) for achieving the object of the present invention is made of PCD (Polycrystalline Diamond) material manufactured at a predetermined temperature and a predetermined pressure. a blade portion having a cutting portion having blade edge inclined surfaces facing each other and forming a cutting edge along the longitudinal direction of one side; and a support extension portion extending from the other side of the cutting portion and supporting the cutting portion. and a blade support having a receiving connection recessed to receive and connect at least a portion of said support extension along its length. By forming the cutting portion for cutting the semiconductor component from a PCD (Polycrystalline Diamond) material, the cutting force and life can be improved.

If the support extension has a clearance angle smaller than the included angle of the cutting part and has an extension section extending from the cutting part, the cutting surface of the MLCC contacts the side surface of the blade during the cutting process of the MLCC. Therefore, it is possible to prevent the occurrence of cutting defects.

If the part of the blade part and the blade support part are made of cemented carbide materials of the same or different attributes, and are joined to each other by any one of metal adhesive, brazing or soldering at the accommodation joint part, It is preferable that the blade support can support the blade.

If the receiving coupling portion has a pair of concave side surfaces with an outwardly widening inclination angle, and the support extension portion has a cross-sectional shape contacting the pair of concave side surfaces, the cutting edge may be moved during the process of cutting the MLCC. It is preferable because it can maintain a vertical state with respect to the plate surface of the MLCC.

Further, a cutting apparatus for achieving the object of the present invention includes the blade and the blade for manufacturing a semiconductor component including an MLCC (Multi-Layer Ceramic Condenser). and a blade drive for linear movement to cut vertically. A cutting portion for cutting the semiconductor component is made of a PCD (Polycrystalline Diamond) material, and can cut perpendicularly to the surface of the raw material plate of the semiconductor component.

According to the present invention, the cutting force for cutting the semiconductor component can be improved by forming the cutting portion for cutting the semiconductor component from a PCD (Polycrystalline Diamond) material.

Since the support extension has a section with a clearance angle smaller than the cutting edge angle of the cutting part, it is possible to prevent the cutting surface of the MLCC from contacting the side surface of the blade during the cutting process of the MLCC, thereby preventing the cutting failure. effective.

If the support extension is connected to the housing joint by any one of metal adhesive, brazing, or soldering, the blade support can support the blade.

If the receiving coupling part has a pair of concave side surfaces with an outward widening inclination angle, and the support extension part has a cross-sectional shape contacting the pair of convex side surfaces, the blade part can cut the MLCC plate in the process of cutting the MLCC. It has the effect of maintaining a vertical state with respect to the surface.

A cutting unit for cutting semiconductor components using a cutting device having a blade is made of a PCD (Polycrystalline Diamond) material, and has the effect of being able to cut perpendicularly to the surface of the raw material plate of the semiconductor components.

1 is a schematic illustration of a cutting device according to the invention; FIG. FIG. 4 is a detailed view of the blade; It is a modification illustration figure of a blade. It is a manufacturing process drawing of a blade.

A cutting device 1 and a blade 10 according to a preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

1 is a schematic illustration of a cutting device 1 according to the present invention, FIGS. 2(a) and 2(b) are detailed drawings of the blade 10, FIG. 3 is a modified illustration of the blade 10, and FIG. 4 is a manufacturing process of the blade 10. It is a diagram.

The cutting device 1 includes a blade 10 and a blade driving section 20. As shown in FIG. The blade driving unit 20 rotates a blade gripping portion (not shown) that grips the blade 10, a vertical movement shaft (not shown) connected to the blade gripping portion, and a vertical movement shaft to move the blade gripping portion up and down. A vertical movement motor (not shown) is provided for movement. The blade driving unit 20 linearly moves the blade 10 so as to cut perpendicularly to the surface of the material plate of the semiconductor component 2 for manufacturing the semiconductor component 2 such as MLCC (Multi-Layer Ceramic Condenser). The cutting apparatus 1 further comprises a controller (not shown) to control the blade drive 20 and to control various matters including the cutting speed. The horizontal/vertical size of the material plate surface of the semiconductor component 2 can be set within the maximum cutting length of the blade 10 . For horizontal cutting and vertical cutting of the material plate surface, the vertical movement shaft provided in the blade driving part 20 rotates about the axis, or the support part for fixing the material plate surface rotates about the axis. It can be rotated against.

Blade 10 includes a blade portion 100 and a blade support portion 200 . The shape of the blade 10 has one side and the other side of a wide and flat shape, and the one side and the other side commonly have a rectangular shape with a pair of long and short sides. A blade part 100 for cutting is coupled to one side of a pair of long sides, and a blade supporting part 200 for supporting the blade part 100 is formed on the other side without forming a blade and coupled to a blade grip part. . Blade 100 has a cutting portion 110 and a support extension 120 .

The cutting part 110 is made of a PCD (Polycrystalline Diamond) material manufactured at a predetermined temperature and a predetermined pressure, has cutting edge slopes 111 facing each other, and forms a cutting edge 112 along one longitudinal direction. The blade tip inclined surface 111 is processed so that a predetermined blade tip angle is formed from the center of the cross section of the cut surface in the longitudinal direction of the blade portion 100 . As a result, the blade tip slopes 111 are formed, and the blade tip slopes 111 facing each other form the cutting blade tip 112 in a straight shape, and the maximum cutting length of the blade 10 is set.

A support extension 120 extends from the other side of the cutting portion 110 to support the cutting portion 110 . The support extension part 120 is made of cemented carbide containing tungsten (w), which is a different material from the cutting part 110 but integrally formed. The support extension 120 has a relief extension 121 and a support extension body 122 . The relief extension portion 121 is an extension section extending from the cutting portion 110 with a relief angle smaller than the included angle of the cutting portion 110 . The extension section can be formed on a flat surface, a concave or convex curved surface, or a combination thereof. The support extension main body portion 122 extends from the relief extension portion 121 and preferably does not have an included angle or relief angle because it is easy to process. In some cases, it can extend at many angles and have a variety of shapes.

Alternatively, the blade portion 100 may be formed by extending from the cutting edge inclined surface 111 of the cutting portion 110 to the support extension body portion 122 without forming the relief extension portion 121 in the support extension portion 120 . In addition, a clearance extension 121 with a predetermined clearance angle may extend from the cutting portion 110 adjacent to the end of the cutting edge inclined surface 111 starting from the cutting edge 112, or a support extension body portion 122 without the clearance extension 121 may extend. . Also, the blade part 100 may be formed only by the relief extension part 121 having a predetermined relief angle without forming the support extension body part 122 on the support extension part 120 . Also, the support extension 120 can be integrally formed to have a gradual curvature starting at a predetermined relief angle from the relief extension to the support extension body region, and can be formed concavely or convexly. can be

It is said that the cutting part 110 is made of PCD (Polycrystalline Diamond) material and the supporting extension part 120 is made of cemented carbide. Therefore, there may be parts where materials are mixed with each other in part of the boundary area. Also, the support extension part 120 may be made of PCD material and formed integrally with the cutting part 110 .

The blade support 200 has a receiving joint 210 and support ribs 220 . The blade support part 200 is formed in a plate shape and has a pair of plate surfaces and a pair of long and short side surfaces formed to connect the pair of plate surfaces. One side of the pair of long faces has a receiving joint 210 recessed to receive and join at least a portion of the support extension 120 along the longitudinal direction. Accordingly, the receiving coupling part 210 has a concave left side 211 and a concave right side 212 with the blade part 100 to be accommodated, that is, the supporting extension part 120 interposed therebetween. The receiving coupling portion 210 is recessed to a size that is the same as or similar to the thickness of the support extension 120 , that is, the support extension body 122 , and preferably greater than the thickness of the support extension body 122 . By doing so, the metal adhesive can be introduced. The support rib 220 is formed by recessing one side of the long surface of the blade support portion 200 into the accommodation coupling portion 210 .

As a result, a left support rib 221 and a right support rib 222 are formed with the blade portion 100 to be accommodated therebetween. A rib slanted surface having a predetermined slant angle may be formed on the outer side of each support rib 221, 222 corresponding to a part or all of each recessed side surface 211, 212 region, or the rib slanted surface may be can also be omitted. In addition, the rib inclined surfaces of the support ribs 221 and 222 may be formed at the same angle along the extended line of the relief angle of the relief extension portion 121 or may be formed in a curved shape. In addition, the boundary regions between the support ribs 221 and 222 and the corresponding rib inclined surface, that is, the corner regions, may include inclined portions with a predetermined angle or curved portions with a predetermined curvature.

Also, the depth of the receiving joint 210 or the height of the support rib 220 formed correspondingly therewith may be determined by a portion of the support extension 120 formed on the blade 100, such as a portion of the support extension body 122 as shown. It can be formed to accommodate a portion or to accommodate the entire support extension body portion 122 . It can also be formed to accommodate part or all of the relief extension 121 .

The support extension portion 120 of the blade portion 100, for example, the support extension body portion 122, is accommodated in the accommodation coupling portion 210 of the blade support portion 200 and coupled to each other. A portion of the blade portion 100, namely the support extension 120, such as the relief extension 121 and/or the support extension body portion 122, and the blade support 200 can be made of cemented carbide materials of the same or different properties. For example, the attributes of each material include various elements such as hardness, component ratio, type of component, or particle size, and at least one element can be provided differently, and one of which has a higher hardness. can also Preferably, it consists of a cemented carbide with a similar metal composition distribution. Support extensions 120, such as support extension body 122, can be coupled together within receiving coupling 210 by any one of metal adhesive, brazing, or soldering.

FIG. 3 is a modified illustration of the blade 10. FIG.

In the embodiment shown in FIG. 3(a), the support extension 120 of the blade 100 has a shape that tapers downward, and the support rib 320 and the receiving joint 310 also correspond to the shape of the support extension 120. formed. The receiving joint 310 has a pair of recessed sides 311, 312 with an outward diverging inclination angle. The support extension 120 has a cross-sectional shape that contacts a pair of concave sides 311 and 312 .

The embodiment of FIG. 3(b) has a rounded corner area at the lower end of the support extension 120. FIG. The support ribs 420 are formed by recessing the receiving joints 410 . The recessed sides 411 and 412 formed in the recessed area of the receiving coupling part 410 may be formed parallel to each other, but the lower recessed part has a rounded shape at the corner area of the lower end of the support extension part 120 . Correspondingly, the bottom surface of the receiving coupling portion 410 is also rounded for ease of processing. Since the cross section of the support extension 120 is formed in a pair of rounded corner regions, the cutting force can be dispersed, which is a preferable cross section.

3(a) and 3(b), corresponding to the recessed sides 311, 312; 411, 412 of FIGS. 3(a) and 3(b). It is the same as the example.

FIG. 4 is a manufacturing process diagram of the blade 10. As shown in FIG.

FIG. 4(a) is an exaggerated view of the sintered plate A composed of a PCD structure for convenience of explanation. For the production of sintered plate A, the bottom of a circular mold of given dimensions is lined with cemented carbide powder and graphite is laminated thereon. Cemented carbide powder and graphite are layered and sintered at 1,400° C. or higher and 5 GPa or higher at an ultra-high temperature and ultra-high pressure. This causes the graphite to undergo a phase change to polycrystalline diamond, and the cemented carbide powder is also sintered into a hardened cemented carbide to form an upper PCD layer and a lower cemented carbide layer. This forms a sintered plate A, which is a disk-shaped polycrystalline diamond (PCD) structure having a predetermined thickness and diameter. By sintering in this way, a polycrystalline diamond layer, that is, a PCD layer is formed in the upper region, and a cemented carbide layer is formed in the lower part. A thin plate material having a predetermined thickness corresponding to the thickness of the blade part 100 when forming the blade 10 is selected so that the part that can be cut in the vertical direction is selected and used as the blade part 100 before polishing. cutting things. That is, the maximum cutting length of the blade 10 can be secured within a predetermined area of the diameter portion of the sintered plate A, thereby setting the size of the plate surface of the semiconductor component material to be cut. Here, the blade 10 after final processing can be set to a rectangular thin plate with a thickness of 1 mm or less, and the blade portion 100 is less than the thickness of the blade 10, such as 10% to 50% of the blade thickness. can be set.

FIG. 4(b) shows the sintered thin plate material after cutting used as the blade portion 100 and the formation of the blade support portion 200, with the thickness exaggerated. The outer side of the sintered thin plate material after cutting, which is used as the blade part 100 before polishing, is polished so as to have a predetermined thickness and height. The upper surface of the blade supporting portion 200 is polished to form a recessed side surface on the inside thereof by grinding the receiving joint portion 210 in which the blade portion 100 is received. A metal adhesive B is applied to the recessed receiving joint 210 . The metal adhesive B may be applied to one or both of the accommodation joint part 210 and the accommodation area of the blade part 100, and when both are joined by brazing or soldering, the application of the metal adhesive may be omitted. can.

FIG. 4(c) shows the joining process of the blade part 100 and the blade support part 200. FIG. A sintered sheet material after cutting, which is used as the blade part 100 before polishing, is inserted into the receiving and connecting part 210 and then connected to each other. During bonding, the bonding strength can be increased by setting conditions such as predetermined pressure, temperature, and time.

FIG. 4(d) shows the polishing process of the blade portion 100 and the blade support portion 200. FIG. After the sintered thin plate material after cutting, which is used as the blade part 100 before polishing, is combined with the housing joint part 210, a polishing operation is performed to form the blade tip inclined surface 111, the cutting blade tip 112, the escape extension part 121, and the blade support part. Form the shape of the top corner of 200 and each rib ramp on its outside. It is possible to secure the centering position of the cutting edge 112 while finally forming the cutting edge inclined surface 111, thereby increasing the uniformity of the cut surfaces of the cut semiconductor parts on both sides. After the blade 10 manufactured in this manner is mounted on the blade drive unit 20 of the cutting device 1, the semiconductor component material including the plate-like MLCC 2 is cut.

Modifications other than the above embodiment will be described.

The cutting device 1 may further include a camera for imaging the cutting edge 112 of the blade 10 to determine whether the cutting edge 112 is normal. As a result, the defective rate is reduced by replacing the blade before a defect occurs, and the blade is replaced by grasping the abnormality of the cutting edge 112, so that the blade replacement time can be reduced and the productivity of the MLCC can be improved.

The cutting device can further include a clean air jetting section for jetting clean air toward the cutting position where the cutting operation is performed. This makes it possible to further reduce the defect rate.

The cutting device includes a plurality of gripping portions that grip the blades, the gripping portions are configured to be rotatable about the vertical movement shaft, and when the blades need to be replaced, the gripping portions are rotated about the vertical movement shaft. By replacing with a normal blade, it is also possible to prevent the MLCC cutting operation from being interrupted for a long period of time.

In the cutting device 1 and the blade 10, the cutting force can be improved by forming the cutting portion 110 for cutting the material 2 of the semiconductor component from a PCD (Polycrystalline Diamond) material. Since the support extension part 120 has a section with a relief angle smaller than the cutting edge angle of the cutting part 110, it prevents the cutting surface of the MLCC 2 from coming into contact with the side surface of the blade 10 during the cutting process of the MLCC 2 and causing a cutting failure. be able to. If the support extension part 120 is connected to the receiving connection part 210 by any one of metal adhesive, brazing or soldering, the blade support part 200 can firmly support the blade part 100 . If the receiving coupling part 210 has a pair of recessed sides 211, 212 with an outward widening inclination angle, and the support extension part 120 has a cross-sectional shape in contact with the pair of recessed sides 211, 212, then the MLCC 2 is cut. During the process, the blade part 100 can maintain a vertical state with respect to the plate surface of the MLCC 2 . A cutting unit 110 for cutting the semiconductor component 2 using the cutting device 1 having the blade 10 is made of a PCD (Polycrystalline Diamond) material, and can cut the semiconductor component 2 perpendicularly to the material plate surface.

REFERENCE SIGNS LIST 1 cutting device 2 MLCC, semiconductor component 10 blade 20 blade drive unit 100 blade unit 110 cutting unit 111 blade edge inclined surface 112 cutting blade edge 120 support extension 121 escape extension 122 support extension body 200 blade support 210 accommodation joint 211 Depressed left side 212 Depressed right side 220 Support rib 221 Left support rib 222 Right support rib

Claims (4)

A cutting blade for the manufacture of semiconductor components including MLCC (Multi-Layer Ceramic Condenser),
A cutting portion made of a PCD (Polycrystalline Diamond) material manufactured at a predetermined temperature and a predetermined pressure, having cutting edge inclined surfaces facing each other and forming a cutting edge along the longitudinal direction of one side, and the cutting portion a blade portion having a support extension extending from the other side to support the cutting portion ,
the blade portion, wherein the cutting portion is made of PCD material, the support extension portion is made of cemented carbide containing tungsten (W), and the cutting portion and the support extension portion are integrally formed;
a blade support having a receiving coupling recessed to receive and couple at least a portion of said support extension along its length;
The blade has a rectangular flat shape with a pair of long sides and short sides, the blade part is provided on one long side, and the blade support part is provided on the other long side, blade. 2. The blade of claim 1, wherein the support extension has a clearance angle less than the included angle of the cutting portion and has an extension section extending from the cutting portion. 2. The blade according to claim 1, wherein the receiving joints are connected to each other by one of metal adhesive, brazing or soldering. the receiving coupling portion has a pair of concave side surfaces with an outwardly widening inclination angle;
2. The blade of claim 1, wherein said support extension has a cross-sectional shape that contacts said pair of concave sides.