KR101254960B1 - Scribing wheel, scribing apparatus, and scribing method - Google Patents

Abstract

(Problem) Provided are a scribing wheel capable of forming a good scribe line on a brittle material substrate, a scribing apparatus having the scribing wheel, and a scribing method using the scribing wheel.
(Solving means) The sintered diamond used for shaping the scribing wheel 50 has diamond particles and a binding phase (including an additive and a binder) of the remainder, and the average particle diameter of the particles of the diamond is preferably It is the range of 0.6-1.5 (micrometer). Content of the diamond in sintered diamond becomes like this. Preferably it is the range of 65.0-75.0 (weight%). Moreover, content of the ultrafine carbides in sintered diamond becomes like this. Preferably it is the range of 3.0-10.0 (weight%). The content of the binder in the sintered diamond is preferably the remainder of the diamond and the ultrafine carbides.

Description

Scribing wheel, scribing device and scribing method {SCRIBING WHEEL, SCRIBING APPARATUS, AND SCRIBING METHOD}

The present invention relates to a scribing wheel made of sintered diamond, a scribing apparatus having the scribing wheel, and a scribing method using the scribing wheel.

Conventionally, the technique which cuts the laminated glass substrate formed by joining two glass substrates together with several unit laminated glass by a series of scribing process and a brake process is known (for example, patent document 1).

Moreover, the technique which generate | occur | produces a deep vertical crack in a glass plate, without generating a horizontal crack is known conventionally by providing a protrusion part in the ridge line part of a blade edge (for example, patent document 2).

Moreover, the technique of dividing the single-sided board | substrate of both front and back which forms a junction board continuously in two directions orthogonal to a horizontal direction is also known conventionally, without rotating it 90 degrees in a vertical direction and a horizontal direction. (For example, patent document 3).

Moreover, by making the outer diameter of a wheel, the depth of a groove, and the length of the ridge line between grooves into a desired range, the technique of reducing the abrasion of the blade edge of a scribing wheel and making the scribing wheel longer is also known conventionally (for example, , Patent Document 4).

Japanese Patent No. 3042192 Japanese Patent No. 3074143 International Publication No. 2005/087458 International Publication No. 2009/148073

Here, as one of the methods for reducing the number of scribing processes, the scribing wheel and the brittle material substrate (e.g., And a glass substrate) may be mentioned.

However, in this technique, a problem arises in that the advancing direction of the scribing wheel changes in a state in which it is in contact with the brittle material substrate, and in some cases, the protrusion of the blade tip is missing.

Accordingly, the present invention provides a scribing wheel capable of forming a good scribing line on a brittle material substrate, a scribing apparatus having the scribing wheel, and a scribing method using the scribing wheel. It aims to do it.

In order to solve the said subject, invention of Claim 1 is a scribing wheel made from sintered diamond, Comprising: A disk-shaped main body part, an annular blade formed in the outer periphery of the said main body part, and the outermost of the said blade. Thus, a blade tip having a plurality of protrusions formed, the thickness of the blade is smaller from the center of the body portion toward the blade tip, the cross section of the plane passing through the outermost central axis of the blade is V-shaped Each protrusion is formed between adjacent grooves among a plurality of grooves formed along the blade edge, and the sintered diamond is 65.0 to 75.0 wt% diamond and 3.0 to 10.0 wt% ultrafine carbide And a remainder of the binder, wherein the average particle diameter of the diamond is in the range of 0.6 to 1.5 µm, and the binder is an iron-based metal containing cobalt. All.

In addition, in the scribing wheel according to claim 1, the invention of claim 2, wherein the ultrafine particle carbide is in the range of 6.0 to 8.0% by weight, and 1.0 to 4.0% by weight of titanium carbide and the balance of tungsten carbide It is characterized by including.

The invention of claim 3 further includes a scribing unit for forming a scribe line on the brittle material substrate by rolling a scribing wheel according to claim 1 or 2 with respect to the brittle material substrate. And a holding unit for moving the held and holding the brittle material substrate relative to the scribe unit while holding the brittle material substrate.

In addition, the invention of claim 4 is a method of forming a scribe line on a brittle material substrate by the scribing wheel according to claim 1 or 2, wherein (a) the scribing wheel is fitted to the brittle material substrate. Relatively touching the scribing wheel in a first horizontal direction parallel to the brittle material substrate, and (b) after the step (a), fitting the scribing wheel to the brittle material substrate. And a step of changing the moving direction of the scribing wheel from the first horizontal direction to a second horizontal direction different from the first horizontal direction while being in parallel with the brittle material substrate in the contacted state. do.

According to the invention according to claim 1, the sintered diamond constituting the scribing wheel includes 65.0-75.0 wt% diamond, 3.0-10.0 wt% ultrafine carbide, and the remainder of the binder. The average particle diameter of diamond is 0.6-1.5 micrometers, and a binder is an iron type metal containing cobalt.

As a result, the scribing wheel made of sintered diamond can improve not only the wear resistance and impact resistance characteristics but also the torsion resistance characteristics. That is, even when the scribing wheel changes in the advancing direction of the scribing material substrate in contact with the brittle material substrate to be cut, it is possible to effectively prevent the protrusion of the blade tip from being missing. Therefore, longer life of the scribing wheel can be realized.

In particular, according to the invention described in claim 2, 1.0 to 4.0% by weight of titanium carbide is contained in the ultrafine particle carbide. Thereby, abnormal grain growth of diamond grains can be suppressed at the time of melt-solidification of the diamond in a sintering process. Therefore, the torsion strength characteristic can be improved further.

BRIEF DESCRIPTION OF THE DRAWINGS It is a front view which shows an example of the whole structure of the scribe apparatus in embodiment of this invention.
FIG. 2 is a side view showing an example of the entire configuration of a scribe device according to the embodiment of the present invention. FIG.
3 is a front view illustrating an example of a configuration near a scribing wheel.
4 is a bottom view illustrating an example of a configuration near a scribing wheel.
5 is a bottom view for explaining the caster effect.
6 is a side view illustrating an example of a configuration of a scribing wheel.
7 is a front view illustrating an example of a configuration of a scribing wheel.
FIG. 8 is an enlarged view of a portion A of FIG. 6.
9 is a view showing another example of a groove shape formed at the blade tip of the scribing wheel.
10 is a view showing another example of a groove shape formed at the blade tip of the scribing wheel.
11 is a view showing another example of a groove shape formed at the blade tip of the scribing wheel.
It is a top view for demonstrating a torsion test.
It is a figure for demonstrating the test conditions of Example 1, the comparative example 1, and the comparative example 2. FIG.
It is a photograph which shows the protrusion part of the scribing wheel of Example 1 before a torsion test.
It is a photograph which shows the protrusion part of the scribing wheel of Example 1 after a torsion test.
It is a photograph which shows the protrusion part of the scribing wheel of the comparative example 1 before a torsion test.
It is a photograph which shows the protrusion part of the scribing wheel of the comparative example 1 after a torsion test.
It is a photograph which shows the processus | protrusion part of the scribing wheel of the comparative example 2 before a torsion test.
It is a photograph which shows the protrusion part of the scribing wheel of the comparative example 2 after a torsion test.
20 is a diagram for explaining test conditions of Example 2, Comparative Example 1, and Comparative Example 2. FIG.

(Mode for carrying out the invention)

<1. Configuration of Scribe Devices>

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail, referring drawings.

1 and 2 are front and side views respectively showing an example of the entire configuration of the scribe device 1. 3 and 4 are front and bottom views showing an example of the configuration near the scribing wheel 50. 5 is a bottom view for explaining the caster effect.

The scribing apparatus 1 has a scribe line (cutting line: vertical) on the surface of a substrate (hereinafter, also simply referred to as a "brittle material substrate") 4 formed of a brittle material, such as a glass substrate or a ceramic substrate. It is a device to put a crack).

As shown in FIG. 1 and FIG. 2, the scribe device 1 mainly includes a holding unit 10, a scribe unit 20, an imaging unit 60, and a control unit 90. . In addition, in order to make clear the direction relationship, the XYZ Cartesian coordinate system which makes a Z-axis direction a vertical direction and makes an XY plane a horizontal plane is attached to each figure after FIG. 1 and subsequent figures as needed.

Here, as shown in FIG. 3, when the scribe line SL is formed in the surface of the brittle material board | substrate 4 by the scribing apparatus 1, it is perpendicular to a brittle material board | substrate 4 (Z-axis direction). Vertical cracks K are generated (scribe step).

Then, stress is applied to the brittle material substrate 4 where the vertical crack K has occurred (brake step), so that the main surface of the brittle material substrate 4 on which the scribe line SL is formed is perpendicular to the main surface on the opposite side thereof. The method of growing the crack K and cutting the brittle material substrate 4 is referred to as "cutting edge".

On the other hand, only by the scribing process (that is, without executing the brake process), the vertical crack K is extended from the main surface of the scribe line SL of the brittle material substrate 4 to the opposite main surface, thereby brittle. The method of cutting the material substrate 4 is called "dividing."

These, splitting and dividing are grinding cutting using a diamond cutting saw (or wheel), or a diamond dicing saw, wherein generating cutting chips is an essential element for cutting, since the essential element for cutting is the extension of the vertical crack. It is a more preferable cutting method.

Moreover, glass, ceramic, silicon, sapphire, etc. are mentioned as an example of the material of the brittle material board | substrate 4 which can be cut or divided by the scribing method of this embodiment. In particular, in recent years, as a substrate used for high-frequency modules related to communication devices, the transition from HTCC (High Temperature Co-fired Ceramics) to relatively easy to process low temperature co-fired ceramics (LTCC) has been accelerated. Therefore, the scribing method of this embodiment is used more and more effectively.

The holding unit 10 holds the brittle material substrate 4 and moves the held brittle material substrate 4 relative to the scribe unit 20. As shown in FIG. 1, the holding unit 10 is formed on a base 10a and mainly includes a table 11, a ball screw mechanism 12, and a motor 13.

Here, the base 10a is formed of the substantially rectangular parallelepiped stone plate, for example, and the upper surface (surface facing the holding unit 10) is flattened. Thereby, the thermal expansion of the base 10a can be reduced, and the brittle material board | substrate 4 hold | maintained by the holding unit 10 can be moved favorably.

The table 11 adsorbs and holds the mounted brittle material substrate 4. In addition, the table 11 moves the retained brittle material substrate 4 in the arrow AR1 direction (X axis plus or minus direction: hereinafter, also referred to simply as the "retraction direction"), and the arrow ( Rotate in the R1) direction. As shown to FIG. 1 and FIG. 2, the table 11 mainly has the adsorption | suction part 11a, the rotating table 11b, and the moving table 11c.

The suction part 11a is formed above the swivel table 11b. As shown in FIG. 1 and FIG. 2, the brittle material substrate 4 can be mounted on the upper surface of the adsorption | suction part 11a. In addition, a plurality of suction grooves (not shown) are arranged in a lattice shape on the upper surface of the suction part 11a. Therefore, in the state where the brittle material substrate 4 is placed, the atmosphere in each adsorption groove is evacuated (suctioned), so that the brittle material substrate 4 is adsorbed to the adsorption portion 11a.

The rotating table 11b is formed below the adsorption part 11a, and rotates the adsorption part 11a about the rotating shaft 11d substantially parallel to a Z axis. In addition, the movable table 11c is formed below the rotary table 11b, and moves the suction part 11a and the rotary table 11b along the advance direction.

Accordingly, the brittle material substrate 4 adsorbed and held on the table 11 is moved forward and backward in the direction of the arrow AR1 and rotated around the rotating shaft 11d moving along with the advancing and retracting operation of the adsorption portion 11a. .

The ball screw mechanism 12 is arrange | positioned under the table 11, and advances the table 11 to an arrow AR1 direction. As shown to FIG. 1 and FIG. 2, the ball screw mechanism 12 mainly has the feed screw 12a and the nut 12b.

The feed screw 12a is a rod extending along the advancing and retracting direction of the table 11. A spiral groove (not shown) is formed in the outer peripheral surface of the feed screw 12a. Moreover, one end of the feed screw 12a is rotatably supported by the support part 14a, and the other end of the feed screw 12a is rotatably supported by the support part 14b, respectively. In addition, the feed screw 12a is interlocked with the motor 13, and when the motor 13 rotates, the feed screw 12a rotates in the rotation direction.

The nut 12b advances and retreats in the arrow AR1 direction by the rolling motion of the ball which is not shown in accordance with the rotation of the feed screw 12a. As shown to FIG. 1 and FIG. 2, the nut 12b is being fixed to the lower part of the movable stand 11c.

Therefore, when the motor 13 is driven and the rotational force of the motor 13 is transmitted to the feed screw 12a, the nut 12b moves forward and backward in the direction of the arrow AR1. As a result, the table 11 to which the nut 12b is fixed advances and retreats in the arrow AR1 direction similarly to the nut 12b.

The pair of guide rails 15 and 16 restrict the movement of the table 11 in the advancing direction. As shown in FIG. 2, the pair of guide rails 15 and 16 are fixed apart by a predetermined distance in the direction of the arrow AR2 on the base 10a.

The sliding part 17 (17a, 17b) of the some (two in this embodiment) is free to slide along the guide rail 15 to the arrow AR1 direction. As shown to FIG. 1 and FIG. 2, each sliding part 17 (17a, 17b) is fixed to the arrow AR1 by the predetermined distance in the lower part of the movable stand 11c.

The sliding part 18 of two or more (this embodiment is two: However, for the convenience of illustration only the sliding part 18a) is sliding freely along the guide rail 16 to arrow AR1 direction. As shown in FIG. 1 and FIG. 2, each sliding part 18 is a predetermined distance in the direction of an arrow AR1 in the lower part of the movable stand 11c similarly to the sliding parts 17 (17a, 17b). As long as it is fixed.

In this way, when the rotational force of the motor 13 is applied to the ball screw mechanism 12, the table 11 moves along the pair of guide rails 15 and 16. Thus, the straightness of the table 11 in the advancing direction can be ensured.

The scribe unit 20 press-bonds the scribing wheel 50 (refer FIG. 3) made of sintered diamond with respect to the brittle material board | substrate 4 hold | maintained by the holding unit 10, and the brittle material board | substrate 4 The scribe line SL is formed on the surface of the (). As shown to FIG. 1 and FIG. 2, the scribe unit 20 mainly has the head part 30 and the drive part 40. As shown in FIG.

The head portion 30 is also referred to as a pressing force (hereinafter, simply referred to as a "scribing load") from the held scribing wheel 50 to the surface of the brittle material substrate 4 by a lifting / pressing mechanism (not shown). Calling). As shown in FIG. 3, the head part 30 has a holder 35. In addition, the holder 35 is an element for holding the scribing wheel 50 freely in rotation. As shown in FIG. 3, the holder 35 mainly has the pin 36, the support frame 37, and the turning part 38. As shown in FIG.

The pin 36 is a rod body fixed in the inserted state in the through-hole 50a which penetrates the scribing wheel 50. As shown in FIG. Here, the through hole 50a extends along the rotating shaft 50b which is substantially parallel to the X axis, as shown in FIG. 3 and FIG. 4.

As shown in FIG. 3, the support frame 37 is a structure arrange | positioned so that both openings (both ends) of the through hole 50a may be covered. The pins 36 protruding from both ends of the through hole 50a are rotatably provided with respect to the support frame 37. Therefore, the scribing wheel 50 fixed to the pin 36 is free to rotate with respect to the support frame 37.

3, the turning part 38 is formed in the upper part of the support frame 37, and rotates the support frame 37 about the rotating shaft 38a substantially parallel to a Z axis. As shown in FIG. 4, the position of the rotating shaft 38a of the turning part 38 seen from the lower surface, and the installation position 50c of the holding unit 10 in the brittle material board | substrate 4 are shift | deviated.

As a result, when the advancing direction of the scribing wheel 50 changes from the arrow AR3 (double dashed line) direction to the arrow AR4 (solid line) direction as shown in FIG. Torque around the rotating shaft 38a acts on the scribe wheel 50. Therefore, the scribing wheel 50 rotates in the direction of the arrow AR2, and the position of the scribing wheel 50 changes from the dashed-dotted position to the solid line position.

In this way, even when the advancing direction of the scribing wheel 50 is changed and the attitude of the scribing wheel 50 is shifted by the angle θ1 with respect to the advancing direction, an arrow ( Torque in AR2) acts. As a result, the scribing wheel 50 turns so that the attitude | position of the scribing wheel 50 and the advancing direction of the scribing wheel 50 become substantially parallel.

The drive part 40 reciprocates the head part 30 in which the scribing wheel 50 was formed in the arrow AR2 direction (Y-axis plus or minus direction: hereinafter, also only called "return direction"). As shown in FIG. 2, the drive part 40 mainly has the support | pillar 41, the rail 42, and the motor 43. As shown in FIG.

The plurality of pillars (two in this embodiment) 41 (41a, 41b) extend from the base 10a in the vertical direction (Z-axis direction). As shown in FIG. 2, each guide rail 42 is fixed with respect to these support | pillars 41a and 41b in the state clamped between support | pillars 41a and 41b.

The plurality of guide rails 42 (two in this embodiment) restrict the movement of the head portion 30 in the reciprocating direction. As illustrated in FIG. 2, the plurality of guide rails 42 are fixed apart by a predetermined distance in the vertical direction.

The motor 43 is interlocked with the transfer mechanism (for example, ball screw mechanism) which is not shown in figure. As a result, when the motor 43 rotates, the head portion 30 reciprocates in the direction of the arrow AR2 along the plurality of guide rails 42.

The scribing wheel 50 is press-bonded on the brittle material substrate 4 to form a scribe line SL (see FIG. 3) on the brittle material substrate 4. The scribing wheel 50 is formed by, for example, forming sintered diamond (hereinafter, simply referred to as "PCD"). In addition, the detailed structure of the scribing wheel 50 is mentioned later.

The imaging unit 60 captures an image of the brittle material substrate 4 held by the holding unit 10. As shown in FIG. 2, the imaging unit 60 has a plurality of cameras 65 (65a, 65b).

The plurality of cameras 65 (65a, 65b in the present embodiment) are arranged above the holding unit 10 as shown in Figs. 1 and 2. Each camera 65 (65a, 65b) image | photographs the image of the characteristic part (for example, alignment mark (not shown)) formed on the brittle material board | substrate 4. As shown in FIG. And based on the image picked up by each camera 65 (65a, 65b), the position and attitude | position of the brittle material board | substrate 4 can be calculated | required.

Here, the "position" of the brittle material substrate 4 means arbitrary positions on the brittle material substrate 4 in the absolute coordinate system. In addition, "posture" of the brittle material substrate 4 means four sides when the baseline of the brittle material substrate 4 with respect to the reciprocating direction of the head part 30 (for example, when the brittle material substrate 4 is a rectangular shape). Let's say the slope of 1 side).

In addition, in this embodiment, the square brittle material board | substrate 4 is used, and the alignment mark is formed in two adjacent corners among the four corners of the brittle material board | substrate 4. In addition, each alignment mark is imaged with the corresponding camera 65a, 65b, and the position of each alignment mark in an absolute coordinate system can be calculated | required based on these image picked up. And the position and attitude | position of the brittle material board | substrate 4 are computed based on the position of these alignment marks.

The control unit 90 realizes operation control and data operation of each element of the scribe device 1. As shown in FIG. 1 and FIG. 2, the control unit 90 mainly includes a ROM 91, a RAM 92, and a CPU 93.

The ROM (Read Only Memory) 91 is a so-called nonvolatile storage unit, for example, in which a program 91a is stored. In addition, as the ROM 91, a flash memory which is a nonvolatile memory that is free to read and write may be used. The RAM (Random Access Memory) 92 is a volatile storage unit, for example, which stores data used in the calculation of the CPU 93.

The CPU (Central Processing Unit) 93 controls the control according to the program 91a of the ROM 91 (advancing / rotating operation of the holding unit 10 and reciprocating operation of the head unit 30 by the drive unit 40). Control), and data processing such as position and attitude calculation of the brittle material substrate 4 is executed.

For example, the CPU 93,

(1) While calculating the position and attitude of the brittle material substrate 4,

(2) On the basis of the calculation result of this position and posture, by rotating the swivel table 11b and moving the moving table 11c forward and backward,

The alignment process of the brittle material substrate 4 with respect to the head part 30 is performed.

<2. Composition of Scribing Wheel>

6 and 7 are side and front views illustrating an example of the configuration of the scribing wheel 50. 8 is an enlarged view of a portion A of FIG. 6. As shown in FIGS. 3-7, the scribing wheel 50 is arrange | positioned so that the lower bottom surface (but lower surface is larger in area than an upper bottom surface) of two truncated cones may mutually oppose, and will be substantially disk shape ( Abacus ball shape). As shown to FIG. 6 thru | or 8, the scribing wheel 50 mainly has the main-body part 51, the blade 52, and the blade tip 52a.

As shown in FIG. 6 and FIG. 7, the main body 51 has a disk shape, and in the vicinity of the center of the main body 51, a through hole penetrating the main body 51 along the rotation shaft 50b ( 50a) is formed. In addition, an annular body portion 51 is formed on the outer circumference of the body portion 51.

As shown in FIG. 6, the blade 52 is an annular body formed by the inner circumference and outer circumference of the concentric shape centering on the rotating shaft 50b. As shown in FIG. 7, the blade 52 has a V shape when viewed from the front. The thickness Tb (refer FIG. 7) of the blade 52 along the rotating shaft 50b becomes small gradually toward the blade tip 52a from the rotating shaft 50b side.

The blade tip 52a has the outermost periphery of the blade 52 (that is, the portion from which the distance from the rotation axis 50b becomes the largest and the thickness Tb of the blade 52 becomes the minimum in the blade 52). Therefore, it is formed. As shown in FIG. 8, while the blade edge | tip 52a has the projection 54, the groove | channel 53 and the ridgeline 54a are formed in the blade edge | tip 52a.

The some groove 53 is a substantially V-shaped recessed part seen from the side surface formed in the blade edge | wing 52a. As shown in FIG. 8, the adjacent grooves 53 are formed apart by a desired pitch P along the outer circumference of the blade 52.

As shown in FIG. 8, the some protrusion part 54 is formed along the outermost peripheral part of the main-body part 51. As shown in FIG. More specifically, each of the protrusions 54 is formed between the adjacent grooves 53 among the plurality of grooves 53 formed along the blade edge 52a.

8, only three grooves 53 and four projections 54 are described in the case of illustration. In addition, the some groove 53 formed in the blade edge 52a is intentionally processed by the micron order. Therefore, the some groove 53 is distinguished from the grinding streak which is necessarily formed by the grinding process at the time of blade edge 52a formation.

<2. 1. Dimensions of the scribing wheel

Here, the outer diameter Dm (see FIG. 7) of the scribing wheel 50 is preferably in the range of 1 to 5 (mm) (more preferably 1 to 3 (mm)). When the outer diameter Dm of the scribing wheel 50 is smaller than 1 mm, the handleability and durability of the scribing wheel 50 fall. On the other hand, when the outer diameter Dm of the scribing wheel 50 is larger than 5 mm, the vertical crack K at the time of scribing may not be deeply formed with respect to the brittle material board | substrate 4.

In addition, the thickness Th (see FIG. 7) of the scribing wheel 50 is preferably in the range of 0.5 to 1.2 (mm) (more preferably, 0.5 to 1.1 (mm)). When the thickness Th of the scribing wheel 50 is smaller than 0.5 mm, workability and handleability may fall. On the other hand, when the thickness Th of the scribing wheel 50 is larger than 12 mm, the cost for material and manufacturing of the scribing wheel 50 becomes high.

The blade tip angle θ2 (see FIG. 7) of the blade 52 is usually an obtuse angle, preferably in the range of 90 <θ2 ≦ 160 (deg) (more preferably 100 ≦ θ2 ≦ 140 (deg)). to be. In addition, the specific angle of the blade angle | corner (theta) 2 is suitably set from the material of the brittle material board | substrate 4 to cut | disconnect, and / or thickness.

Further, the depth Dp (in other words, the height of the projection 54) of the groove 53 formed in the blade tip 52a is preferably 1 to 60 (µm), usually 2 to 25 (µm) (more preferred). Preferably it is the range of 3-15 (micrometer).

In addition, the pitch P (refer FIG. 8) between the adjacent grooves 53 becomes like this. Preferably it is the range of 20-200 (micrometer) (more preferably, 30-70 (micrometer)). When the pitch P between the adjacent grooves 53 is smaller than 20 micrometers, abrasion of the blade edge 52a of the scribing wheel 50 may become large and durability may fall. On the other hand, when this pitch P is larger than 200 micrometers, the favorable vertical crack K may not be formed in the brittle material board | substrate 4.

In addition, the length L (see FIG. 8) of the ridge line 54a formed between the adjacent grooves 53 is preferably 25 to 75 (µm) (more preferably 25 to 75 (µm)). Range. When the length L of this ridgeline 54a is smaller than 25 micrometers, sufficient effective cutting length cannot be ensured and the problem that the life of the scribing wheel 50 becomes short will arise.

The ratio Rt (= W / L) of the width W of the groove 53 to the length L of the ridge line 54a is preferably 0.5 to 5.0 (more preferably 1.0 to 3.5). Range. In this case, the effective cutting length can be sufficiently secured.

<2. 2. Materials included in the scribing wheel>

Moreover, it is preferable that the sintered diamond used for shaping | molding the scribing wheel 50 has the diamond particle and the bonding phase of remainder, and the diamond particle which adjoins mutually is mutually bonded. Adjacent diamond particles are bonded to each other to obtain excellent wear resistance and strength.

Here, among the materials contained in the sintered diamond, the diamond particles, the binder and the additive contained in the bonding phase will be described.

The average particle diameter of diamond grains becomes like this. Preferably it is the range of 0.6-1.5 (micrometer) (more preferably, 0.7-1.0 (micrometer)).

Here, in the scribing wheel 50, the sharpness is required in the ridge line 54a of the protrusion part 54. As shown in FIG. Therefore, the average particle diameter of diamond grains needs to be at least 1.5 micrometers or less ultrafine particles.

On the other hand, when the average particle diameter of the diamond is less than 0.6 µm, cracks tend to propagate at the diamond grain boundaries. Therefore, if the torsional force is repeatedly applied to the protrusion 54 of the blade tip 52a, the defect of the protrusion 54 is encouraged. As a result, there arises a problem that the service life of the scribing wheel 50 is shortened.

The content of diamond in the sintered diamond is preferably in the range of 65.0 to 75.0 (wt%) (more preferably 68.0 to 72.0 (wt%): 85.0 to 86.0 (volume%)). Here, when content of diamond is less than 68.0 weight%, the abrasion resistance of sintered diamond falls.

As the additive, for example, ultrafine carbides of at least one or more elements selected from tungsten, titanium, niobium and tantalum are suitably used.

Here, content of the ultrafine particle carbide in sintered diamond becomes like this. Preferably it is the range of 3.0-10.0 (weight%).

More preferably, the content of the ultrafine carbide is in the range of 6.0 to 8.0 (wt%), and the ultrafine carbide includes 1.0 to 4.0 (wt%) titanium carbide and the balance of tungsten carbide. Thereby, abnormal grain growth of diamond grains can be suppressed at the time of melt-solidification of the diamond in a sintering process. Therefore, the torsion strength characteristic can be improved further.

As a binder, an iron group element is normally used suitably. As an iron group element, cobalt, nickel, iron, etc. are mentioned, for example, cobalt is suitable among these. The content of the binder in the sintered diamond is preferably the remainder of the diamond and the ultrafine carbides, more preferably in the range of 20 to 25 (wt%).

In addition, "weight%" in this embodiment is calculated | required based on elemental analysis performed by Energy Dispersive X-ray spectrometry (EDX). In addition, "capacity%" means the ratio of the total volume of the diamond particle with respect to the total volume of the sintered diamond containing a void.

<3. Manufacturing Method of Scribing Wheel>

In explaining the manufacturing method of the scribing wheel 50, first, the sintering method of sintered diamond is demonstrated, and the method of shape | molding the scribing wheel 50 from sintered diamond is demonstrated first.

<3. 1. Sintering method of sintered diamond>

Here, the sintering method of sintered diamond is demonstrated. In this sintering method, the above-mentioned diamond particle, binder, and additive are mixed first. Next, these mixtures are sintered under high temperature and ultrahigh pressure at which the diamond is thermodynamically stable. Thus, sintered diamond is produced.

Here, at the time of sintering, the pressure in the mold of the ultrahigh pressure generator is preferably in the range of 5 to 8 (GPa). Moreover, the temperature in this metal mold | die becomes like this. Preferably it is the range of 1500-1900 (degreeC).

<3. 2. Molding method of scribing wheel>

Here, the method of shaping the scribing wheel 50 from the produced sintered diamond is demonstrated. First, in this shaping | molding method, the disk which turns into a desired radius is cut out from the sintered diamond of the suitable thickness (0.5-1.2 (mm)) first.

Next, the peripheral edge of the disk is shaved so that the thickness Tb of the blade 52 along the rotation shaft 50b gradually decreases from the rotation shaft 50b side toward the blade tip 52a. As a result, a V-shaped blade 52 is formed in front of the peripheral portion of the disk.

Then, a plurality of grooves 53 are formed in the blade edge 52a by conventionally known processing methods such as laser processing, electric discharge processing, or grinding processing. In addition, the scribing wheel 50 of this embodiment is small diameter (1-5 (mm)) as mentioned above, and processing precision is calculated | required in formation of the groove 53. As shown in FIG. Therefore, laser processing is preferable as the processing method of the groove 53, and YAG laser is mentioned as a laser beam used, for example.

<4. Scribe Method>

Here, the method of forming the scribe line SL on the brittle material board | substrate 4 by the scribing wheel 50 is demonstrated.

In this method, the scribing wheel 50 of the head part 30 is press-contacted with respect to the brittle material board | substrate 4 by the lifting / pressing mechanism which is not shown in figure. Further, the brittle material substrate 4 in which the motor 13 of the holding unit 10 and / or the motor 43 of the driving unit 40 is driven, and the head portion 30 is held by the holding unit 10. Relative to the horizontal plane. Therefore, on the brittle material substrate 4, the desired scribe line SL is formed by the scribing wheel 50, and the vertical crack K generate | occur | produces.

Here, the scribe load is preferably in the range of 5 to 50 (N) (more preferably 15 to 30 (N)). In addition, the moving speed of the scribing wheel 50 with respect to the brittle material substrate 4 (hereinafter, also simply referred to as "scribing speed") is preferably in the range of 50 to 300 (mm / sec). In addition, the specific value of the scribe load and the scribe speed is suitably set from the material of the brittle material board | substrate 4, and / or thickness.

In addition, on the brittle material substrate 4, the following scribe line SL is formed according to the relative movement of the head part 30. FIG.

For example, when the motor 13 is driven while the motor 43 is stopped, the holding unit 10 moves forward and backward (in the direction of the arrow AR1 in FIG. 1) while the head part 30 is stopped. Is moved to). That is, the head part 30 moves relative to the brittle material substrate 4 held by the holding unit 10 in the advancing direction. Therefore, the scribe line SL (refer FIG. 3) along this advancing direction is formed in the upper surface of the brittle material substrate 4. As shown in FIG.

On the other hand, when the motor 43 is driven in the state in which the motor 13 is stopped, in the state in which the holding unit 10 is stopped, the head portion 30 moves in the reciprocating direction (the arrow AR2 direction in FIG. 2). Is moved. That is, the head part 30 relatively moves in the reciprocating direction with respect to the brittle material substrate 4 held by the holding unit 10. Therefore, the scribe line SL (refer FIG. 3) along this reciprocation direction is formed in the upper surface of the brittle material board | substrate 4. As shown in FIG.

The operating state of each of the motors 13 and 43 is (1) the motor 43 is stopped, and from the state in which the motor 13 is driven, (2) the motor 13 is stopped and the motor 43 Is changed to the driven state, the moving direction of the head portion 30 is changed from the advancing direction (first horizontal direction) parallel to the brittle material substrate 4 by the caster effect in the reciprocating direction (second horizontal direction). do. That is, the direction of the blade tip 52a of the scribing wheel 50 is changed by 90 degrees while the scribing wheel 50 is in contact with the brittle material substrate 4. Therefore, a substantially L-shaped scribe line SL (see FIG. 3) is formed on the upper surface of the brittle material substrate 4.

In addition, when the motors 13 and 43 rotate at the same time, the advancing direction of the head part 30 is inclined with respect to the advancing direction (arrow AR1 direction) and the reciprocating direction (arrow AR2 direction). . Therefore, the scribe line SL (refer FIG. 3) of the inclined state with respect to the advancing direction and the reciprocating direction is formed in the upper surface of the brittle material substrate 4. As shown in FIG. Moreover, when the rotation speed of the motors 13 and 43 changes, the curved scribe line SL (refer FIG. 3) is formed.

Here, in this embodiment, generating vertical crack K (refer FIG. 3) to the brittle material substrate 4 so that a substantially L-shaped scribe line is formed is also called "L-shaped scribe."

In the case of cutting, the main surface of the brittle material substrate 4 is formed by the brake device (not shown), and (1) the main surface on which the scribe line SL is formed (hereinafter, simply referred to as "formation surface"). (2) A stress is applied to the main surface on the side opposite to the forming surface. Therefore, in the scribing process, the vertical crack K generated in the brittle material substrate 4 grows to the surface opposite to the formation surface, and the brittle material substrate 4 is cut (break process).

In addition, in the case of dividing, the deep vertical crack K is formed by a scribe process. Therefore, a brake device (not shown) is not necessary, and the brittle material substrate 4 is cut only by the scribe process.

<5. Advantages of the scribing wheel in this embodiment>

As described above, the scribing wheel 50 of the present embodiment is made of sintered diamond, and the sintered diamond includes 65.0 to 75.0 wt% of diamond, 3.0 to 10.0 wt% of ultrafine carbide, and the remainder of the binder. In addition, the average particle diameter of diamond is in the range of 0.6 to 1.5 µm, and the binder is an iron-based metal containing cobalt as a main component.

As a result, the scribing wheel 50 can improve not only the wear resistance and impact resistance characteristics, but also the torsion resistance characteristics. That is, even if the scribing wheel 50 is in contact with the brittle material substrate 4, even when the advancing direction of the scribing wheel 50 is changed, the protrusion 54 of the blade tip 52a is missing. It can prevent effectively. Therefore, longer life of the scribing wheel 50 can be realized.

<6. Modifications>

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, A various deformation | transformation is possible.

In this embodiment, although the shape of the some groove 53 formed in the blade edge 52a was demonstrated as what is substantially V-shaped from the side, it is not limited to this. 9 to 11 are diagrams showing another example of the groove 53 formed in the blade tip 52a of the scribing wheel 50. As shown in FIG. 9, the groove 53 may be a trapezoid-shaped recessed part, for example from the side surface. 10 and 11, an arcuate or rectangular concave may be seen from the side.

(Example)

Hereinafter, although an Example demonstrates this invention still in detail, this invention is not limited to these examples at all.

&Lt; Example 1 >

Here, Example 1 will be described. It is a top view for demonstrating a torsion test. FIG. 13: is a figure which shows the material and dimension of the scribing wheel 50 corresponding to each of Example 1 and Comparative Examples 1 and 2, and the conditions of a torsion test.

In this torsion resistance test, as shown in FIG. 12, an L-shaped scribe is repeatedly performed. Then, the missing state of the protrusion 54 of the blade edge 52a of each scribing wheel 50 is observed, whereby the scribing wheel 50 corresponding to each of Example 1 and Comparative Examples 1 and 2 is observed. The torsional strength characteristic is judged.

As shown in FIG. 13, about the sintered diamond which comprises the scribing wheel 50 of Example 1, the average particle diameter and content of a diamond, content of an iron group metal, and content of ultra-fine particle carbide are all in a preferable range. .

On the other hand, the sintered diamond constituting the scribing wheel 50 of Comparative Example 1,

(1) The average particle diameter of diamond is larger than the upper limit of a preferable range,

(2) content of diamond is less than the lower limit of the preferable range, and

(3) Content of carbide is more than the upper limit of a preferable range,

In this respect, it differs from the sintered diamond constituting the scribing wheel 50 of the first embodiment.

In addition, the sintered diamond constituting the scribing wheel 50 of Comparative Example 2,

(1) The average particle diameter of diamond is smaller than the lower limit of a preferable range,

In this respect, it differs from the sintered diamond constituting the scribing wheel 50 of the first embodiment.

Here, the L-shaped scribe executed in the torsion test is performed according to the following procedure. First, in a state where the motor 13 of the holding unit 10 is stopped, the motor 43 of the drive unit 40 is driven so that the scribing wheel 50 of the head unit 30 moves in the Y-axis plus direction. Is moved to. As a result, a scribe line SL1 having a length D1 is formed on the brittle material substrate 4.

Next, the motor 43 of the drive unit 40 is stopped from the driving state, and the motor 13 of the holding unit 10 is brought into the driving state from the stop state. As a result, while the protrusion 54 of the blade tip 52a of the scribing wheel 50 is in contact with the brittle material substrate 4, the advancing direction of the scribing wheel 50 is caused by the caster effect. This changes about 90 degrees.

Subsequently, the scribing wheel 50 of the head portion 30 is further moved in the X-axis plus direction, whereby a scribe line SL2 of length D2 is formed on the brittle material substrate 4.

Then, after the L-shaped scribes forming the scribe lines SL1 and SL2 have been executed a plurality of times, the defect status of the protrusion 54 of the blade tip 52a (for example, the number of defects of the protrusion 54) is reduced. By this, the torsional strength characteristics of the scribing wheel 50 corresponding to each of Example 1 and Comparative Examples 1 and 2 are obtained.

14 is a photograph showing the projection 54 of the scribing wheel 50 of Example 1 before the torsion test. FIG. 15 is a photograph showing the protruding portion 54 of the scribing wheel 50 of Example 1 after the torsion test (after performing an L-shape scribe 1000 times). As shown in FIG. 14 and FIG. 15, although some defects exist in the protrusion part 54 of Example 1 after a torsion test, the L-scribed satisfactorily also by the scribing wheel 50 after 1000 runs. Could run.

16 and 18 are photographs showing the projections 54 of the scribing wheel 50 of Comparative Examples 1 and 2 before the torsion test. 17 and 19 are photographs showing the projections 54 of the scribing wheels 50 of Comparative Examples 1 and 2 after the torsion test (after performing L-shaped scribe 10 times).

In the scribing wheels 50 of Comparative Examples 1 and 2, as shown in Figs. 17 and 19, the protrusions 54 are markedly missing at the time of 10 executions, and the scribing process can be continued 10 times or more. Could not.

In addition, it is thought that the result of the comparative examples 1 and 2 originates in the following points. That is, content of the diamond of the comparative example 1 is 64.0 weight%, and is smaller than the lower limit of the preferable range (68.0-72.0 (weight%)). Accordingly, it is considered that the wear resistance of the scribing wheel 50 of Comparative Example 1 is reduced. Therefore, it is thought that the lifetime of the scribing wheel 50 of the comparative example 1 became shorter than the thing of the comparative example 1.

Moreover, the average particle diameter of the diamond of the comparative example 2 is 0.5 micrometer, and smaller than a preferable range (0.6-1.5 (micrometer)). Accordingly, in Comparative Example 2, cracks are more likely to occur at the diamond grain boundaries than in Example 1, and the protrusions 54 of the blade edges 52a are easily broken. That is, compared with Example 1, the comparative example 2 is inferior to torsion strength characteristic. Therefore, it is thought that the lifetime of the scribing wheel 50 of the comparative example 2 became shorter than the thing of Example 1. FIG.

Thus, even when the advancing direction of this scribing wheel 50 changes in the state in which the scribing wheel 50 produced by the sintered diamond of Example 1 contacted the brittle material board | substrate 4, a blade edge | tip is changed. It is possible to effectively prevent the protrusion 54 of 52a from being missing. Therefore, longer life of the scribing wheel 50 can be realized.

<Example 2>

Here, Example 2 will be described. FIG. 20 is a diagram showing the material and dimensions of the scribing wheel 50 corresponding to each of Example 2 and Comparative Examples 1 and 2, and the conditions for the torsion test.

As shown in FIG. 20, about the sintered diamond which comprises the scribing wheel 50 of Example 2, the average particle diameter and content of a diamond, content of an iron group metal, and content of ultra-fine particle carbide are all in a preferable range. . In Example 2, the same torsion test as in Example 1 is carried out.

Therefore, the scribing wheel 50 produced by the sintered diamond of the second embodiment can also achieve longer life, as in the case of the first embodiment.

The scribing wheel of the present embodiment is advantageous in that deep vertical cracks can be generated on the brittle material substrate in a dry manner while improving not only the wear resistance and impact resistance characteristics but also the torsion resistance characteristics.

1: scribe device
4: brittle material substrate
10: holding unit
20: scribe unit
30: head part
40:
50: scribing wheel
51: main body
52: day
52a: end of blade
53: home
54: protrusion
54a: ridge
60: imaging unit
90 control unit
SL: scribe line
K: vertical crack

Claims (4)

As a scribing wheel made of sintered diamond,
(a) a disc-shaped body part,
(b) a toroidal blade formed on the outer periphery of the main body portion,
(c) a blade tip having a plurality of protrusions formed along the outermost side of the blade,
The thickness of the said blade becomes small toward the edge of the said blade from the center of the said main-body part, and the cross section of the plane which passes the outermost center axis of the said blade forms the V shape,
Each projection is formed between adjacent grooves among a plurality of grooves formed along the blade edge,
The said sintered diamond contains 65.0-75.0 weight% diamond, 3.0-10.0 weight% ultra-fine carbide, and remainder the binder,
The average particle diameter of the diamond is in the range of 0.6 to 1.5 mu m,
The bonding material is a scribing wheel, characterized in that the iron-based metal containing cobalt. The method of claim 1,
The ultrafine carbides,
While in the range of 6.0 to 8.0% by weight,
A scribing wheel comprising 1.0 to 4.0 wt% titanium carbide and the remainder of tungsten carbide. The scribing unit which forms a scribe line on the said brittle material board | substrate by pressure-contacting the scribing wheel of Claim 1 or 2 with respect to a brittle material board | substrate,
And a holding unit for moving the held and holding the brittle material substrate relative to the scribing unit while holding the brittle material substrate. A method for forming a scribe line on a brittle material substrate by the scribing wheel according to claim 1 or 2,
(a) relatively moving said scribing wheel in a first horizontal direction parallel to said brittle material substrate, while bringing said scribing wheel into contact with said brittle material substrate;
(b) After the step (a), with the scribing wheel in contact with the brittle material substrate, the moving direction of the scribing wheel is parallel to the brittle material substrate from the first horizontal direction. And a step of changing to a second horizontal direction different from the first horizontal direction.

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